Patents by Inventor Waite R. Warren, Jr.
Waite R. Warren, Jr. has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 8720051Abstract: In one embodiment, a meta-module having circuitry for two or more modules is formed on a substrate, which is preferably a laminated substrate. The circuitry for the different modules is initially formed on the single meta-module. Each module will have one or more component areas in which the circuitry is formed. A metallic structure is formed on or in the substrate for each component area to be shielded. A single body, such as an overmold body, is then formed over all of the modules on the meta-module. At least a portion of the metallic structure for each component area to be shielded is then exposed through the body by a cutting, drilling, or like operation. Next, an electromagnetic shield material is applied to the exterior surface of the body of each of the component areas to be shielded and in contact with the exposed portion of the metallic structures.Type: GrantFiled: June 2, 2011Date of Patent: May 13, 2014Assignee: RF Micro Devices, Inc.Inventors: Donald Joseph Leahy, Waite R. Warren, Jr., Stephen Parker
-
Patent number: 8409658Abstract: In one embodiment, a meta-module having circuitry for two or more modules is formed on a substrate, which is preferably a laminated substrate. The circuitry for the different modules is initially formed on the single meta-module. Each module will have one or more component areas in which the circuitry is formed. A metallic structure is formed on or in the substrate for each component area to be shielded. A single body, such as an overmold body, is then formed over all of the modules on the meta-module. At least a portion of the metallic structure for each component area to be shielded is then exposed through the body by a cutting, drilling, or like operation. Next, an electromagnetic shield material is applied to the exterior surface of the body of each of the component areas to be shielded and in contact with the exposed portion of the metallic structures.Type: GrantFiled: December 7, 2007Date of Patent: April 2, 2013Assignee: RF Micro Devices, Inc.Inventors: David J. Hiner, Waite R. Warren, Jr., David Jandzinski
-
Patent number: 8349659Abstract: The present invention integrates a shield on a flat, no-lead (FN) semiconductor package, which has multiple rows of contact pads along any side. The FN semiconductor package will have at least one inner row and one outer row of contact pads on at least one side. The inner and outer rows of contact pads and a die attach pad form the foundation for the FN semiconductor package. A die is mounted on the die attach pad and connected by wirebonds to certain contact pads of the inner rows of contact pads. An overmold body is formed over the die, die attach pad, wirebonds, and inner row of contact pads, and substantially encompasses each contact pad of the outer row of contact pads. A conformal coating is applied over the overmold body, including the exposed surfaces of the contact pads of the outer row of contact pads, providing a shield.Type: GrantFiled: July 21, 2011Date of Patent: January 8, 2013Assignee: RF Micro Devices, Inc.Inventors: Geoff Swan, Waite R. Warren, Jr.
-
Patent number: 8296941Abstract: A meta-module having circuitry for two or more modules is formed on a substrate, which is preferably a laminated substrate. The circuitry for the different modules is initially formed on the single meta-module. Each module will have one or more component areas in which the circuitry is formed. A metallic structure is formed on or in the substrate for each component area to be shielded. A single body, such as an overmold body, is then formed over all of the modules on the meta-module. At least a portion of the metallic structure for each component area to be shielded is then exposed through the body by a cutting, drilling, or like operation. Next, an electromagnetic shield material is applied to the exterior surface of the body of each of the component areas to be shielded and in contact with the exposed portion of the metallic structures.Type: GrantFiled: May 27, 2011Date of Patent: October 30, 2012Assignee: RF Micro Devices, Inc.Inventors: David J. Hiner, Waite R. Warren, Jr., Donald Joseph Leahy, David Jandzinski, Thomas Scott Morris, David Halchin, Milind Shah, Mark Charles Held, Brian Howard Calhoun, Brian D. Sawyer, Ulrik Riis Madsen
-
Patent number: 8220145Abstract: In one embodiment, a meta-module having circuitry for two or more modules is formed on a substrate, which is preferably a laminated substrate. The circuitry for the different modules is initially formed on the single meta-module. Each module will have one or more component areas in which the circuitry is formed. A metallic structure is formed on or in the substrate for each component area to be shielded. A single body, such as an overmold body, is then formed over all of the modules on the meta-module. At least a portion of the metallic structure for each component area to be shielded is then exposed through the body by a cutting, drilling, or like operation. Next, an electromagnetic shield material is applied to the exterior surface of the body of each of the component areas to be shielded and in contact with the exposed portion of the metallic structures.Type: GrantFiled: December 7, 2007Date of Patent: July 17, 2012Assignee: RF Micro Devices, Inc.Inventors: David J. Hiner, Waite R. Warren, Jr.
