Patents by Inventor WAI KWOK, KELVIN YEUNG

WAI KWOK, KELVIN YEUNG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Polymeric based and surface treated metallic hybrid materials and fabrication methods thereof
    Patent number: 10603412
    Abstract: Novel hybrid materials and fabrication methods thereof are provided. The novel hybrid materials can include a biodegradable polymer and a biodegradable metallic material. The hybrid material can also include a coupling agent between the biodegradable metallic material and the biodegradable polymer. A method of fabricating a hybrid material can include performing a surface treatment process on the biodegradable metallic material, and then either performing a solvent formation method or a thermal formation method.
    Type: Grant
    Filed: August 31, 2018
    Date of Patent: March 31, 2020
    Assignees: Versitech Limited, City University of Hong Kong
    Inventors: Hoi Man Karen Wong, Wai Kwok Kelvin Yeung, Man Chee Kenneth Cheung, Dip Kei Keith Luk, Kin On John Lam, Kim Ho Paul Chu
  • POLYMERIC BASED AND SURFACE TREATED METALLIC HYBRID MATERIALS AND FABRICATION METHODS THEREOF
    Publication number: 20180369453
    Abstract: Novel hybrid materials and fabrication methods thereof are provided. The novel hybrid materials can include a biodegradable polymer and a biodegradable metallic material. The hybrid material can also include a coupling agent between the biodegradable metallic material and the biodegradable polymer. A method of fabricating a hybrid material can include performing a surface treatment process on the biodegradable metallic material, and then either performing a solvent formation method or a thermal formation method.
    Type: Application
    Filed: August 31, 2018
    Publication date: December 27, 2018
    Inventors: HOI MAN, KAREN WONG, WAI KWOK, KELVIN YEUNG, MAN CHEE, KENNETH CHEUNG, DIP KEI, KEITH LUK, KIN ON, JOHN LAM, KIM HO, PAUL CHU