Abstract: Provided herein are methods and apparatuses for controlling uniformity of processing at an edge region of a semiconductor wafer. In some embodiments, the methods include exposing an edge region to treatment gases such as etch gases and/or inhibition gases. Also provided herein are exclusion ring assemblies including multiple rings that may be implemented to provide control of the processing environment at the edge of the wafer.

Abstract: An automotive Ethernet physical-layer (PHY) transceiver includes an analog Front End (FE) and a digital processor. The FE is configured to receive an analog Ethernet signal over a physical Ethernet link while the Ethernet PHY transceiver is operating in a vehicle, and to convert the received analog Ethernet signal into a digital signal. The digital processor is configured to hold one or more noise profiles that characterize respective predefined noise types of noise signals that are expected to corrupt the received analog Ethernet signal, to classify an actual noise signal present in the digital signal into one of the noise types, using the noise profiles, and in response to deciding that the actual noise signal matches a given noise type among the predefined noise types, to apply a noise mitigation operation selected responsively to the given noise type.

Abstract: The present application describes a sensor apparatus based on chemically functionalized graphene as the sensing materials. The sensing materials is modified from graphene oxide with unique chemical process to form a group of graphene derivatives, e.g. butylamine, hexylamine, decylamine, dodecylamine, benzylamine etc., to detect volatile and non-volatile compounds, e.g. toluene, ethylacetate, ethanol, acetone, hexane etc. with high sensitivity. Pattern recognition algorithms and methods, e.g. PCA, are coupled with the sensors for detecting and quantifying specific chemical compounds. Methods of using the sensor apparatus in applications such as diagnosis of disease and food quality control are disclosed.

Abstract: The present disclosure relates to compositions including a phenylbutyrate compound and a bile acid, and methods of processing such compositions.

Abstract: Systems and methods for packet re-transmission via a bi-directional wired interface between two devices are provided. A transmitter of a first device transmits one or more first transmit data packets to a second device over the bi-directional wired interface. Concurrently with the transmission of the one or more first transmit data packets, the first device receives, over the bi-directional wired interface, one or more second received data packets from the second device. A packet integrity monitor of the first device monitors whether one or more received data packets of the second received data packets is corrupted at the physical layer of the first device. In response to detecting that one or more received data packets of the second received data packets is corrupted, the first device re-transmits one or more transmit data packets of the first transmit data packets that was previously transmitted over the bi-directional wired interface.

Abstract: The present invention provides methods and devices for detecting and distinguishing various types of gas molecules or volatile organic compounds (VOCs), the methods and devices have enhanced sensing ability; namely response magnitude, sensitivity, detection limit and selectivity (i.e., classification capability). In one embodiment, the present invention provides methods and devices for diagnosing a disease in a subject or a health status of a subject through the detection of VOCs indicative of the disease or health status in question from breath of the subject. In one embodiment, the present invention provides methods and devices for detecting the existence of lung cancer or the stage of lung cancer in a subject through the detection of VOCs indicative of the existence of lung cancer from breath of the subject.

Abstract: Forming a protective coating ex situ in an atomic layer deposition process to coat one or more chamber components subsequently installed in a reaction chamber provides a number of benefits over more conventional coating methods such as in situ deposition of an undercoat. In certain cases the protective coating may have a particular composition such as aluminum oxide, aluminum fluoride, aluminum nitride, yttrium oxide, and/or yttrium fluoride. The protective coating may help reduce contamination on wafers processed using the coated chamber component. Further, the protective coating may act to stabilize the processing conditions within the reaction chamber, thereby achieving very stable/uniform processing results over the course of processing many batches of wafers, and minimizing radical loss. Also described are a number of techniques that may be used to restore the protective coating after the coated chamber component is used to process semiconductor wafers.

Abstract: An Ethernet Physical layer (PHY) device includes a PHY interface and PHY circuitry. The PHY interface is configured to connect to a physical link. The PHY circuitry is configured to generate layer-1 frames that carry data for transmission to a peer Ethernet PHY device, to insert among the layer-1 frames one or more management frames that are separate from, the layer-1 frames and that are configured to control a General-Purpose Input-Output (GPIO) port associated with the peer Ethernet PHY device, to transmit the layer-1 frames and the inserted management frames, via the PHY interface, to the peer Ethernet PHY device over the physical link, for controlling one or more operations of the GPIO port associated with the peer Ethernet PHY device, and to receive, via the PHY interface, one or more verifications acknowledging that the one or more management frames were received successfully at the peer Ethernet PHY device.

Abstract: Embodiments described herein provide a method for waking a first node in a low power mode. A network comprises at least the first node and a second node in an awake mode where the first and second nodes have respective transceivers coupled via substantially fixed communication pathways. The transceiver of the second node obtains a training signal designed to be transmitted at a pre-defined symbol rate and transmits the training signal at a symbol rate lower than the pre-defined symbol rate to the physical layer of the first node for a predetermined duration of time. The second node, in response to receiving the training signal transitions from the low power mode to an awake state.

Abstract: Forming a protective coating ex situ in an atomic layer deposition process to coat one or more chamber components subsequently installed in a reaction chamber provides a number of benefits over more conventional coating methods such as in situ deposition of an undercoat. In certain cases the protective coating may have a particular composition such as aluminum oxide, aluminum fluoride, aluminum nitride, yttrium oxide, and/or yttrium fluoride. The protective coating may help reduce contamination on wafers processed using the coated chamber component. Further, the protective coating may act to stabilize the processing conditions within the reaction chamber, thereby achieving very stable/uniform processing results over the course of processing many batches of wafers, and minimizing radical loss. Also described are a number of techniques that may be used to restore the protective coating after the coated chamber component is used to process semiconductor wafers.

