Patents by Inventor Wah-Yih Lien

Wah-Yih Lien has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for simultaneous formation of contacts between metal layers and fuse windows in semiconductor manufacturing
    Patent number: 6008075
    Abstract: A method for simultaneous fabrication of an interlever metal contact and a fuse window reducing the number of masking steps required while providing a high yield for the fuse. A semiconductor substrate is provided having a device area with a first metal layer over an InterLevel Dielectric layer and a fuse area with a polysilicon fuse buried within the InterLevel Dielectric layer. A thick anti-reflective coating is formed on the first metal layer. The first metal layer and the anti-reflective coating are patterned to form a first metal line. An InterMetal Dielectric layer is formed over the InterLevel Dielectric layer and the first metal line. The InterMetal Dielectric layer, the InterLevel Dielectric layer, and the anti-reflective coating are patterned, simultaneously opening a via hole extending partially into the anti-reflective coating and a fuse window opening extending into the InterLevel Dielectric layer without exposing the fuse. An adhesion layer is formed over the InterMetal Dielectric layer.
    Type: Grant
    Filed: February 11, 1999
    Date of Patent: December 28, 1999
    Assignee: Vanguard International Semiconductor Corporation
    Inventors: Wah-Yih Lien, Ing-Ruey Liaw