Patents by Inventor Wai Chan
Wai Chan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11970742Abstract: Methods are provided for diagnosing pregnancy-associated disorders, determining allelic ratios, determining maternal or fetal contributions to circulating transcripts, and/or identifying maternal or fetal markers using a sample from a pregnant female subject. Also provided is use of a gene for diagnosing a pregnancy-associated disorder in a pregnant female subject.Type: GrantFiled: January 23, 2019Date of Patent: April 30, 2024Assignee: The Chinese University of Hong KongInventors: Yuk-Ming Dennis Lo, Rossa Wai Kwun Chiu, Kwan Chee Chan, Peiyong Jiang, Bo Yin Tsui
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Publication number: 20240130922Abstract: An apparatus for assisting the mobility of a user is disclosed. The apparatus includes an electronic device provided in a device body and a haptic unit. The electronic device includes a sensing unit, a machine vision unit, and a path planning unit. The machine vision unit is connected to the sensing unit and is configured to detect one or more obstacles in a vicinity of the user. The path planning unit is capable of developing a movement route for the user to avoid the one or more obstacles. The haptic unit includes a haptic arrangement having a plurality of haptic actuators adapted to provide a tactile stimulation to the torso or limbs of the user. The plurality of haptic actuators actuate based on the movement commands from the path planning unit to signify a travel direction in which there is no obstacle.Type: ApplicationFiled: November 30, 2022Publication date: April 25, 2024Inventors: Ka Wai KONG, Hiu Ling CHAN
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Patent number: 11923046Abstract: Disclosed herein are methods, systems, and apparatus for detecting microamplifications or microdeletions in the genome of a fetus. In some embodiments, the method comprises receiving sequence tags for each of a plurality of DNA fragments in a biological sample; determining genomic positions for the sequence tags; determining whether the density of DNA in each of a plurality of genomic regions is aberrantly high or low; identifying as a microamplification a set of consecutive genomic regions having aberrantly high density; and identifying as a microdeletion a set of consecutive genomic regions having aberrantly low density. The biological sample may be a blood sample obtained noninvasively from a female subject pregnant with the fetus.Type: GrantFiled: February 7, 2020Date of Patent: March 5, 2024Assignee: The Chinese University of Hong KongInventors: Yuk Ming Dennis Lo, Kwan Chee Chan, Peiyong Jiang, Cheuk Yin Jandy Yu, Rossa Wai Kwun Chiu
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Publication number: 20240071944Abstract: The invention relates to the field of chip fabrication, in particular to the fabrication of superconducting integrated circuits for use in quantum computers. Raised and recessed alignment structures are provided on the surfaces of two substrate such that the raised and recessed alignment structure extends within the recessed alignment structure to a maximum depth determined by the geometry of the alignment structures. The alignment structures act as a hard stop for positioning and aligning the substrates for flip chip bonding.Type: ApplicationFiled: November 7, 2023Publication date: February 29, 2024Inventors: Máté JENEI, Kok Wai Chan, Kuan Yen Tan
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Patent number: 11907805Abstract: A three-dimensional superconducting qubit and a method for manufacturing the same are disclosed. In an example, a three-dimensional superconducting qubit comprises a structural base comprising one or more insulating materials, and superconductive patterns on surfaces of the structural base. The superconductive patterns form at least a capacitive part and an inductive part of the three-dimensional superconducting qubit. A first surface of the surfaces of the structural base defines a first plane and a second surface of the surfaces of the structural base defines a second plane, the second plane being oriented differently than the first plane. At least one superconductive pattern of the superconductive patterns extends from the first surface to the second surface.Type: GrantFiled: October 6, 2021Date of Patent: February 20, 2024Assignee: IQM Finland OyInventors: Caspar Ockeloen-Korppi, Tianyi Li, Wei Liu, Vasilii Sevriuk, Tiina Naaranoja, Mate Jenei, Jan Goetz, Kuan Yen Tan, Mikko Möttönen, Kok Wai Chan
