Patents by Inventor Wakako KAMIMURA

Wakako KAMIMURA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • POLYMER MOLDED ARTICLE INCLUDING BASE PORTION AND SURFACE LAYER PORTION
    Publication number: 20250243301
    Abstract: A polymer molded article including: a base portion; and a surface layer portion thermally bonded onto the base portion, wherein the polymer molded article satisfies the following requirements: 1) Gs>Gb where Gs is a rigidity of the surface layer portion, and Gb is a rigidity of the base portion; and 2) Tms<Tp where Tms is a melting point of the surface layer portion at a joint portion with the base portion, and Tp is a molding temperature during the thermally bonding.
    Type: Application
    Filed: April 21, 2023
    Publication date: July 31, 2025
    Applicant: SunAllomer Ltd.
    Inventors: Takeshi NAKAJIMA, Akihiro KATAGIRI, Wakako KAMIMURA