Abstract: A high performance LED (402) and associated semiconductor package (400) advantageously utilizes an integrated heat sink (408) for purposes of power dissipation. At a next level of assembly, (500, 600) the semiconductor package (400) is electromechanically coupled to a printed circuit board (300). The printed circuit board (300) has a cavity (208) with thermal contact pad (308) disposed therein and connected to a metal back plane (106). During electromechanical coupling, the heat sink (408) is thermally coupled to the metal back plane (106) via the thermal contact pad (308). During operation, the thermal coupling of the heat sink (408) to the metal back plane, also referred to as a thermal mass reservoir (106) operates to increase the effective thermal mass of the integrated heat sink (408) and thereby provide enhanced power dissipation and heat transfer away from the high performance LED device (402).

Abstract: This hybrid pulley assembly is comprised of two outer driven synchronized timing pulleys and a centerpiece inner driver timing pulley. This pulley assembly operates in such a manner where the input driving timing belt mounted on the centerpiece timing pulley positively drives the outer synchronized timing pulleys. An outer driven timing belt, which is mounted on the outer driven timing pulleys and across the centerpiece driver timing belt, is partially supported by the centerpiece driver timing belt top surface in the area enclosed by the two outer synchronized timing pulleys. This configuration allows this hybrid pulley assembly to be driven from within. This alleviates the need of conventional drive train systems where a timing driven belt is driven through an axial input to the driven timing pulley.