Patents by Inventor Wai Hoong Moy

Wai Hoong Moy has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Surface mountable semiconductor package with solder bonding features
    Patent number: 7737546
    Abstract: A packaged circuit element such as an LED and a method for making the same are disclosed. The packaged circuit element includes a lead frame, a molded body, and a die containing the circuit element. The lead frame has first and second leads, each lead having first and second portions. The molded body surrounds the first portion of each lead, and the die is connected electrically to the first and second leads on the first portions of the first and second leads. The second portion of each of the first and second leads is substantially parallel to opposing side surfaces of the body and include a feature that inhibits molten solder from wetting a portion of the second section of each lead between the feature and the first portion of that lead while allowing the molten solder to wet the remaining surfaces of the second portions.
    Type: Grant
    Filed: September 5, 2007
    Date of Patent: June 15, 2010
    Assignee: Avago Technologies ECBU IP (Singapore) Pte. Ltd.
    Inventors: Wai Hoong Moy, Chu Kun Tan, Keh Chin Seah, Paul Beng Hui Oh
  • Surface Mountable Semiconductor Package with Solder Bonding Features
    Publication number: 20090057850
    Abstract: A packaged circuit element such as an LED and a method for making the same are disclosed. The packaged circuit element includes a lead frame, a molded body, and a die containing the circuit element. The lead frame has first and second leads, each lead having first and second portions. The molded body surrounds the first portion of each lead, and the die is connected electrically to the first and second leads on the first portions of the first and second leads. The second portion of each of the first and second leads is substantially parallel to opposing side surfaces of the body and include a feature that inhibits molten solder from wetting a portion of the second section of each lead between the feature and the first portion of that lead while allowing the molten solder to wet the remaining surfaces of the second portions.
    Type: Application
    Filed: September 5, 2007
    Publication date: March 5, 2009
    Inventors: Wai Hoong Moy, Chu Kun Tan, Keh Chin Seah, Paul Beng Hui Oh