Patents by Inventor Wallace K Johnson

Wallace K Johnson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6558188
    Abstract: An electrical connector assembly has a flexible circuit with a first end portion, a second end portion, a first surface, and a second surface. A plurality of conductors extend between the first end portion and the second end portion within the circuit. A first connector assembly is attached to the circuit first end portion. The first connector assembly has a first connector electrically connected to at least one of the plurality of conductors, a first plate substantially encompassing the first connector and located adjacent the circuit first surface, and a second plate located adjacent the circuit second surface and opposite the first plate. The first plate and the second plate are mechanically coupled.
    Type: Grant
    Filed: June 22, 2000
    Date of Patent: May 6, 2003
    Assignee: Hewlett Packard Development Company, L.P.
    Inventors: Paul J. Mantey, Wallace K Johnson
  • Patent number: 6556449
    Abstract: The present invention is directed to a network chassis having a system backplane board, a subassembly backplane board, and at least one connector disposed on each of the system backplane board and subassembly backplane board for electrically connecting the system backplane board to the subassembly backplane board. The chassis includes a mounting mechanism for rotatably coupling the system backplane board to the chassis and defining a path of rotation therefor, and an ejection mechanism mounted to the system backplane board to unseat the connector of the system backplane board from the connector of the subassembly backplane board. The ejection mechanism selectively exerts a force against the chassis that is directed linearly outwardly from and perpendicularly to the system backplane board. The ejection mechanism further comprises a fastener for releasably engaging the system backplane board to the chassis.
    Type: Grant
    Filed: August 1, 2001
    Date of Patent: April 29, 2003
    Assignee: Hewlett Packard Development Company, L.P.
    Inventors: Brandon A Rubenstein, Wallace K Johnson, Bradley E. Clements