Abstract: A radio-frequency (RF) heat shield for electronics includes a first and second outer skin formed of an insulating material, an insulating core layer arranged between the first and second outer skin, wherein the insulating core layer has a lower dielectric constant as compared with a higher dielectric constant of the first and second outer skin, and a frequency selective surface (FSS) layer including a reflective metallization pattern that is RF transparent and formed on an exterior surface of each of the first and second outer skin.

Abstract: A radio-frequency (RF) heat shield for electronics includes a first and second outer skin formed of an insulating material, an insulating core layer arranged between the first and second outer skin, wherein the insulating core layer has a lower dielectric constant as compared with a higher dielectric constant of the first and second outer skin, and a frequency selective surface (FSS) layer including a reflective metallization pattern that is RF transparent and formed on an exterior surface of each of the first and second outer skin.

Abstract: A radio frequency (RF) module having a plurality of channels includes a heat sink having at least one tapered edge; a substrate disposed over a surface of the heat sink such that the tapered edge of the heat sink extends past a boundary of the substrate. RF, logic and power circuitry is disposed on the substrate and one or more RF signal ports are formed on an edge of the substrate to allow the RF module to be used in an array antenna having a brick architecture. The tapered edge heat sink provides both a ground plane for RF signal components and a thermal path for heat generating circuits disposed in the substrate.

Abstract: A radio frequency (RF) module having a plurality of channels includes a heat sink having at least one tapered edge; a substrate disposed over a surface of the heat sink such that the tapered edge of the heat sink extends past a boundary of the substrate. RF, logic and power circuitry is disposed on the substrate and one or more RF signal ports are formed on an edge of the substrate to allow the RF module to be used in an array antenna having a brick architecture. The tapered edge heat sink provides both a ground plane for RF signal components and a thermal path for heat generating circuits disposed in the substrate.

Abstract: A radome is provided and includes a substrate formed of moisture permeable material and a coating disposed on a surface of the SCFS substrate. The coating includes a layer of inorganic material disposed adjacent to at least one layer of organic material.

Abstract: A radome is provided and includes a substrate formed of moisture permeable material and a coating disposed on a surface of the SCFS substrate. The coating includes a layer of inorganic material disposed adjacent to at least one layer of organic material.

Abstract: The present invention relates to radio frequency and microwave connectors, and more particularly to grounding methods for printed wiring board edge-launch connectors. The grounding method comprises conducting tabs secured to a PWB and to an attached connector frame holding coaxial connectors. The conducting tabs thus provide a ground connection between the connector frame and one or more ground conductors on the PWB.

Abstract: The present invention relates to radio frequency and microwave connectors, and more particularly to grounding methods for printed wiring board edge-launch connectors. The grounding method comprises conducting tabs secured to a PWB and to an attached connector frame holding coaxial connectors. The conducting tabs thus provide a ground connection between the connector frame and one or more ground conductors on the PWB.