Abstract: A method of through-plating a circuit board having conductors formed on two sides. At least two holes are filled under compression pressure with a sintering paste. Subsequently, the sintering paste is dried and fired to form a cohesive bond with the ceramic substrate and fill the holes. Simultaneous filling of multiple holes having different hole diameters is accomplished using a printing screen with screen holes of different diameters. A single print parameter set is used. The printing screen here has at least one screen hole for filling a hole larger than the reference hole. The screen hole has an area-reducing and area-dividing geometry that divides the screen hole into at least two hole sections.

Abstract: A printed circuit board having conductor tracks formed on one side of a substrate. The substrate is able to be cohesively bonded at a contact face to a cover for protecting the conductor tracks. In this case, the substrate includes a step, which forms a barrier with respect to an auxiliary material for promoting the cohesive bond, in order to prevent any wetting of the conductor tracks with the auxiliary material. A sensor having a printed circuit board for use in a fuel filling level measurement system of a vehicle.

Abstract: A printing screen for use through-plating a printed circuit board. The printing screen has at least one screen hole for filling a larger hole compared to a reference hole in a ceramic substrate. This printing screen has an area-reducing and area-dividing geometry that divides the screen hole into at least two hole sections.

Abstract: A printed circuit board, preferably for use in a fuel fill-level sensor and in a fuel fill-level measuring system, having conductor tracks formed on two sides of a ceramic substrate. The ceramic substrate has at least one metalized hole for through-contacting that connects the conductor tracks to one another. The hole of the sintered ceramic substrate is filled with a metal-containing sintering paste, which is introduced under pressure. In the fully sintered state, the paste enters into at least one integral bond with the ceramic substrate and completely fills the hole in so doing.

Abstract: A method of through-plating a circuit board having conductors formed on two sides. At least two holes are filled under compression pressure with a sintering paste. Subsequently, the sintering paste is dried and fired to form a cohesive bond with the ceramic substrate and fill the holes. Simultaneous filling of multiple holes having different hole diameters is accomplished using a printing screen with screen holes of different diameters. A single print parameter set is used. The printing screen here has at least one screen hole for filling a hole larger than the reference hole. The screen hole has an area-reducing and area-dividing geometry that divides the screen hole into at least two hole sections.

Abstract: A printed circuit board having conductor tracks formed on one side of a substrate. The substrate is able to be cohesively bonded at a contact face to a cover for protecting the conductor tracks. In this case, the substrate includes a step, which forms a barrier with respect to an auxiliary material for promoting the cohesive bond, in order to prevent any wetting of the conductor tracks with the auxiliary material. A sensor having a printed circuit board for use in a fuel filling level measurement system of a vehicle.

Abstract: An electronics unit includes a low multi-point metallic mount on which an insulating layer is arranged. A conductor track system is arranged on the insulating layer and electronic power components are arranged on the conductor track system. The insulating layer is a sintered electrically insulating polymer layer on which the conductor track system, which comprises a sintered glass frit with a noble metal filling, is arranged.

Abstract: An electronics unit includes a low multi-point metallic mount on which an insulating layer is arranged. A conductor track system is arranged on the insulating layer and electronic power components are arranged on the conductor track system. The insulating layer is a sintered electrically insulating polymer layer on which the conductor track system, which comprises a sintered glass frit with a noble metal filling, is arranged.

Abstract: An electrical circuit having at least one electrical component, in particular a strain-sensitive resistor and conductor tracks which are applied to a metallic carrier with the intermediate positioning of at least one insulating layer, at least one further conductor track, which is connected to at least one conductor track of the circuit, is applied to the surface of the metallic carrier. The invention also relates to methods for manufacturing the electrical circuit.

Abstract: An electrical circuit having at least one electrical component, in particular a strain-sensitive resistor and conductor tracks which are applied to a metallic carrier with the intermediate positioning of at least one insulating layer, at least one further conductor track, which is connected to at least one conductor track of the circuit, is applied to the surface of the metallic carrier. The invention also relates to methods for manufacturing the electrical circuit.