Abstract: A three-axis load sensor utilizing four piezoresistive devices on a flexible silicon membrane is provided. The load sensor further includes a mesa disposed on the membrane substantially equidistant from the piezoresistive devices. A six-axis load cell is provided by placing a plurality of load sensors disposed on a substrate, the substrate configured to attach to an object wherein forces applied to the object can be measured and/or determined. The load sensors can be manufactured using bulk microfabrication techniques on a single crystal silicon wafer, and can detect normal and shear loading applied to the membrane.

Abstract: An apparatus and method is provided for characterizing adhesive bonding using an acoustic wave MEMS sensor. The sensor can consist of a silicon substrate, a thin aluminum nitride film on top of the substrate and a thin gold film above the aluminum nitride layer. An adhesive layer is added on top of the sensor and the dispersion property of acoustic waves in the layered configuration can be utilized for bonding integrity characterization. A wave dispersion model is developed to study the effect of changing the interface stiffness on the wave dispersion profile and to investigate the sensitivity of different sensor configurations. The results of the model illustrate that the dispersion profile shifts in the direction of decreasing wave velocity as the interface stiffness decreases.

Abstract: An apparatus and method is provided for characterizing adhesive bonding using an acoustic wave MEMS sensor. The sensor can consist of a silicon substrate, a thin aluminium nitride film on top of the substrate and a thin gold film above the aluminium nitride layer. An adhesive layer is added on top of the sensor and the dispersion property of acoustic waves in the layered configuration can be utilized for bonding integrity characterization. A wave dispersion model is developed to study the effect of changing the interface stiffness on the wave dispersion profile and to investigate the sensitivity of different sensor configurations. The results of the model illustrate that the dispersion profile shifts in the direction of decreasing wave velocity as the interface stiffness decreases.

Abstract: This disclosure presents an advanced design of an energy harvester that utilizes a piezoelectric element to convert vibration to electricity. The advanced design is based on a fixed-fixed folded beam. An aqua regia wet etching and PZT sol-gel deposition/patterning processes can be used to manufacture the energy harvester.

Abstract: A three-axis load sensor utilizing four piezoresistive devices on a flexible silicon membrane is provided. The load sensor further includes a mesa disposed on the membrane substantially equidistant from the piezoresistive devices. A six-axis load cell is provided by placing a plurality of load sensors disposed on a substrate, the substrate configured to attach to an object wherein forces applied to the object can be measured and/or determined. The load sensors can be manufactured using bulk microfabrication techniques on a single crystal silicon wafer, and can detect normal and shear loading applied to the membrane.

Abstract: A new approach for building a stress-sensing rosette capable of extracting the six stress components and the temperature is provided, and its feasibility is verified both analytically and experimentally. The approach can include varying the doping concentration of the sensing elements and utilizing the unique behaviour of the shear piezoresistive coefficient (?44) in n-Si.