Patents by Inventor Wajid H. Rizvi

Wajid H. Rizvi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Structure and fabrication of semiconductor device having merged resistive/capacitive plate and/or surface layer that provides ESD protection
    Patent number: 5801065
    Abstract: A compact RC semiconductor structure suitable for integrated RC and RCD networks contains a semiconductor body (10), an overlying dielectric layer (14), and a resistive plate (16A) situated over the dielectric layer. The resistive plate constitutes both a resistor and at least part of the upper plate of a capacitor whose lower plate (12) is formed with part of the semiconductor body below the dielectric layer. A capacitive structure which provides high ESD protection is formed with a semiconductor body (10) that contains a heavily doped surface layer (12) whose sheet resistance is no more than 5 ohms/square. The surface layer constitutes the lower plate for a capacitor whose upper plate is formed with a conductive plate (16A) situated on a dielectric layer (14) overlying the semiconductor body.
    Type: Grant
    Filed: March 1, 1996
    Date of Patent: September 1, 1998
    Assignee: Universal Semiconductor, Inc.
    Inventors: Wajid H. Rizvi, Murali K. Denduluri, Greg Anzelc, Henry P. Y. Fong, Rahul B. Shinkre, Daniel Q. Ho