Patents by Inventor Wai Loon Yip

Wai Loon Yip has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Die stack override for die testing
    Patent number: 11476168
    Abstract: Disclosed herein are structures and techniques for exposing circuitry in die testing. For example, in some embodiments, an integrated circuit (IC) die may include: first conductive contacts at a first face of the die; second conductive contacts at a second face of the die; die stack emulation circuitry; other circuitry; and a switch coupled to the second conductive contacts, the die stack emulation circuitry, and the other circuitry, wherein the switch is to couple the second conductive contacts to the other circuitry when the switch is in a first state, and the switch is to couple the die stack emulation circuitry to the other circuitry when the switch is in a second state different from the first state.
    Type: Grant
    Filed: April 9, 2018
    Date of Patent: October 18, 2022
    Assignee: Intel Corporation
    Inventors: Terrence Huat Hin Tan, Rehan Sheikh, Michael T. Klinglesmith, Sukhbinder Takhar, Shi Hou Chong, Kok Hin Oon, Wai Loon Yip, Yudhishthira Kundu, Deepak R. Tanna
  • DIE STACK OVERRIDE FOR DIE TESTING
    Publication number: 20190311960
    Abstract: Disclosed herein are structures and techniques for exposing circuitry in die testing. For example, in some embodiments, an integrated circuit (IC) die may include: first conductive contacts at a first face of the die; second conductive contacts at a second face of the die; die stack emulation circuitry; other circuitry; and a switch coupled to the second conductive contacts, the die stack emulation circuitry, and the other circuitry, wherein the switch is to couple the second conductive contacts to the other circuitry when the switch is in a first state, and the switch is to couple the die stack emulation circuitry to the other circuitry when the switch is in a second state different from the first state.
    Type: Application
    Filed: April 9, 2018
    Publication date: October 10, 2019
    Applicant: Intel Corporation
    Inventors: Terrence Huat Hin Tan, Rehan Sheikh, Michael T. Klinglesmith, Sukhbinder Takhar, Shi Hou Chong, Kok Hin Oon, Wai Loon Yip, Yudhishthira Kundu, Deepak R. Tanna