Patents by Inventor Wai Chu
Wai Chu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240129146Abstract: A first communication device generates an Operation, Administration, and Maintenance (OAM) frame that includes i) OAM message content and ii) an OAM frame header outside of the OAM message content, wherein generating the OAM frame comprises generating the OAM frame header to include information that signals one of i) a low power sleep (LPS) request, and ii) a wake-up request (WUR). The first communication device transmits the OAM frame to a second communication device via a communication medium to signal to the second communication device the one of i) the LPS request, and ii) the WUR.Type: ApplicationFiled: December 21, 2023Publication date: April 18, 2024Inventors: Ming-Tak LEUNG, Bizhan ABEDINZADEH, Hon Wai FUNG, Liang ZHU, Der-Ren CHU
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Patent number: 10735841Abstract: The present invention sets out to solve the problems above by presenting a dual-mode speaker system for acoustic reproduction. The dual-mode speaker system for acoustic reproduction presents a system with high-energy conversion efficiency and provides flexibility between an active speaker driver and other radiators, improved sound quality, a larger range of low frequency sounds, and the capability to improve audio frequency playback range in small-scale audio environments. A dual-mode acoustic radiator speaker system is provided having an enclosure with a plurality of openings, an active speaker driver having a first motor assembly and a dual-mode radiator having a second motor assembly. In some embodiments, the dual-mode acoustic radiator speaker system further comprises one or more passive radiators adjoined to the enclosure. Next, within the dual-mode acoustic radiator speaker system a power supply is connected to the electronic signal processing and amplification system.Type: GrantFiled: October 31, 2019Date of Patent: August 4, 2020Assignee: FAIF Designs LimitedInventor: Walter Ka Wai Chu
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Patent number: 10652639Abstract: The present invention sets out to solve the problems above by presenting a dual-mode speaker system for acoustic reproduction. The dual-mode speaker system for acoustic reproduction presents a system with high-energy conversion efficiency and provides flexibility between an active speaker driver and other radiators, improved sound quality, a larger range of low frequency sounds, and the capability to improve audio frequency playback range in small-scale audio environments. A dual-mode acoustic radiator speaker system is provided having an enclosure with a plurality of openings, an active speaker driver having a first motor assembly and a dual-mode radiator having a second motor assembly. In some embodiments, the dual-mode acoustic radiator speaker system further comprises one or more passive radiators adjoined to the enclosure. Next, within the dual-mode acoustic radiator speaker system a power supply is connected to the electronic signal processing and amplification system.Type: GrantFiled: March 13, 2019Date of Patent: May 12, 2020Assignee: FAIF Designs LtdInventor: Walter Ka Wai Chu
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Publication number: 20200068281Abstract: The present invention sets out to solve the problems above by presenting a dual-mode speaker system for acoustic reproduction. The dual-mode speaker system for acoustic reproduction presents a system with high-energy conversion efficiency and provides flexibility between an active speaker driver and other radiators, improved sound quality, a larger range of low frequency sounds, and the capability to improve audio frequency playback range in small-scale audio environments. A dual-mode acoustic radiator speaker system is provided having an enclosure with a plurality of openings, an active speaker driver having a first motor assembly and a dual-mode radiator having a second motor assembly. In some embodiments, the dual-mode acoustic radiator speaker system further comprises one or more passive radiators adjoined to the enclosure. Next, within the dual-mode acoustic radiator speaker system a power supply is connected to the electronic signal processing and amplification system.Type: ApplicationFiled: October 31, 2019Publication date: February 27, 2020Inventor: Walter Ka Wai Chu
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Publication number: 20190363728Abstract: A digital to analog converter circuit applied to a source driving apparatus is disclosed. The digital to analog converter circuit includes P-type transistors coupled in series, N-type transistors coupled in series and a substrate voltage control unit. The substrate voltage control unit is coupled to substrates of the P-type transistors and substrates of the N-type transistors respectively and used for controlling the substrates of the P-type transistors to have a first substrate voltage and controlling the substrates of the N-type transistors to have a second substrate voltage. The first substrate voltage is an operating voltage substituted by a specific voltage difference and the second substrate voltage is a ground voltage added by the specific voltage difference, and the operating voltage is higher than the ground voltage.Type: ApplicationFiled: March 20, 2019Publication date: November 28, 2019Inventors: WAI-CHU WANG, CHIH-CHUAN HUANG
