Patents by Inventor Wakana FUSE

Wakana FUSE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • ORGANOMETALLIC ADDUCT COMPOUND AND METHOD OF MANUFACTURING INTEGRATED CIRCUIT DEVICE BY USING THE SAME
    Publication number: 20220324887
    Abstract: An organometallic adduct compound and a method of manufacturing an integrated circuit device, the organometallic adduct compound being represented by General Formula (I):
    Type: Application
    Filed: March 30, 2022
    Publication date: October 13, 2022
    Applicant: ADEKA CORPORATION
    Inventors: Seungmin RYU, Younsoo KIM, Jaewoon KIM, Kazuki HARANO, Kazuya SAITO, Takanori KOIDE, Yutaro AOKI, Gyuhee PARK, Younjoung CHO, Wakana FUSE, Yoshiki MANABE, Hiroyuki UCHIUZOU, Masayuki KIMURA, Takahiro YOSHII
  • Niobium compound and method of forming thin film
    Patent number: 11466043
    Abstract: A niobium compound and a method of forming a thin film using the niobium compound, the compound being represented by the following General formula I: wherein, in General formula I, R1, R4, R5, R6, R7, and R8 are each independently a hydrogen atom, a C1-C6 linear or branched alkyl group or a C3-C6 cyclic hydrocarbon group, at least one of R4, R5, R6, R7, and R8 being a C1-C6 linear or branched alkyl group, and R2 and R3 are each independently a hydrogen atom, a halogen atom, a C1-C6 linear or branched alkyl group, or a C3-C6 cyclic hydrocarbon group.
    Type: Grant
    Filed: May 22, 2020
    Date of Patent: October 11, 2022
    Assignees: SAMSUNG ELECTRONICS CO., LTD., ADEKA CORPORATION
    Inventors: Soyoung Lee, Seungmin Ryu, Gyuhee Park, Jaesoon Lim, Younjoung Cho, Akio Saito, Wakana Fuse, Yutaro Aoki, Takanori Koide
  • ORGANOMETALLIC COMPOUND AND METHOD OF MANUFACTURING INTEGRATED CIRCUIT USING THE SAME
    Publication number: 20210388010
    Abstract: An organometallic compound and a method of manufacturing an integrated circuit (IC) device, the organometallic compound being represented by Formula (I),
    Type: Application
    Filed: June 14, 2021
    Publication date: December 16, 2021
    Applicant: ADEKA CORPORATION
    Inventors: Seungmin RYU, Younsoo KIM, Gyuhee PARK, Younjoung CHO, Yutaro AOKI, Wakana FUSE, Kazuki HARANO, Takanori KOIDE, Yoshiki MANABE, Kazuya SAITO, Hiroyuki UCHIUZOU
  • MATERIALS FOR FABRICATING THIN FILMS, METHODS OF FABRICATING THIN FILMS USING THE SAME, AND EQUIPMENT FOR FABRICATING THIN FILMS USING THE SAME
    Publication number: 20210380622
    Abstract: Materials for fabricating a thin film that has improved quality and productivity are provided. The materials may include a Group 5 element precursor of formula (1): M1 may be a Group 5 element, each of R1 to R10 independently may be a hydrogen atom, a substituted or unsubstituted alkyl group having 1 to 5 carbon atoms, or f7onnula (2), R11 may be a substituted or unsubstituted alkyl group having 1 to 10 carbon atoms, and L1 may be an alkyl group, an alkylamino group, an alkoxy group or an alkylsilyl group, each of which may have 1 to 5 carbon atoms and may be substituted or unsubstituted. Formula (2) may have a structure of Each of Ra to Rc independently may be a substituted or unsubstituted alkyl group having 1 to 5 carbon atoms.
    Type: Application
    Filed: March 29, 2021
    Publication date: December 9, 2021
    Inventors: Seung-Min Ryu, Gyu-Hee Park, Youn Joung Cho, Kazuki Harano, Takanori Koide, Wakana Fuse, Yoshiki Manabe, Yutaro Aoki, Hiroyuki Uchiuzou, Kazuya Saito
  • ORGANOMETALLIC ADDUCT COMPOUND AND METHOD OF MANUFACTURING INTEGRATED CIRCUIT USING THE SAME
    Publication number: 20210284667
    Abstract: An organometallic adduct compound and a method of manufacturing an integrated circuit (IC) device, the organometallic adduct compound being represented by General formula (I): in General formula (I), R1, R2, and R3 are each independently a C1 to C5 alkyl group, at least one of R1, R2, and R3 being a C1 to C5 alkyl group in which at least one hydrogen atom is substituted with a fluorine atom, M is a niobium atom, a tantalum atom, or a vanadium atom, X is a halogen atom, m is an integer of 3 to 5, and n is 1 or 2.
    Type: Application
    Filed: March 5, 2021
    Publication date: September 16, 2021
    Applicant: ADEKA CORPORATION
    Inventors: Seungmin RYU, Jaewoon KIM, Gyuhee PARK, Younjoung CHO, Kazuya SAITO, Takanori KOIDE, Yoshiki MANABE, Yutaro AOKI, Hiroyuki UCHIUZOU, Wakana FUSE
  • NIOBIUM COMPOUND AND METHOD OF FORMING THIN FILM
    Publication number: 20210040130
    Abstract: A niobium compound and a method of forming a thin film using the niobium compound, the compound being represented by the following General formula I: wherein, in General formula I, R1, R4, R5, R6, R7, and R8 are each independently a hydrogen atom, a C1-C6 linear or branched alkyl group or a C3-C6 cyclic hydrocarbon group, at least one of R4, R5, R6, R7, and R8 being a C1-C6 linear or branched alkyl group, and R2 and R3 are each independently a hydrogen atom, a halogen atom, a C1-C6 linear or branched alkyl group, or a C3-C6 cyclic hydrocarbon group.
    Type: Application
    Filed: May 22, 2020
    Publication date: February 11, 2021
    Applicant: Adeka Corporation
    Inventors: Soyoung LEE, Seungmin RYU, Gyuhee PARK, Jaesoon LIM, Younjoung CHO, Akio SAITO, Wakana FUSE, Yutaro AOKI, Takanori KOIDE