Abstract: A modular power tee distribution assembly includes a tee formed of first and second housing pieces which can be mated together. NEMA devices and accessories can be directly attached to the tee. First and second adaptors are provided can be mounted to the tee. The adaptors allow differently sized NEMA devices and accessories to be attached to the tee.

Abstract: A modular power tee distribution assembly includes a tee formed of first and second housing pieces which can be mated together. NEMA devices and accessories can be directly attached to the tee. First and second adaptors are provided can be mounted to the tee. The adaptors allow differently sized NEMA devices and accessories to be attached to the tee.

Abstract: The fuel additives of the present invention comprise essentially of about 10-50 weight % of terpene, 0-15 weight % of Alkylene Glycol Ether, and 40-80 weight % of 2-Propanone, 0-20 weight % of Dibasic Methyl Ester and 0-15 weight % of nonyl phenol ethoxylate and 0-15 weight % of mineral oil. This highly effective fuel additives can eliminate the formation of deposits and form air-borne micro-cluster molecules in internal combustion engines, particularly, in the fuel injection system and combustion chamber of such engines.

Abstract: The fuel additives of the present invention comprise essentially of about 10-50 weight % of terpene, 0-15 weight % of Alkylene Glycol Ether, and 40-80 weight % of 2-Propanone, 0-20 weight % of Dibasic Methyl Ester and 0-15 weight % of nonyl phenol ethoxylate and 0-15 weight % of mineral oil. This highly effective fuel additives can eliminate the formation of deposits and form air-borne micro-cluster molecules in internal combustion engines, particularly, in the fuel injection system and combustion chamber of such engines.

Abstract: A Pb-free solder alloy based on Sn as matrix is provided, which is a metal that has no toxicity and is environmental friendly. The Pb-free solder comprises a tetra-nary composition consisting essentially of about 99.0 weight % Sn, 0.3 to 0.4 weight % Ag, and 0.6 to 0.7 weight % Cu, with off-eutectic melting temperature of 217 to 227 degree Celsius. The fourth component is a non-metallic phosphorus (P), and 0.01 to 1.0 weight % of phosphorus is added into said composition to improve better micro-structural stability and hence reduce the formation of dross when hand soldering, wave soldering and reflow soldering during the electronic assembly installation process.