Abstract: A method for dividing a package substrate into a plurality of device packages. The package substrate has a mount surface on the front side where a plurality of division lines are formed and a sealing layer formed on the back side, in which devices are sealed. The method includes a groove forming step of forming a groove along each division line on the mount surface of the package substrate so that the groove has a depth corresponding to a finished thickness of each device package, a burr removing step of removing burrs produced from electrodes in the groove forming step, and a grinding step of grinding the sealing layer of the package substrate so that a thickness of the package substrate is reduced to the finished thickness, after performing the burr removing step, thereby dividing the package substrate into the plural device packages.

Abstract: A method of manufacturing packages includes forming grooves with a depth that reaches a finished thickness of a device chip along planned dividing lines from a front surface of a device wafer, sealing the front surface of the device wafer by a sealant and filling the grooves with the sealant, and grinding a back surface of the device wafer corresponding to a device region to form a recessed part with a depth that reaches the grooves and forms an annular projection part that surrounds the recessed part and corresponds to a peripheral surplus region. The recessed part is filled with the sealant to execute sealing and dividing grooves are formed with a smaller width than the grooves along the grooves from the front surface of the device wafer. The device wafer is divided to form plural packages in each of which the device chip is sealed by the sealant.

Abstract: A method of manufacturing packages includes forming grooves with a depth that reaches a finished thickness of a device chip along planned dividing lines from a front surface of a device wafer, sealing the front surface of the device wafer by a sealant and filling the grooves with the sealant, and grinding a back surface of the device wafer corresponding to a device region to form a recessed part with a depth that reaches the grooves and forms an annular projection part that surrounds the recessed part and corresponds to a peripheral surplus region. The recessed part is filled with the sealant to execute sealing and dividing grooves are formed with a smaller width than the grooves along the grooves from the front surface of the device wafer. The device wafer is divided to form plural packages in each of which the device chip is sealed by the sealant.

Abstract: A method for dividing a package substrate into a plurality of device packages. The package substrate has a mount surface on the front side where a plurality of division lines are formed and a sealing layer formed on the back side, in which devices are sealed. The method includes a groove forming step of forming a groove along each division line on the mount surface of the package substrate so that the groove has a depth corresponding to a finished thickness of each device package, a burr removing step of removing burrs produced from electrodes in the groove forming step, and a grinding step of grinding the sealing layer of the package substrate so that a thickness of the package substrate is reduced to the finished thickness, after performing the burr removing step, thereby dividing the package substrate into the plural device packages.