Patents by Inventor Wai Tak YU

Wai Tak YU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190310023
    Abstract: The disclosure relates to a multi-pass removable plate heat exchanger without a need of arranging interfaces or connections on a mobile pressure plate, and a specific heat transfer plate therefor. The heat transfer plate has a plurality of lateral regions, where a plurality of mutually communicative lateral-pass partitions or mutually isolated pass partitions are formed with specially shaped gaskets. With such kind of heat transfer plates, a multi-pass removable plate heat exchanger without a need of arranging interfaces or nozzles on the mobile pressure plate may be constructed. The disclosure further relates to a specially shaped gasket to allow construction of a multi-pass removable plate heat exchanger without a need of arranging interfaces or nozzles on the mobile pressure plate.
    Type: Application
    Filed: July 20, 2017
    Publication date: October 10, 2019
    Applicant: IES ENGINEERING (HONG KONG) LIMITED
    Inventors: Xingcun HUANG, Wai Tak YU