Abstract: The invention provides a computer-implemented method for analyzing a piece of text. The method comprises truncating one or more characters of the text into one or more block units each having at least one character. The method includes sorting the one or more block units for one or more unique block units and comparing the one or more unique block units with a grading database to thereby assign a grade to each of the one or more unique block units. An overall grade for the piece of text may be determined based on one or more of the grades assigned to each of the one or more unique block units. The overall grade of the text may be derived from successive truncating of the text into block units of increasing size and the successive processing of such block units.

Abstract: Forming a protective coating ex situ in an atomic layer deposition process to coat one or more chamber components subsequently installed in a reaction chamber provides a number of benefits over more conventional coating methods such as in situ deposition of an undercoat. In certain cases the protective coating may have a particular composition such as aluminum oxide, aluminum fluoride, aluminum nitride, yttrium oxide, and/or yttrium fluoride. The protective coating may help reduce contamination on wafers processed using the coated chamber component. Further, the protective coating may act to stabilize the processing conditions within the reaction chamber, thereby achieving very stable/uniform processing results over the course of processing many batches of wafers, and minimizing radical loss. Also described are a number of techniques that may be used to restore the protective coating after the coated chamber component is used to process semiconductor wafers.

Abstract: Disclosed herein is a multilayered article comprising a core layer comprising a thermoplastic polymer; where the thermoplastic polymer comprises a polyolefin, thermoplastic starch, and a compatibilizer; where the compatibilizer does not contain ethylene acrylic acid; where the polyolefin is not polypropylene and where the polyolefin present in an amount of greater than 40 wt %, based on a total weight of the core layer; a first layer comprising a thermoplastic resin; and a second layer comprising a thermoplastic resin; where the first layer and the second layer are devoid of fillers; where the first layer is disposed on a side of the core layer that is opposed to the side that contacts the second layer; where the multilayered article has an optical clarity of greater than 80% when measured as per ASTM D 1746 and a total haze less than 8% when measured as per ASTM D 1003.

Abstract: A liquid immersion lithography apparatus includes a projection system having a final optical element, a stage movable in a scanning direction beneath the projection system and arranged to support a substrate, and a nozzle member disposed to surround at least a lower part of the final optical element. The nozzle member has a first aperture disposed on one side of the final optical element and a second aperture disposed on an other side of the final optical element. During exposure, immersion liquid is supplied and recovered by the nozzle member using the first and second apertures to provide a flow of the immersion liquid across an end surface of the final optical element. The flow of the immersion liquid across the end surface of the final optical element is across the scanning direction.

Abstract: A liquid immersion lithography apparatus includes a projection system having a final optical element and a nozzle member having a first opening disposed on a first side of the final optical element and from which an immersion liquid is supplied, a second opening disposed on a second side of the final optical element and from which the immersion liquid is recovered, and a liquid recovery portion disposed to surround a path of an exposure beam and from which the immersion liquid is recovered. A tank is fluidicly connected to the liquid recovery portion of the nozzle member. During exposure of a substrate to the exposure beam, an upper surface of the substrate faces the liquid recovery portion, and the immersion liquid is supplied from the first opening while performing liquid recovery from the second opening and the liquid recovery portion.

Abstract: An electronic device has a first surface providing electrical contact points and multiple side surfaces surrounding the first surface. The electronic device includes a lead frame and a device die attached to the lead frame. The lead frame is located at a side of the first surface of the electronic device, and is configured to provide solder pads on the first surface of the electronic device. A lead frame for the electronic device and a method for assembling the electronic device also are provided.

Abstract: A liquid immersion lithography apparatus includes a projection system having a final optical element and a nozzle member having a first opening disposed on a first side of the final optical element and from which an immersion liquid is supplied, a second opening disposed on a second side of the final optical element and from which the immersion liquid is recovered, and a liquid recovery portion disposed to surround a path of an exposure beam and from which the immersion liquid is recovered. A tank is fluidicly connected to the liquid recovery portion of the nozzle member. During exposure of a substrate to the exposure beam, an upper surface of the substrate faces the liquid recovery portion, and the immersion liquid is supplied from the first opening while performing liquid recovery from the second opening and the liquid recovery portion.

Abstract: Disclosed herein is a multilayered article comprising a core layer comprising a thermoplastic polymer; where the thermoplastic polymer comprises a polyolefin, thermoplastic starch, and a compatibilizer; where the compatibilizer does not contain ethylene acrylic acid; where the polyolefin is not polypropylene and where the polyolefin present in an amount of greater than 40 wt %, based on a total weight of the core layer; a first layer comprising a thermoplastic resin; and a second layer comprising a thermoplastic resin; where the first layer and the second layer are devoid of fillers; where the first layer is disposed on a side of the core layer that is opposed to the side that contacts the second layer; where the multilayered article has an optical clarity of greater than 80% when measured as per ASTM D 1746 and a total haze less than 8% when measured as per ASTM D 1003.

Abstract: Methods of treating coronary and peripheral artery disease in diabetic patients with bioresorbable polymer stents are described. The stents may include everolimus.

Abstract: A liquid immersion lithography apparatus includes a projection system having a final optical element and a nozzle member having a first opening disposed on a first side of the final optical element and from which an immersion liquid is supplied, a second opening disposed on a second side of the final optical element and from which the immersion liquid is recovered, and a liquid recovery portion disposed to surround a path of an exposure beam and from which the immersion liquid is recovered. A tank is fluidicly connected to the liquid recovery portion of the nozzle member. During exposure of a substrate to the exposure beam, an upper surface of the substrate faces the liquid recovery portion, and the immersion liquid is supplied from the first opening while performing liquid recovery from the second opening and the liquid recovery portion.