Patents by Inventor Waleed ALAM

Waleed ALAM has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11064636
    Abstract: Exemplary embodiments are disclosed of EMI shields including electrically-conductive foam (broadly, electrically-conductive resiliently compressible porous material). An exemplary embodiment includes an electromagnetic interference (EMI) shield for an optical transceiver including transmitter and receiver optical sub-assemblies. The EMI shield includes a portion having openings configured for receiving the transmitter and receiver optical sub-assemblies therethrough to thereby allow the EMI shield to be fit over the transmitter and receiver optical sub-assemblies for installation along a portion of the optical transceiver. The EMI shield also includes sidewalls depending from the portion that includes the openings. Electrically-conductive resiliently compressible porous material (e.g., electrically-conductive foam, etc.) is along at least a portion of an outer perimeter defined by the sidewalls.
    Type: Grant
    Filed: September 27, 2019
    Date of Patent: July 13, 2021
    Assignee: Laird Technologies, Inc.
    Inventors: Yongxue He, Waleed Alam
  • Publication number: 20210100140
    Abstract: Exemplary embodiments are disclosed of EMI shields including electrically-conductive foam (broadly, electrically-conductive resiliently compressible porous material). An exemplary embodiment includes an electromagnetic interference (EMI) shield for an optical transceiver including transmitter and receiver optical sub-assemblies. The EMI shield includes a portion having openings configured for receiving the transmitter and receiver optical sub-assemblies therethrough to thereby allow the EMI shield to be fit over the transmitter and receiver optical sub-assemblies for installation along a portion of the optical transceiver. The EMI shield also includes sidewalls depending from the portion that includes the openings. Electrically-conductive resiliently compressible porous material (e.g., electrically-conductive foam, etc.) is along at least a portion of an outer perimeter defined by the sidewalls.
    Type: Application
    Filed: September 27, 2019
    Publication date: April 1, 2021
    Inventors: Yongxue HE, Waleed ALAM