-
Patent number: 8186048Abstract: In one embodiment, a meta-module having circuitry for two or more modules is formed on a substrate, which is preferably a laminated substrate. The circuitry for the different modules is initially formed on the single meta-module. Each module will have one or more component areas in which the circuitry is formed. A metallic structure is formed on or in the substrate for each component area to be shielded. A single body, such as an overmold body, is then formed over all of the modules on the meta-module. At least a portion of the metallic structure for each component area to be shielded is then exposed through the body by a cutting, drilling, or like operation. Next, an electromagnetic shield material is applied to the exterior surface of the body of each of the component areas to be shielded and in contact with the exposed portion of the metallic structures.Type: GrantFiled: December 7, 2007Date of Patent: May 29, 2012Assignee: RF Micro Devices, Inc.Inventors: Donald Joseph Leahy, Waite R. Warren, Jr., Stephen Parker
-
Patent number: 8053872Abstract: The present invention integrates a shield on a flat, no-lead (FN) semiconductor package, which has multiple rows of contact pads along any side. The FN semiconductor package will have at least one inner row and one outer row of contact pads on at least one side. The inner and outer rows of contact pads and a die attach pad form the foundation for the FN semiconductor package. A die is mounted on the die attach pad and connected by wirebonds to certain contact pads of the inner rows of contact pads. An overmold body is formed over the die, die attach pad, wirebonds, and inner row of contact pads, and substantially encompasses each contact pad of the outer row of contact pads. A conformal coating is applied over the overmold body, including the exposed surfaces of the contact pads of the outer row of contact pads, providing a shield.Type: GrantFiled: June 25, 2007Date of Patent: November 8, 2011Assignee: RF Micro Devices, Inc.Inventors: Geoff Swan, Waite R. Warren, Jr.
-
Publication number: 20110235282Abstract: In one embodiment, a meta-module having circuitry for two or more modules is formed on a substrate, which is preferably a laminated substrate. The circuitry for the different modules is initially formed on the single meta-module. Each module will have one or more component areas in which the circuitry is formed. A metallic structure is formed on or in the substrate for each component area to be shielded. A single body, such as an overmold body, is then formed over all of the modules on the meta-module. At least a portion of the metallic structure for each component area to be shielded is then exposed through the body by a cutting, drilling, or like operation. Next, an electromagnetic shield material is applied to the exterior surface of the body of each of the component areas to be shielded and in contact with the exposed portion of the metallic structures.Type: ApplicationFiled: June 2, 2011Publication date: September 29, 2011Applicant: RF MICRO DEVICES, INC.Inventors: Donald Joseph Leahy, Waite R. Warren, JR., Stephen Parker
-
Publication number: 20110225803Abstract: A meta-module having circuitry for two or more modules is formed on a substrate, which is preferably a laminated substrate. The circuitry for the different modules is initially formed on the single meta-module. Each module will have one or more component areas in which the circuitry is formed. A metallic structure is formed on or in the substrate for each component area to be shielded. A single body, such as an overmold body, is then formed over all of the modules on the meta-module. At least a portion of the metallic structure for each component area to be shielded is then exposed through the body by a cutting, drilling, or like operation. Next, an electromagnetic shield material is applied to the exterior surface of the body of each of the component areas to be shielded and in contact with the exposed portion of the metallic structures.Type: ApplicationFiled: May 27, 2011Publication date: September 22, 2011Applicant: RF MICRO DEVICES, INC.Inventors: David J. Hiner, Waite R. Warren, JR., Donald Joseph Leahy, David Jandzinski, Thomas Scott Morris, David Halchin, Milind Shah, Mark Charles Held, Brian Howard Calhoun, Brian D. Sawyer, Ulrik Riis Madsen
-
