Patents by Inventor Wai Kek Ooi

Wai Kek Ooi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8757384
    Abstract: Devices and methods for packing objects, including information handling systems and other types of electronic devices that may be implemented using a single piece and assembly-free packing device configuration that has one or more foldable and insertable buffer sections that are foldable to increase the overall strength of the packing device against external loads and shocks.
    Type: Grant
    Filed: November 3, 2010
    Date of Patent: June 24, 2014
    Assignee: Dell Products, LP.
    Inventors: Wai Kek Ooi, Hwa Bee Chuah
  • Publication number: 20120103854
    Abstract: Devices and methods for packing objects, including information handling systems and other types of electronic devices that may be implemented using a single piece and assembly-free packing device configuration that has one or more foldable and insertable buffer sections that are foldable to increase the overall strength of the packing device against external loads and shocks.
    Type: Application
    Filed: November 3, 2010
    Publication date: May 3, 2012
    Inventors: Wai Kek Ooi, Hwa Bee Chuah