Patents by Inventor Wai-Cheng Seetoo

Wai-Cheng Seetoo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Plateable structural adhesive for cyanate ester composites
    Patent number: 5840829
    Abstract: An adhesive is provided for bonding cyanate ester composite parts together which is also plateable with metal once chemically etched. The adhesive comprises a polymeric matrix and a filler of cyanate ester polymer. The polymeric matrix comprises at least one polyepoxide resin and a curing agent, while the cyanate ester polymer filler is present in the adhesive as a powder. In practice, the present adhesive is applied to the surface of cyanate ester composite articles to be bonded and is allowed to cure at room temperature. Thereafter, the surface of the assembly is chemically etched and then plated with metal. The present adhesive enable the complete coverage of the cyanate ester composite assembly with the plated metal, including the adhesive bondlines.
    Type: Grant
    Filed: November 25, 1997
    Date of Patent: November 24, 1998
    Assignee: Hughes Electronics Corporation
    Inventors: Ralph D. Hermansen, Brian M. Punsly, Wai-Cheng Seetoo
  • Plateable structural adhesive for cyanate ester composites
    Patent number: 5780581
    Abstract: An adhesive is provided for bonding cyanate ester composite parts together which is also plateable with metal once chemically etched. The adhesive comprises a polymeric matrix and a filler of cyanate ester polymer. The polymeric matrix comprises at least one polyepoxide resin and a curing agent, while the cyanate ester polymer filler is present in the adhesive as a powder. In practice, the present adhesive is applied to the surface of cyanate ester composite articles to be bonded and is allowed to cure at room temperature. Thereafter, the surface of the assembly is chemically etched and then plated with metal. The present adhesive enable the complete coverage of the cyanate ester composite assembly with the plated metal, including the adhesive bondlines.
    Type: Grant
    Filed: October 27, 1995
    Date of Patent: July 14, 1998
    Assignee: Hughes Aircraft Company
    Inventors: Ralph D. Hermansen, Brian M. Punsly, Wai-Cheng Seetoo