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Patent number: 11875519Abstract: An integrated navigation solution is provided for a device within a moving platform. Motion sensor data from a sensor assembly of the device is obtained, optical samples from at least one optical sensor for the platform are obtained and map information for an environment encompassing the platform is obtained. Correspondingly, an integrated navigation solution is generated based at least in part on the obtained motion sensor data using a nonlinear state estimation technique, wherein the nonlinear state estimation technique uses a nonlinear measurement model for optical sensor data. Generating the integrated navigation solution includes using the sensor data with the nonlinear state estimation technique and integrating the optical sensor data directly by updating the nonlinear state estimation technique using the nonlinear measurement model and the map information. The integrated navigation solution is then provided.Type: GrantFiled: August 13, 2021Date of Patent: January 16, 2024Inventors: Medhat Omr, Abdelrahman Ali, Amr Al-Hamad, Jacques Georgy, Billy Cheuk Wai Chan, Dylan Krupity, Qingli Wang, Christopher Goodall
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Patent number: 11849651Abstract: This disclosure describes a superconducting device comprising a trench and a cavity that extends through a superconducting base layer. The trench crosses the cavity. The superconducting device further comprises a first junction layer that extends from a first region of the superconducting base layer to the cavity, an insulating layer on the surface of the first junction layer, and a second junction layer that extends from a second region of the superconducting base layer to the cavity. The second junction layer overlaps with the insulating layer on the bottom of the cavity. The disclosure also describes a method for producing this disclosed superconducting device.Type: GrantFiled: January 14, 2022Date of Patent: December 19, 2023Assignee: IQM Finland OyInventors: Tianyi Li, Wei Liu, Manjunath Ramachandrappa Venkatesh, Hasnain Ahmad, Kok Wai Chan
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Publication number: 20230400297Abstract: A camera module is manufactured by attaching a lens module to an image sensor. The lens module includes at least one lens element which has a plurality of centers of curvature. A tilt angle of an imaging axis of the image sensor is determined, and a tilt angle of an optical axis of the lens module is also determined by using an optical device to identify locations of multiple centers of curvature of the at least one lens element included in the lens module. At least one of the lens module and the image sensor are then adjusted accordingly so that the imaging axis and the optical axis are aligned, and thereafter, the lens module is fixedly attached with respect to the image sensor to form the camera module.Type: ApplicationFiled: May 20, 2022Publication date: December 14, 2023Inventors: Ying San CHUI, Kwok Yuen CHEUNG, Hei Lam CHANG, Man Wai CHAN, Po Lam AU
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Publication number: 20230398139Abstract: Methods of using rifampicin and zidovudine and pharmaceutical compositions comprising the same to inhibit growth of and/or kill Klebsiella pneumoniae, such as antibiotic-resistant Klebsiella pneumoniae.Type: ApplicationFiled: August 16, 2022Publication date: December 14, 2023Inventors: Sheng CHEN, Bill Kwan-wai CHAN, Hongyuhang NI
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Publication number: 20230265911Abstract: A dual clutch transmission for a motor vehicle power train for selectively coupling rotating transmission members includes a base assembly, a bearing mounted rotating assembly which is rotatable with respect to the base assembly, first and second torque transmission assemblies movable between disengaged and engaged positions, and first and second actuation mechanisms associated with the first and second torque transmissions assemblies. The actuating mechanisms are arranged for moving the respective torque transmission assemblies between the disengaged and engaged positions for selectively coupling the transmission members. The first torque transmission assembly couples two rotating members in the engaged position. The first actuating mechanism includes a hydraulic actuating mechanism having a piston chamber and a piston for moving the first torque transmission assembly between the disengaged and engaged positions.Type: ApplicationFiled: July 20, 2021Publication date: August 24, 2023Applicant: PUNCH POWERTRAIN PSA E-TRANSMISSIONS N.V.Inventors: Roy BASTIAANSEN, Rens OBELINK, Bert Johannes Cornelis VAN BAKEL, Chi Wai CHAN
