Abstract: A Far-UVC excimer light source contains a first electrode adapted to be energized, a second electrode adapted to be energized, a body defining a cavity that is filled with an excited molecule complex between the first and second electrodes; and a Far-UVC optical dielectric coating filter which is a Far-UVC filter attached to the interior side of the first electrode and adapted to filter a Far-UVC light excited in the cavity of the body. The Far-UVC dielectric coating is located inside the light source, between the cavity with the excited molecules and the first electrode. The Far-UVC filter attached to the interior side of the first electrode is a transmissive Far-UVC optical filtering dielectric coating or coated glass which is integrated, placed on, or near the interior side of the first electrode inside the light source.

Abstract: A substrate-integrated dielectric resonator contains a substrate layer with a first dielectric constant, a plurality of dielectric vias, and a plurality of second vias. Each dielectric via includes a first via-hole extending through the substrate layer, and a dielectric material with a second dielectric constant contained within the first via-hole. Each second via has a second via-hole extending through the substrate layer and filled with gas. A dielectric resonator antenna containing a substrate-integrated dielectric resonator and a method of fabricating the same is also disclosed. By skillfully arranging second vias inside the DRA, the resonant frequencies of different modes can be controlled, and a wide impedance band-width with stable radiation performance can be achieved.

Abstract: An apparatus and method for selective rework for surface mount components. A shield assembly encloses a circuit board on which Surface Mount Technology (SMT) modules are soldered. The shield assembly includes a top shield member having an opening over an SMT module to be removed from the circuit board, and a bottom shield member having an opening exposing the solder mount of the SMT module to be removed. An intermediate shield member is located in the opening in the top shield member and extends through the opening to the circuit board and surrounds the SMT module to be removed. A spring loaded mechanism is positioned over the intermediate shield member and grips the SMT module to be removed. The spring loaded mechanism applies removal force for removing the SMT module from the circuit board when heat is applied causing the solder holding the SMT module to the circuit board to reflow.