Patents by Inventor Wakana Aizawa

Wakana Aizawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220271392
    Abstract: It is an object of the present invention to provide a substrate for lithium ion battery separators which has high adhesion to an inorganic particle layer, can be made thin and is excellent in tensile strength and cuttability and a lithium ion battery separator including the substrate for lithium ion battery separators. The substrate for lithium ion battery separators which contains heat-resistant fibers and synthetic resin short fibers contains fibrillated heat-resistant fibers having a modified freeness of not more than 300 ml as the heat-resistant fibers and has a content of the fibrillated heat-resistant fibers having a modified freeness of not more than 300 ml of not less than 1.0 mass % to less than 5.0 mass % based on the total of all the fiber components contained in the substrate. The modified freeness is a value measured in accordance with JIS P8121-2:2012 except that an 80-mesh wire net having a wire diameter of 0.14 mm and an opening of 0.
    Type: Application
    Filed: May 2, 2022
    Publication date: August 25, 2022
    Applicant: MITSUBISHI PAPER MILLS LIMITED
    Inventors: Toshihiro SHIGEMATSU, Tomohiro SATO, Makoto KATO, Masatoshi KITO, Noriko KASAI, Kukjin YOON, Wakana AIZAWA
  • Publication number: 20210288382
    Abstract: It is an object of the present invention to provide a substrate for lithium ion battery separators which has high adhesion to an inorganic particle layer, can be made thin and is excellent in tensile strength and cuttability and a lithium ion battery separator including the substrate for lithium ion battery separators. The substrate for lithium ion battery separators which contains heat-resistant fibers and synthetic resin short fibers contains fibrillated heat-resistant fibers having a modified freeness of not more than 300 ml as the heat-resistant fibers and has a content of the fibrillated heat-resistant fibers having a modified freeness of not more than 300 ml of not less than 1.0 mass % to less than 5.0 mass % based on the total of all the fiber components contained in the substrate. The modified freeness is a value measured in accordance with JIS P8121-2:2012 except that an 80-mesh wire net having a wire diameter of 0.14 mm and an opening of 0.
    Type: Application
    Filed: September 1, 2017
    Publication date: September 16, 2021
    Applicant: MITSUBISHI PAPER MILLS LIMITED
    Inventors: Toshihiro SHIGEMATSU, Tomohiro SATO, Makoto KATO, Masatoshi KITO, Noriko KASAI, Kukjin YOON, Wakana AIZAWA
  • Patent number: 10230087
    Abstract: A non-woven fabric base material for a lithium ion secondary battery separator composed mainly of a polyethylene terephthalate fiber, characterized in that the non-woven fabric base material comprises a polyethylene terephthalate binder fiber and a crystallized polyethylene terephthalate fiber, and the content of a polyethylene terephthalate binder fiber having a fiber length of 2.5 mm or less is 10 to 60 mass %.
    Type: Grant
    Filed: June 23, 2017
    Date of Patent: March 12, 2019
    Assignee: MITSUBISHI PAPER MILLS LIMITED
    Inventors: Tomohiro Sato, Toshihiro Shigematsu, Makoto Kato, Kenji Hyodo, Wakana Aizawa
  • Publication number: 20170288190
    Abstract: A non-woven fabric base material for a lithium ion secondary battery separator composed mainly of a polyethylene terephthalate fiber, characterized in that the non-woven fabric base material comprises a polyethylene terephthalate binder fiber and a crystallized polyethylene terephthalate fiber, and the content of a polyethylene terephthalate binder fiber having a fiber length of 2.5 mm or less is 10 to 60 mass %.
    Type: Application
    Filed: June 23, 2017
    Publication date: October 5, 2017
    Applicant: MITSUBISHI PAPER MILLS LIMITED
    Inventors: Tomohiro SATO, Toshihiro SHIGEMATSU, Makoto KATO, Kenji HYODO, Wakana AIZAWA
  • Patent number: 9768430
    Abstract: A non-woven fabric base material for a lithium ion secondary battery separator composed mainly of a polyethylene terephthalate fiber, characterized in that the non-woven fabric base material comprises a polyethylene terephthalate binder fiber and a crystallized polyethylene terephthalate fiber, and the content of a polyethylene terephthalate binder fiber having a fiber length of 2.5 mm or less is 10 to 60 mass %.
    Type: Grant
    Filed: January 28, 2014
    Date of Patent: September 19, 2017
    Assignee: MITSUBISHI PAPER MILLS LIMITED
    Inventors: Tomohiro Sato, Toshihiro Shigematsu, Makoto Kato, Kenji Hyodo, Wakana Aizawa
  • Publication number: 20150372269
    Abstract: A non-woven fabric base material for a lithium ion secondary battery separator composed mainly of a polyethylene terephthalate fiber, characterized in that the non-woven fabric base material comprises a polyethylene terephthalate binder fiber and a crystallized polyethylene terephthalate fiber, and the content of a polyethylene terephthalate binder fiber having a fiber length of 2.5 mm or less is 10 to 60 mass %.