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Publication number: 20190349656Abstract: The present invention sets out to solve the problems above by presenting a dual-mode speaker system for acoustic reproduction. The dual-mode speaker system for acoustic reproduction presents a system with high-energy conversion efficiency and provides flexibility between an active speaker driver and other radiators, improved sound quality, a larger range of low frequency sounds, and the capability to improve audio frequency playback range in small-scale audio environments. A dual-mode acoustic radiator speaker system is provided having an enclosure with a plurality of openings, an active speaker driver having a first motor assembly and a dual-mode radiator having a second motor assembly. In some embodiments, the dual-mode acoustic radiator speaker system further comprises one or more passive radiators adjoined to the enclosure. Next, within the dual-mode acoustic radiator speaker system a power supply is connected to the electronic signal processing and amplification system.Type: ApplicationFiled: March 13, 2019Publication date: November 14, 2019Inventor: Walter Ka Wai Chu
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Patent number: 10468012Abstract: A compressed skins-tensioned core structure includes a first surface region; a second surface region; a core between the first surface region and the second surface region; a first transition region continuous with the first surface region at a side, and continuous with the core at another side; and a second transition region continuous with the core at a side, and continuous with the second surface region at another side, wherein each of the first surface region, the second surface region, the core, the first transition region and the second transition region is formed of a substantially homogeneous amorphous material; each of the first surface region and the second surface region exhibits an internal compressive stress, the core exhibits an internal tensile stress, and each of the first transition region and the second transition region exhibits a stress gradient from the internal compressive stress to the internal tensile stress.Type: GrantFiled: August 10, 2017Date of Patent: November 5, 2019Assignee: BDNC (HOLDING) LIMITEDInventor: Walter Ka Wai Chu
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Publication number: 20180130458Abstract: A compressed skins-tensioned core structure includes a first surface region; a second surface region; a core between the first surface region and the second surface region; a first transition region continuous with the first surface region at a side, and continuous with the core at another side; and a second transition region continuous with the core at a side, and continuous with the second surface region at another side, wherein each of the first surface region, the second surface region, the core, the first transition region and the second transition region is formed of a substantially homogeneous amorphous material; each of the first surface region and the second surface region exhibits an internal compressive stress, the core exhibits an internal tensile stress, and each of the first transition region and the second transition region exhibits a stress gradient from the internal compressive stress to the internal tensile stress.Type: ApplicationFiled: August 10, 2017Publication date: May 10, 2018Inventor: WALTER KA WAI CHU
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Publication number: 20180109893Abstract: A vibration assembly for use in a speaker includes a supporting member, a light-transmissive rigid and hard diaphragm vibrating and propagating vibration for sound radiation in response to an actuating force, a flexible membrane having a first portion coupled to the rigid and hard diaphragm and configured to vibrate with the rigid and hard diaphragm, and having a second portion coupled to the supporting member for positioning the rigid and hard diaphragm, and a voice coil coupled to the rigid and hard diaphragm with a light-curing adhesive, and flowing therein an alternating current and passing therethrough magnetic lines of force generated by a magnet to provide the actuating force. The use of light-curing adhesive accelerates the automated manufacturing process.Type: ApplicationFiled: October 6, 2017Publication date: April 19, 2018Inventor: Walter Ka Wai Chu
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Patent number: 9288561Abstract: A speaker device includes a main cabinet composed of a cabinet body and a speaker mounted on the cabinet body; an extendable cabinet composed of a bellows tube and a passive diaphragm, the bellows tube having a front end communicably connected to the cabinet body and a rear end closed by the passive diaphragm, and the passive diaphragm being axially aligned with the speaker; and a damping assembly being arranged in the cabinet body and in the bellows tube, and having a front end connected to the cabinet body and a rear end to the passive diaphragm. With these arrangements, the speaker device can have improved bass performance in the entire low-frequency band instead of being limited to only a few low-frequency points.Type: GrantFiled: May 29, 2015Date of Patent: March 15, 2016Assignee: FORTUNE GRAND TECHNOLOGY INC.Inventor: Walter Ka Wai Chu
