Abstract: An infrared detector array is covered by an insulation subcoat atop which o metal layers are applied. The first layer is a thin sputtered or evaporated layer atop which the thick layer is electroplated. Holes through the metal layers uncover the individual detectors of the array.

Abstract: An infrared detector array and its associated read-out conductors on a surate are covered with an electrically insulating photoresist layer. This layer is metalized, and a thin photoresist layer is applied atop the metal. The thin photoresist layer is exposed through a mask having perforations corresponding to the detectors of the array and to desired bonding lead regions on the conductors; when the layer is developed, regions of the metal are thus uncovered. These uncovered regions are then etched away and the insulating photoresist layer is exposed and developed, with the remaining metal acting as a mask. The thin photoresist layer may be stripped any time after the metal is etched. An array is produced in which regions above and closely around the detectors are uncovered, and regions on the read-out conductors are uncovered. Bonding leads may be applied to the read-out conductors in their exposed regions.