Publication number: 20100199492Abstract: A meta-module having circuitry for two or more modules is formed on a substrate, which is preferably a laminated substrate. The circuitry for the different modules is initially formed on the single meta-module. Each module will have one or more component areas in which the circuitry is formed. A metallic structure is formed on or in the substrate for each component area to be shielded. A single body, such as an overmold body, is then formed over all of the modules on the meta-module. At least a portion of the metallic structure for each component area to be shielded is then exposed through the body by a cutting, drilling, or like operation. Next, an electromagnetic shield material is applied to the exterior surface of the body of each of the component areas to be shielded and in contact with the exposed portion of the metallic structures.Type: ApplicationFiled: April 23, 2010Publication date: August 12, 2010Applicant: RF MICRO DEVICES, INC.Inventors: David J. Hiner, Waite R. Warren, JR., Donald Joseph Leahy, David Jandzinski, Thomas Scott Morris, David Halchin, Milind Shah, Mark Charles Held, Brian Howard Calhoun, Brian D. Sawyer, Ulrik Riis Madsen
-
Publication number: 20090025211Abstract: In one embodiment, a meta-module having circuitry for two or more modules is formed on a substrate, which is preferably a laminated substrate. The circuitry for the different modules is initially formed on the single meta-module. Each module will have one or more component areas in which the circuitry is formed. A metallic structure is formed on or in the substrate for each component area to be shielded. A single body, such as an overmold body, is then formed over all of the modules on the meta-module. At least a portion of the metallic structure for each component area to be shielded is then exposed through the body by a cutting, drilling, or like operation. Next, an electromagnetic shield material is applied to the exterior surface of the body of each of the component areas to be shielded and in contact with the exposed portion of the metallic structures.Type: ApplicationFiled: December 7, 2007Publication date: January 29, 2009Applicant: RF MICRO DEVICES, INC.Inventors: David J. Hiner, Waite R. Warren, JR.
-
Publication number: 20090002970Abstract: In one embodiment, a meta-module having circuitry for two or more modules is formed on a substrate, which is preferably a laminated substrate. The circuitry for the different modules is initially formed on the single meta-module. Each module will have one or more component areas in which the circuitry is formed. A metallic structure is formed on or in the substrate for each component area to be shielded. A single body, such as an overmold body, is then formed over all of the modules on the meta-module. At least a portion of the metallic structure for each component area to be shielded is then exposed through the body by a cutting, drilling, or like operation. Next, an electromagnetic shield material is applied to the exterior surface of the body of each of the component areas to be shielded and in contact with the exposed portion of the metallic structures.Type: ApplicationFiled: December 7, 2007Publication date: January 1, 2009Applicant: RF MICRO DEVICES, INC.Inventors: Donald Joseph Leahy, Waite R. Warren, JR., Stephen Parker
-
Publication number: 20090000816Abstract: In one embodiment, a meta-module having circuitry for two or more modules is formed on a substrate, which is preferably a laminated substrate. The circuitry for the different modules is initially formed on the single meta-module. Each module will have one or more component areas in which the circuitry is formed. A metallic structure is formed on or in the substrate for each component area to be shielded. A single body, such as an overmold body, is then formed over all of the modules on the meta-module. At least a portion of the metallic structure for each component area to be shielded is then exposed through the body by a cutting, drilling, or like operation. Next, an electromagnetic shield material is applied to the exterior surface of the body of each of the component areas to be shielded and in contact with the exposed portion of the metallic structures.Type: ApplicationFiled: December 7, 2007Publication date: January 1, 2009Applicant: RF MICRO DEVICES, INC.Inventors: David J. Hiner, Waite R. Warren, Jr., David Jandzinski
-
