Patents by Inventor Wael O. Zohni

Wael O. Zohni has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Embossed heat spreader
    Patent number: 8730670
    Abstract: One embodiment of the present invention sets forth a heat spreader module for dissipating thermal heat generated by electronic components. The assembly comprises a printed circuit board (PCB), electronic components disposed on the PCB, a thermal interface material (TIM) thermally coupled to the electronic components, and a heat spreader plate thermally coupled to the TIM. The heat spreader plate includes an embossed pattern. Consequently, surface area available for heat conduction between the heat spreader plate and surrounding medium may be increased relative to the prior art designs.
    Type: Grant
    Filed: October 21, 2011
    Date of Patent: May 20, 2014
    Assignee: Google Inc.
    Inventors: Wael O. Zohni, William Schmidt, Michael J. S. Smith, Jeremy Matthew Plunkett
  • Embossed heat spreader
    Patent number: 8705240
    Abstract: One embodiment of the present invention sets forth a heat spreader module for dissipating thermal heat generated by electronic components. The assembly comprises a printed circuit board (PCB), electronic components disposed on the PCB, a thermal interface material (TIM) thermally coupled to the electronic components, and a heat spreader plate thermally coupled to the TIM. The heat spreader plate includes an embossed pattern. Consequently, surface area available for heat conduction between the heat spreader plate and surrounding medium may be increased relative to the prior art designs.
    Type: Grant
    Filed: September 14, 2012
    Date of Patent: April 22, 2014
    Assignee: Google Inc.
    Inventors: Wael O. Zohni, William L. Schmidt, Michael John Sebastian Smith, Jeremy Matthew Plunkett
  • Providing additional space between an integrated circuit and a circuit board for positioning a component therebetween
    Patent number: 8080874
    Abstract: A system, method, and apparatus are included for providing additional space between an integrated circuit package and a circuit board. An integrated circuit package is provided including a plurality of integrated circuit package contacts. Also provided is a circuit board in electrical communication with the integrated circuit package. Further, the integrated circuit package, the integrated circuit contacts, and/or the circuit board is configured for providing additional space between the integrated circuit package and the circuit board to position at least a portion of at least one component between the integrated circuit package and the circuit board.
    Type: Grant
    Filed: September 14, 2007
    Date of Patent: December 20, 2011
    Assignee: Google Inc.
    Inventors: Jeremy Werner, Daniel L. Rosenband, Jeremy Matthew Plunkett, William L. Schmidt, David T. Wang, Wael O. Zohni, Philip Arnold Ferolito, Michael John Sebastian Smith, Suresh Natarajan Rajan, Joseph C. Fjelstad
  • Embossed heat spreader
    Patent number: 8081474
    Abstract: One embodiment of the present invention sets forth a heat spreader module for dissipating thermal heat generated by electronic components. The assembly comprises a printed circuit board (PCB), electronic components disposed on the PCB, a thermal interface material (TIM) thermally coupled to the electronic components, and a heat spreader plate thermally coupled to the TIM. The heat spreader plate includes an embossed pattern. Consequently, surface area available for heat conduction between the heat spreader plate and surrounding medium may be increased relative to the prior art designs.
    Type: Grant
    Filed: September 2, 2008
    Date of Patent: December 20, 2011
    Assignee: Google Inc.
    Inventors: Wael O. Zohni, William L. Schmidt, Michael John Sebastian Smith, Jeremy Matthew Plunkett