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Patent number: 8699720Abstract: A headphone assembly for generating an audio output with distortion-free loudness limiting and dynamic equalization feature includes a voltage divider comprising a positive temperature coefficient resistor and a headphone driver, and two audio signal input terminals in each audio channel connected to the voltage divider arranged for connecting to an audio device, wherein a large portion of the voltage of the audio signal to the two audio signal input terminals to appear across the headphone driver in response to the audio signal received through the two audio signal input terminals below a preset low amplitude level; and increasing a resistance of the positive temperature coefficient resistor in a preset non-linear manner and decreasing a voltage drop across the headphone driver accordingly in response to the audio signal received through the two audio signal input terminals which is higher than the preset low amplitude level.Type: GrantFiled: February 15, 2011Date of Patent: April 15, 2014Inventor: Walter Ka Wai Chu
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Publication number: 20130279735Abstract: A flat thin dynamic speaker which includes a motor unit, a suspension unit, a radiating unit and a frame arranged in such a manner that the motor unit and the suspension unit are at the same plane while the radiating unit is on top of the motor unit such that the thickness of the speaker assembly is reduced while the performance of the speaker assembly is maintained or even improved. Also, the speaker can be made into a quadrangular, polygon or a spherical structure. The speaker further has a surround at a level lower than the radiating unit without utilizing the radiating surface of the radiating unit such as a maximized radiating surface is provided, and includes a dual side voice-coil actuation to the radiator unit, thereby providing a slim and flat speaker assembly with high power output.Type: ApplicationFiled: April 14, 2013Publication date: October 24, 2013Inventor: Walter Ka Wai Chu
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Patent number: 8447063Abstract: A flat thin dynamic speaker which includes a motor unit, a suspension unit, a radiating unit and a frame arranged in such a manner that the motor unit and the suspension unit are at the same plane while the radiating unit is on top of the motor unit such that the thickness of the speaker assembly is reduced while the performance of the speaker assembly is maintained or even improved. Also, the speaker can be made into a quadrangular, polygon or a spherical structure. The speaker further has a surround at a level lower than the radiating unit without utilizing the radiating surface of the radiating unit such as a maximized radiating surface is provided, and includes a dual side voice-coil actuation to the radiator unit, thereby providing a slim and flat speaker assembly with high power output.Type: GrantFiled: January 29, 2011Date of Patent: May 21, 2013Inventor: Walter Ka Wai Chu
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Publication number: 20110200203Abstract: A headphone assembly for generating an audio output with distortion-free loudness limiting and dynamic equalization feature includes a voltage divider comprising a positive temperature coefficient resistor and a headphone driver, and two audio signal input terminals in each audio channel connected to the voltage divider arranged for connecting to an audio device, wherein a large portion of the voltage of the audio signal to the two audio signal input terminals to appear across the headphone driver in response to the audio signal received through the two audio signal input terminals below a preset low amplitude level; and increasing a resistance of the positive temperature coefficient resistor in a preset non-linear manner and decreasing a voltage drop across the headphone driver accordingly in response to the audio signal received through the two audio signal input terminals which is higher than the preset low amplitude level.Type: ApplicationFiled: February 15, 2011Publication date: August 18, 2011Inventor: Walter Ka Wai Chu
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Publication number: 20110188697Abstract: A flat thin dynamic speaker which includes a motor unit, a suspension unit, a radiating unit and a frame arranged in such a manner that the motor unit and the suspension unit are at the same plane while the radiating unit is on top of the motor unit such that the thickness of the speaker assembly is reduced while the performance of the speaker assembly is maintained or even improved. Also, the speaker can be made into a quadrangular, polygon or a spherical structure. The speaker further has a surround at a level lower than the radiating unit without utilizing the radiating surface of the radiating unit such as a maximized radiating surface is provided, and includes a dual side voice-coil actuation to the radiator unit, thereby providing a slim and flat speaker assembly with high power output.Type: ApplicationFiled: January 29, 2011Publication date: August 4, 2011Inventor: Walter Ka Wai Chu