Publication number: 20090000815Abstract: In one embodiment, a meta-module having circuitry for two or more modules is formed on a substrate, which is preferably a laminated substrate. The circuitry for the different modules is initially formed on the single meta-module. Each module will have one or more component areas in which the circuitry is formed. A metallic structure is formed on or in the substrate for each component area to be shielded. A single body, such as an overmold body, is then formed over all of the modules on the meta-module. At least a portion of the metallic structure for each component area to be shielded is then exposed through the body by a cutting, drilling, or like operation. Next, an electromagnetic shield material is applied to the exterior surface of the body of each of the component areas to be shielded and in contact with the exposed portion of the metallic structures.Type: ApplicationFiled: December 7, 2007Publication date: January 1, 2009Applicant: RF MICRO DEVICES, INC.Inventors: David J. Hiner, Waite R. Warren, JR., Donald Joseph Leahy, David Jandzinski, Thomas Scott Morris, David Halchin, Milind Shah, Mark Charles Held, Brian Howard Calhoun, Brian D. Sawyer, Ulrik Riis Madsen
-
Patent number: 5864776Abstract: A position detection system is provided which, without physical contact, by the use of detected infrared energy emissions determines whether there is correct placement of one or more small objects, e.g., lead frames, on the lower half of a two-part die mold in a semiconductor component manufacturing process. This takes place prior to injection of an initially molten material that solidifies and encapsulates the small objects upon curing and cooling.Type: GrantFiled: August 27, 1997Date of Patent: January 26, 1999Assignee: Mitsubishi Electric America, Inc.Inventors: Waite R. Warren, Jr., John T. Cox, Louis W. Nicholls
-
Patent number: 5777873Abstract: In a test system, test fixtures that hold modules are controlled to enable an operator to separate modules that pass a test from modules that fail. When a module under test is properly loaded in a test fixture, a test fixture controller instructs a tester to start a test procedure. For a semiautomatic test fixture, a test start command is automatically supplied to the tester when the test fixture is closed around the module under test. The test fixture controller automatically interprets the test results provided by the tester. The module that passes the test is automatically released from the test fixture. If the module fails, the test fixture controller keeps it locked in the test fixture. The module is released only when an operator presses a failure acknowledgement button on a control box.Type: GrantFiled: April 29, 1996Date of Patent: July 7, 1998Assignee: Mitsubishi Semiconductor America, Inc.Inventors: John Cox, Waite R. Warren, Jr.
-
Patent number: 5737846Abstract: A lead frame dryer comprises a pair of water absorbing rollers positioned downstream of a lead frame water jet deflasher. The water absorbing rollers remove water from surfaces of the lead frame. A solid roller is positioned adjacent each of the water absorbing rolls to squeegee to compress the water absorbing roller and remove water stored in the water absorbing rollers for collection. A venturi device is provided which creates a vacuum for absorbing water removed from the water absorbing rolls. The collected water can be recycled back to the water jet deflasher.Type: GrantFiled: November 22, 1996Date of Patent: April 14, 1998Assignee: Mitsubishi Semiconductor America, Inc.Inventors: Waite R. Warren, Jr., Lou W. Nicholls
-
Patent number: 5696328Abstract: A clamp assembly for holding an object includes a first clamp member having a first grip portion and a second clamp member having a second grip portion disposed opposite said first grip portion. A first guide member restricts the first clamp member to movement along a first axis and a second guide member restricts the second clamp member to movement along a second axis, the second axis being disposed so as to cross the first axis at a crossover point.Type: GrantFiled: September 30, 1996Date of Patent: December 9, 1997Assignee: Mitsubishi Semiconductor America, Inc.Inventors: Jeffery D. Underwood, Thomas E. Andrews, Waite R. Warren, Jr.
-
Patent number: 5653860Abstract: During electroplating, an article immersed in an electroplating solution is held by an ultrasonic transducer supplied with an alternating-current energy produced by an ultrasonic generator. The ultrasonic transducer converts the alternating-current energy to mechanical vibrations at an ultrasonic frequency corresponding to the excitation frequency. The mechanical vibrations produced by the transducer are applied directly to the article to cause it to vibrate at the ultrasonic frequency. This vibration results in removing air bubbles from the article surface.Type: GrantFiled: May 2, 1996Date of Patent: August 5, 1997Assignee: Mitsubishi Semiconductor America, Inc.Inventors: Louis W. Nicholls, Waite R. Warren, Jr.