    Type: Application
    Filed: January 28, 2014
    Publication date: December 24, 2015
    Applicant: Mitsubishi Paper Mills Limited
    Inventors: Tomohiro SATO, Toshihiro SHIGEMATSU, Makoto KATO, Kenji HYODO, Wakana AIZAWA
  • Patent number: 7679004
    Abstract: As means for solving a problem of a positional shift of a land and a hole which is caused by an alignment in the formation of an etching resist layer and a plated resist layer in a method of manufacturing a circuit board, there are provided a method of manufacturing a circuit board including the steps of forming a first resin layer on a surface of an insulating substrate having a conductive layer on the surface and an internal wall of a through hole or/and a non-through hole, forming a second resin layer which is insoluble or slightly soluble in a developing solution for the first resin layer on the first resin layer provided on the surface conductive layer, and removing the first resin layer provided over the hole with the developing solution for the first resin layer, and a method of manufacturing a circuit board including the step of uniformly charging a surface of the first resin layer to induce a potential difference to the first resin layer provided over the hole and the first resin layer provided on th
    Type: Grant
    Filed: March 2, 2005
    Date of Patent: March 16, 2010
    Assignees: Shinko Electric Industries Co., Ltd., Mitsubishi Paper Mills Limited
    Inventors: Katsuya Fukase, Toyoaki Sakai, Munetoshi Irisawa, Toyokazu Komuro, Yasuo Kaneda, Masanori Natsuka, Wakana Aizawa
  • Publication number: 20070181994
    Abstract: As means for solving a problem of a positional shift of a land and a hole which is caused by an alignment in the formation of an etching resist layer and a plated resist layer in a method of manufacturing a circuit board, there are provided a method of manufacturing a circuit board including the steps of forming a first resin layer on a surface of an insulating substrate having a conductive layer on the surface and an internal wall of a through hole or/and a non-through hole, forming a second resin layer which is insoluble or slightly soluble in a developing solution for the first resin layer on the first resin layer provided on the surface conductive layer, and removing the first resin layer provided over the hole with the developing solution for the first resin layer, and a method of manufacturing a circuit board including the step of uniformly charging a surface of the first resin layer to induce a potential difference to the first resin layer provided over the hole and the first resin layer provided on th
    Type: Application
    Filed: March 2, 2005
    Publication date: August 9, 2007
    Applicants: SHINKO ELECTRIC INDUSTRIES CO., LTD., MITSUBISHI PAPER MILLS LIMITED
    Inventors: Katsuya Fukase, Toyoaki Sakai, Munetoshi Irisawa, Toyokazu Komuro, Yasuo Kaneda, Masanori Natsuka, Wakana Aizawa
  • Patent number: 7211527
    Abstract: A resin-impregnated substrate is obtained by a method comprising the steps of immersing a sheet comprising an aromatic liquid crystalline polyester fiber in an aromatic liquid crystalline polyester solution containing 100 parts by weight of a solvent and 0.5 to 100 parts by weight of an aromatic liquid crystalline polyester and removing the solvent, the solvent containing on a weight basis with respect to the solvent 30% or more of a phenol compound. The resin-impregnated substrate has a high heat resistance in soldering conditions.
    Type: Grant
    Filed: January 5, 2005
    Date of Patent: May 1, 2007
    Assignee: Sumitomo Chemical Company, Limited
    Inventors: Satoshi Okamoto, Shiro Katagiri, Wakana Aizawa, Masatoshi Kito
  • Publication number: 20050181692
    Abstract: A resin-impregnated substrate is obtained by a method comprising the steps of immersing a sheet comprising an aromatic liquid crystalline polyester fiber in an aromatic liquid crystalline polyester solution containing 100 parts by weight of a solvent and 0.5 to 100 parts by weight of an aromatic liquid crystalline polyester and removing the solvent, the solvent containing on a weight basis with respect to the solvent 30% or more of a phenol compound. The resin-impregnated substrate has a high heat resistance in soldering conditions.
    Type: Application
    Filed: January 5, 2005
    Publication date: August 18, 2005
    Inventors: Satoshi Okamoto, Shiro Katagiri, Wakana Aizawa, Masatoshi Kito
  • Publication number: 20040129916
    Abstract: The present invention provides a gelled composition comprising a polymer and a solvent, said polymer being obtained by an addition reaction between a linear copolymer having two terminal hydrosilyl groups and a compound having 3 or more ethylenic double bonds, wherein
    Type: Application
    Filed: May 24, 2002
    Publication date: July 8, 2004
    Inventors: Kazuchiyo Takaoka, Mutsuhiro Matsuyama, Kenji Hyodo, Wakana Aizawa, Takakazu Hino, Naoki Suzuki