Patents by Inventor Wai Sau Li

Wai Sau Li has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wire bonding apparatus
    Patent number: 4603803
    Abstract: A wire-bonding apparatus which employs a belt-and-pulley driven, spring-returned Z-motion plate to appropriately locate a wire-axis-aligned, solenoid operated, wire feed-and-tear apparatus so that bonds can be quickly and effectively made upon devices located on an X-Y movement table.
    Type: Grant
    Filed: April 2, 1985
    Date of Patent: August 5, 1986
    Assignee: ASM Assembly Automation, Ltd.
    Inventors: Lo Kwan Chan, Wai Sau Li