Abstract: A process performed by the manufacturer for testing integrated circuits (ICs) to insure better quality and higher reliability thereof and to eliminate the need for incoming inspection and board level testing by the chip customer. In the embodiment disclosed, in-process testing, wafer-probe testing, die separation, packaging, and one by one assembly line testing of the digital memory ICs for catastrophic failures all proceed according to conventional techniques. A large number of the ICs are then plugged into high-temperature, high signal integrity PC storage cards, each adapted for interconnecting the ICs in row-column arrays to form a memory board. The storage cards are mounted within an environmental chamber and are operatively coupled to corresponding PC driver cards mounted externally of the chamber. Next, accelerated dynamic burn-in of the ICs takes place.