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Patent number: 11713503Abstract: A method for forming a substrate with a multi-layered, flexible, and anti-scratch metal oxides protective coating being deposited onto the substrate is provided in the present invention, wherein the top most layer of the coating comprises Al2O3 or a mixture thereof such that the top most layer acts as an anti-scratching layer. The multi-layered, flexible and anti-scratch metal oxides protective coating also retains the flexibility of the underlying substrate.Type: GrantFiled: April 24, 2019Date of Patent: August 1, 2023Assignees: Hong Kong Baptist University, Cathay Photonics LimitedInventors: Kok Wai Cheah, Wing Yui Lam, Yu Wai Chan, Shing Chi Tse, Suet Ying Ching, Hoi Lam Tam
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Patent number: 11645591Abstract: An example system for dynamic agent management involving multiple queues is presented. The system may include a remote network management platform that manages a network by way of a computational instance. A first group and a second group of agents may be assigned to address work items in a first queue in the computational instance. The second group may also be assigned to address and prioritize work items in a second queue in the computational instance. A computing device within the computational instance may assign a work item originating from a client device in the managed network into the first queue according to routing rules. The assignment may cause a timer to record a duration that the work item is in the first queue. The computing device may assign one of the second group of agents to address the work item based on the duration exceeding a pre-determined value.Type: GrantFiled: January 21, 2021Date of Patent: May 9, 2023Assignee: ServiceNow, Inc.Inventors: Victor Chung-Wai Chan, Scott Michael Rhodes, Prithvi Yoganand
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Patent number: 11621388Abstract: The present invention relates to the manufacture of Josephson junctions. Such Josephson junctions may be suitable for use in qubits. High-quality, potentially monocrystalline, electrode and dielectric layers are formed using blanket deposition. Subsequently, the structure of one of more Josephson junctions is formed using multi-photon lithography to create openings in a resist followed by etching the electrode and dielectric layers.Type: GrantFiled: December 3, 2021Date of Patent: April 4, 2023Assignee: IQM Finland OyInventors: Tianyi Li, Wei Liu, Manjunath Ramachandrappa Venkatesh, Hasnain Ahmad, Kok Wai Chan, Kuan Yen Tan
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Patent number: 11605586Abstract: An airbridge implements connections on a superconducting chip. It comprises a strip of superconductive material between a first superconductive area and a second superconductive area. A first end of said strip comprises a first planar end portion attached to and parallel with said first superconductive area, and a second end of said strip comprises a respective second planar end portion. A middle portion is located between said first and second planar end portions, forming a bend away from a plane defined by the surfaces of the first and second superconductive areas. First and second separation lines separate the end portions from the middle portion. At least one of said first and second separation lines is directed otherwise than transversally across said strip.Type: GrantFiled: July 17, 2020Date of Patent: March 14, 2023Assignee: IQM Finland OyInventors: Kok Wai Chan, Tianyi Li, Wei Liu, Caspar Ockeloen-Korppi
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Patent number: 11529838Abstract: Vehicle body tilt, representing a difference between a vehicle body frame of reference and a wheel-base frame of reference, is determined by obtaining information from sensor assemblies for the vehicle body and for the wheel-base. Navigational solutions are generated for the sensor assemblies using motion sensor data from the assemblies and absolute navigational information. Correspondingly, vehicle body tilt is determined based at least in part on the vehicle body navigation solution and the wheel-base navigation solution.Type: GrantFiled: April 15, 2020Date of Patent: December 20, 2022Assignee: InvenSense, Inc.Inventors: Jacques Georgy, Christopher Goodall, Abdelrahman Ali, Amr Al-Hamad, Anas Mahmoud, Billy Cheuk Wai Chan, Medhat Omr
