Patents by Inventor Wai Mon Wa

Wai Mon Wa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Selective rework apparatus for surface mount components
    Patent number: 7575146
    Abstract: An apparatus for selective rework for surface mount components. A shield assembly encloses a circuit board on which Surface Mount Technology (SMT) modules are soldered. The shield assembly includes a top shield member having an opening over an SMT module to be removed from the circuit board, and a bottom shield member having an opening exposing the solder mount of the SMT module to be removed. An intermediate shield member is located in the opening in the top shield member and extends through the opening to the circuit board and surrounds the SMT module to be removed. A spring loaded mechanism is positioned over the intermediate shield member and grips the SMT module to be removed. The spring loaded mechanism applies removal force for removing the SMT module from the circuit board when heat is applied causing the solder holding the SMT module to the circuit board to reflow.
    Type: Grant
    Filed: November 11, 2008
    Date of Patent: August 18, 2009
    Assignee: International Business Machines Corporation
    Inventors: Brian D. Chapman, Mary A. Emmett, Arden S. Lake, Wai Mon Wa, Nandu N. Ranadive, Michael Variano, John P. Weir
  • SELECTIVE REWORK APPARATUS FOR SURFACE MOUNT COMPONENTS
    Publication number: 20090065557
    Abstract: An apparatus for selective rework for surface mount components. A shield assembly encloses a circuit board on which Surface Mount Technology (SMT) modules are soldered. The shield assembly includes a top shield member having an opening over an SMT module to be removed from the circuit board, and a bottom shield member having an opening exposing the solder mount of the SMT module to be removed. An intermediate shield member is located in the opening in the top shield member and extends through the opening to the circuit board and surrounds the SMT module to be removed. A spring loaded mechanism is positioned over the intermediate shield member and grips the SMT module to be removed. The spring loaded mechanism applies removal force for removing the SMT module from the circuit board when heat is applied causing the solder holding the SMT module to the circuit board to reflow.
    Type: Application
    Filed: November 11, 2008
    Publication date: March 12, 2009
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Brian D. Chapman, Mary A. Emmett, Arden S. Lake, Wai Mon Wa, Nandu N. Ranadive, Michael Variano, John P. Weir
  • Selective rework process and apparatus for surface mount components
    Patent number: 7472818
    Abstract: An apparatus and method for selective rework for surface mount components. A shield assembly encloses a circuit board on which Surface Mount Technology (SMT) modules are soldered. The shield assembly includes a top shield member having an opening over an SMT module to be removed from the circuit board, and a bottom shield member having an opening exposing the solder mount of the SMT module to be removed. An intermediate shield member is located in the opening in the top shield member and extends through the opening to the circuit board and surrounds the SMT module to be removed. A spring loaded mechanism is positioned over the intermediate shield member and grips the SMT module to be removed. The spring loaded mechanism applies removal force for removing the SMT module from the circuit board when heat is applied causing the solder holding the SMT module to the circuit board to reflow.
    Type: Grant
    Filed: April 28, 2006
    Date of Patent: January 6, 2009
    Assignee: International Business Machines Corporation
    Inventors: Brian D. Chapman, Mary A. Emmett, Arden S. Lake, Wai Mon Wa, Nandu N. Ranadive, Michael Variano, John P. Weir