Abstract: Systems and methods for reducing displacement of selected components during Printed Circuit Board Assembly (PCBA) manufacturing are described. In some embodiments, a PCBA manufacturing tool may include: a bar having a first end and a second end; a movable pin coupled to the first end, the movable pin configured to be inserted into a first hole of a PCB; and a fixed pin coupled to the second end, the fixed pin configured to be inserted into a second hole of the PCB.

Abstract: Circuits, systems and methods are provided that may be implemented using a corrosion sensor that employs a differential bridge circuit layout to detect corrosion events occurring to corrosion-sensitive components such as exposed electronic circuits. In one possible implementation, a detection circuit may be coupled to a corrosion coupon that includes the differential bridge circuit layout, and that is exposed to corrosive conditions such as ambient atmospheric conditions that contain contaminants (e.g., pollutants), humidity, particulates, etc.; as well as varying temperatures.

Abstract: Systems and methods for reducing displacement of selected components during Printed Circuit Board Assembly (PCBA) manufacturing are described. In some embodiments, a PCBA manufacturing tool may include: a bar having a first end and a second end; a movable pin coupled to the first end, the movable pin configured to be inserted into a first hole of a PCB; and a fixed pin coupled to the second end, the fixed pin configured to be inserted into a second hole of the PCB.

Abstract: Circuits, systems and methods are provided that may be implemented using a corrosion sensor that employs a differential bridge circuit layout to detect corrosion events occurring to corrosion-sensitive components such as exposed electronic circuits. In one possible implementation, a detection circuit may be coupled to a corrosion coupon that includes the differential bridge circuit layout, and that is exposed to corrosive conditions such as ambient atmospheric conditions that contain contaminants (e.g., pollutants), humidity, particulates, etc.; as well as varying temperatures.

Abstract: Methods and systems for monitoring contact joint integrity in an information handling system may include precisely monitoring a change in resistance of a resistive element associated with a contact joint. The change in resistance of the resistive element may be indicative of the integrity of the contact joint. The resistance may be measured using a modulated current source and by demodulating a voltage signal resulting from the modulated current flowing across the resistive element.

Abstract: Methods and systems for monitoring contact joint integrity in an information handling system may include precisely monitoring a change in resistance of a resistive element associated with a contact joint. The change in resistance of the resistive element may be indicative of the integrity of the contact joint. The resistance may be measured using a modulated current source and by demodulating a voltage signal resulting from the modulated current flowing across the resistive element.

Abstract: A water soluble, thermally stable, solder flux for use in forming a water soluble, thermally stable, solder paste is provided. The water soluble, thermally stable, solder flux contains an acidic ester component having about 50% to about 60% monoesters by weight based on total weight, about 40% to about 50% diesters by weight based on total weight, and about 0% to about 1.5% phosphoric acid by weight based on total weight. This ester component is combined with triethanolamine to form a flux vehicle having a molar ratio of triethanolamine to the ester component of about 0.6 to about 1.2. This vehicle is present in the solder flux in an amount from about 68% to about 79% by weight based on total weight of solder flux. The flux also contains rheology adjusting components in an amount ranging from about 17% to about 26% by weight based on total weight of solder flux. Citric acid included in the flux in an amount ranging from about 4% to about 6% by weight based on total weight of solder flux.