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Patent number: 11506512Abstract: Feedback for map information is based on an integrated navigation solution for a device within a moving platform using obtained motion sensor data from a sensor assembly of the device, obtained radar measurements for the platform and obtained map information for an environment encompassing the platform. An integrated navigation solution is generated based at least in part on the obtained motion sensor data using a nonlinear state estimation technique that uses a nonlinear measurement model for radar measurements. The map information is assessed based at least in part on the integrated navigation solution and radar measurements so that feedback for the map information can be provided.Type: GrantFiled: April 28, 2020Date of Patent: November 22, 2022Assignee: TDK JapanInventors: Amr Shebl Ahmed, Medhat Omr, Abdelrahman Ali, Jacques Georgy, Christopher Goodall, Billy Cheuk Wai Chan, Qingli Wang
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Patent number: 11499790Abstract: Methods and systems are provided for a heat exchanger. In one example, the heat exchanger may dissipate energy generated by a battery module and may include a first plate and a second plate arranged in opposed facing relation to one another. A plurality of flow passages may be formed between the first and second plates, the plurality of flow passages including at least one multipass fluid flow passage with at least three longitudinally-extending legs.Type: GrantFiled: January 23, 2020Date of Patent: November 15, 2022Assignee: Dana Canada CorporationInventors: Benjamin A. Kenney, Lee M. Kinder, Kwok Wai Chan
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Publication number: 20220359415Abstract: Superconducting through substrate vias (STSVs) are disclosed. The STSVs provide superconducting interconnections between opposite faces of a substrate. In an example, a method of forming STSVs includes etching openings that extend from a first side of a substrate partially through the substrate towards a second side of the substrate. The method also includes depositing a seed layer over the first side of the substrate and interior surfaces of the openings in the substrate. The method further includes forming a resist or hardmask on the first side of the substrate above the seed layer, such that the resist or hardmask comprises openings aligned with the etched openings in the substrate. The etched openings in the substrate are filled with a superconducting filler material. The substrate is thinned by removing material from the second side of the substrate until the deposited seed layer is exposed on the second side of the substrate.Type: ApplicationFiled: May 4, 2022Publication date: November 10, 2022Inventors: Máté Jenei, Kok Wai Chan, Hasnain Ahmad, Manjunath Ramachandrappa Venkatesh, Wei Liu, Lily Yang, Tianyi Li, Jean-Luc Orgiazzi, Caspar Ockeloen-Korppi, Alessandro Landra, Mario Palma
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Publication number: 20220359808Abstract: The invention relates to a method for forming flip chip bumps using electroplating. The method allows the formation of flip chip bumps in a way that is compatible with already-formed sensitive electronic components, such as Josephson junctions, which may be used in quantum processing units. The invention also relates to a product and a flip chip package in which flip chip bumps are formed with the disclosed method.Type: ApplicationFiled: May 2, 2022Publication date: November 10, 2022Inventors: Máté Jenei, Kok Wai Chan, Hasnain Ahmad, Manjunath Ramachandrappa Venkatesh, Wei Liu, Lily Yang, Tianyi Li, Jean-Luc Orgiazzi, Caspar Ockeloen-Korppi, Alessandro Landra, Mario Palma
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Patent number: RE49888Abstract: A magnetic reader head assembly includes a magnetic reader head compartment, a frame and an elastic component. The magnetic reader head compartment comprises electronic and mechanical components of the magnetic reader head. The frame has a front side and a back side and has a footprint matching the footprint of the magnetic reader head compartment. The front side is configured to attach to a back wall of the magnetic reader head compartment while allowing the magnetic reader head compartment to move out or retract from the frame. The elastic component is configured to be placed at the back side of the frame and to push the frame out in order to press the magnetic reader head compartment against a magnetic card stripe.Type: GrantFiled: April 4, 2019Date of Patent: March 26, 2024Assignee: STRIPE, INC.Inventors: Chi Wah Lo, Hwai Sian Tsai, Kin Wai Chan