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Publication number: 20070118371Abstract: Improved variable dimension vector quantization-related (“VDVQ-related”) processes have been developed that provide quality improvements over known coding processes in codebook optimization and the quantization of harmonic magnitudes that can be applied to a broad range of distortion measures, including those that would involve inverting a singular matrix using known centroid computation techniques. The improved VDVQ-related processes improve the way in which actual codevectors are extracted from the codevectors of the codebook by redefining the index relationship and using interpolation to determine the actual codevector elements when the index relationship produces a non-integer value. Additionally, these processes improve the way in which codebooks are optimized using the principles of gradient-descent. These improved VDVQ-related processes can be implemented in various software and hardware implementations.Type: ApplicationFiled: January 16, 2007Publication date: May 24, 2007Inventor: Wai Chu
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Publication number: 20070118365Abstract: Improved variable dimension vector quantization-related (“VDVQ-related”) processes have been developed that provide quality improvements over known coding processes in codebook optimization and the quantization of harmonic magnitudes that can be applied to a broad range of distortion measures, including those that would involve inverting a singular matrix using known centroid computation techniques. The improved VDVQ-related processes improve the way in which actual codevectors are extracted from the codevectors of the codebook by redefining the index relationship and using interpolation to determine the actual codevector elements when the index relationship produces a non-integer value. Additionally, these processes improve the way in which codebooks are optimized using the principles of gradient-descent. These improved VDVQ-related processes can be implemented in various software and hardware implementations.Type: ApplicationFiled: January 16, 2007Publication date: May 24, 2007Inventor: Wai Chu
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Publication number: 20070118370Abstract: Improved variable dimension vector quantization-related (“VDVQ-related”) processes have been developed that provide quality improvements over known coding processes in codebook optimization and the quantization of harmonic magnitudes that can be applied to a broad range of distortion measures, including those that would involve inverting a singular matrix using known centroid computation techniques. The improved VDVQ-related processes improve the way in which actual codevectors are extracted from the codevectors of the codebook by redefining the index relationship and using interpolation to determine the actual codevector elements when the index relationship produces a non-integer value. Additionally, these processes improve the way in which codebooks are optimized using the principles of gradient-descent. These improved VDVQ-related processes can be implemented in various software and hardware implementations.Type: ApplicationFiled: January 16, 2007Publication date: May 24, 2007Inventor: Wai Chu
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Publication number: 20070118366Abstract: Improved variable dimension vector quantization-related (“VDVQ-related”) processes have been developed that provide quality improvements over known coding processes in codebook optimization and the quantization of harmonic magnitudes that can be applied to a broad range of distortion measures, including those that would involve inverting a singular matrix using known centroid computation techniques. The improved VDVQ-related processes improve the way in which actual codevectors are extracted from the codevectors of the codebook by redefining the index relationship and using interpolation to determine the actual codevector elements when the index relationship produces a non-integer value. Additionally, these processes improve the way in which codebooks are optimized using the principles of gradient-descent. These improved VDVQ-related processes can be implemented in various software and hardware implementations.Type: ApplicationFiled: January 16, 2007Publication date: May 24, 2007Inventor: Wai Chu
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Publication number: 20070061135Abstract: Alternate window optimization procedures and/or LSP interpolation factor optimization procedures are used to improve the ITU-T G.729 speech coding standard (the “Standard”) by replacing the window used by the Standard with an optimized window and/or replacing the LSP interpolation factor used by the standard with an optimized LSP interpolation factor. Optimized windows created using the alternate window optimization procedure and/or optimized LSP interpolation factors created using the LSP interpolation factor optimization procedure yield improvements in the objective quality of synthesized speech produced by the Standard. In many cases, improvements are obtained using shorter windows, which results in reduced computational cost and/or smaller future buffering requirements, which results in lowered coding delay. The improved Standard, procedures, and optimized windows and LSP interpolation factors can all be implemented as computer readable software code and in optimization devices.Type: ApplicationFiled: November 10, 2006Publication date: March 15, 2007Inventors: Wai Chu, Toshio Miki