Patents by Inventor Wahseng Yap

Wahseng Yap has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11830132
    Abstract: An image processing method includes the steps of: extracting a first two-dimensional feature point from a two-dimensional face image; on the basis of a geometric model of a standard face, deriving a three-dimensional feature point set including a first three-dimensional feature point corresponding to the first two-dimensional feature point; generating a three-dimensional face model including the three-dimensional feature point set; estimating an input pose of the two-dimensional face image to determine whether to update the three-dimensional feature point set; updating the three-dimensional feature point set by relocating the first three-dimensional feature point according to the first two-dimensional feature point, on the basis of the determination on whether to update the three-dimensional feature point set; and projecting the three-dimensional face model onto the two-dimensional face image.
    Type: Grant
    Filed: December 6, 2018
    Date of Patent: November 28, 2023
    Assignee: DEEPIXEL INC.
    Inventors: Jehoon Lee, Wahseng Yap
  • Publication number: 20220012472
    Abstract: An image processing method includes the steps of: extracting a first two-dimensional feature point from a two-dimensional face image; on the basis of a geometric model of a standard face, deriving a three-dimensional feature point set including a first three-dimensional feature point corresponding to the first two-dimensional feature point; generating a three-dimensional face model including the three-dimensional feature point set; estimating an input pose of the two-dimensional face image to determine whether to update the three-dimensional feature point set; updating the three-dimensional feature point set by relocating the first three-dimensional feature point according to the first two-dimensional feature point, on the basis of the determination on whether to update the three-dimensional feature point set; and projecting the three-dimensional face model onto the two-dimensional face image.
    Type: Application
    Filed: December 6, 2018
    Publication date: January 13, 2022
    Inventors: Jehoon LEE, Wahseng YAP
  • Patent number: 11170535
    Abstract: A virtual reality interface method for providing fusion with a real space according to the present disclosure includes the steps of: analyzing information on an object of the real space to be projected in a virtual space based on image information of the real space acquired from a camera; determining transparency information for the object of the real space based on the object information of the real space; and fusing an object image of the real space and a virtual space based on the transparency information.
    Type: Grant
    Filed: April 27, 2018
    Date of Patent: November 9, 2021
    Assignee: DEEPIXEL INC
    Inventors: Jehoon Lee, Honam Ahn, Wahseng Yap
  • Publication number: 20210166438
    Abstract: A virtual reality interface method for providing fusion with a real space according to the present disclosure includes the steps of: analyzing information on an object of the real space to be projected in a virtual space based on image information of the real space acquired from a camera; determining transparency information for the object of the real space based on the object information of the real space; and fusing an object image of the real space and a virtual space based on the transparency information.
    Type: Application
    Filed: April 27, 2018
    Publication date: June 3, 2021
    Inventors: Jehoon LEE, Honam AHN, Wahseng YAP
  • Patent number: 10664983
    Abstract: A method for implementing a virtual reality (VR) interface based on a single camera. The method includes obtaining pointer coordinates based on an image obtained by a single camera attached to a VR device, converting the pointer coordinates into virtual pointer coordinates based on a distance factor between the single camera and the VR device and a user factor including an input range of a real space derived according to a body characteristic of a user, and displaying the converted virtual pointer coordinates on the VR device.
    Type: Grant
    Filed: April 17, 2017
    Date of Patent: May 26, 2020
    Assignee: DEEPIXEL INC.
    Inventors: Jehoon Lee, Wahseng Yap, Honam Ahn
  • Patent number: 10269111
    Abstract: A method of inspecting a semiconductor wafer is provided, the method includes scanning a plurality of inspection swaths on a wafer to obtain a plurality of image sets and producing a plurality of reference images from the plurality of image sets, respectively. The method of inspecting a semiconductor wafer further includes selecting a plurality of target images from the plurality of image sets, respectively. The method of inspecting a semiconductor wafer additionally includes comparing each reference image of the plurality of reference images with each target image of the plurality of target images to detect a defect image from each of the plurality of target images. A reference image being compared and a target image being compared are images scanned from the same inspection swath.
    Type: Grant
    Filed: May 17, 2017
    Date of Patent: April 23, 2019
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Joonseo Song, Sung Yoon Ryu, Wahseng Yap, Yunjung Jee, Yusin Yang, Chungsam Jun, Yoo Jin Jeoung, Jaehyung Ahn, Janghee Lee
  • Publication number: 20180275764
    Abstract: A method for implementing a virtual reality (VR) interface based on a single camera. The method includes obtaining pointer coordinates based on an image obtained by a single camera attached to a VR device, converting the pointer coordinates into virtual pointer coordinates based on a distance factor between the single camera and the VR device and a user factor including an input range of a real space derived according to a body characteristic of a user, and displaying the converted virtual pointer coordinates on the VR device.
    Type: Application
    Filed: April 17, 2017
    Publication date: September 27, 2018
    Inventors: Jehoon LEE, Wahseng YAP, Honam AHN
  • Publication number: 20180053292
    Abstract: A method of inspecting a semiconductor wafer is provided, the method includes scanning a plurality of inspection swaths on a wafer to obtain a plurality of image sets and producing a plurality of reference images from the plurality of image sets, respectively. The method of inspecting a semiconductor wafer further includes selecting a plurality of target images from the plurality of image sets, respectively. The method of inspecting a semiconductor wafer additionally includes comparing each reference image of the plurality of reference images with each target image of the plurality of target images to detect a defect image from each of the plurality of target images. A reference image being compared and a target image being compared are images scanned from the same inspection swath.
    Type: Application
    Filed: May 17, 2017
    Publication date: February 22, 2018
    Inventors: Joonseo Song, Sung Yoon Ryu, Wahseng Yap, Yunjung Jee, Yusin Yang, Chungsam Jun, Yoo Jin Jeoung, Jaehyung Ahn, Janghee Lee