Patents by Inventor Wai Khee SEE THO

Wai Khee SEE THO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240084472
    Abstract: A wire comprising a wire core with a surface, the wire core having a coating layer superimposed on its surface, wherein the wire core itself is a silver-based wire core, wherein the coating layer is a double-layer comprised of a 1 to 100 nm thick inner layer of nickel or palladium and an adjacent 1 to 250 nm thick outer layer of gold, characterized in that the wire exhibits a total carbon content of ?40 wt.-ppm.
    Type: Application
    Filed: February 5, 2021
    Publication date: March 14, 2024
    Inventors: Murali SARANGAPANI, Yee Weon LIM, Wai Khee SEE THO, Mariyappan DHAYALAN, Chee Chow TAN, Juergen SCHARF, Sungsig KANG