Patents by Inventor Walt VonSeggern

Walt VonSeggern has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • System for reducing or eliminating semiconductor device wire sweep
    Patent number: 7109586
    Abstract: Packaging a semiconductor device is provided. The semiconductor device comprises a plurality of semiconductor elements; a plurality of conductors providing interconnection between said plurality of semiconductor elements; and an insulative material applied across only a portion of at least two of said plurality of conductors.
    Type: Grant
    Filed: June 6, 2005
    Date of Patent: September 19, 2006
    Assignee: Kulicke and Soffa Industries, Inc.
    Inventors: Rakesh Batish, Andrew F. Hmiel, Glenn Sandgren, Walt VonSeggern, C. Scott Kulicke
  • System and method for reducing or eliminating semiconductor device wire sweep
    Patent number: 6955949
    Abstract: A method of packaging a semiconductor device is provided. The method includes applying an insulative material across only a portion of at least two of a plurality of conductors providing interconnection between elements in the semiconductor device. The method also includes encapsulating the conductors and elements, thereby packaging the semiconductor device.
    Type: Grant
    Filed: October 16, 2003
    Date of Patent: October 18, 2005
    Assignee: Kulicke & Soffa Investments, Inc.
    Inventors: Rakesh Batish, Andrew F. Hmiel, Glenn Sandgren, Walt VonSeggern, C. Scott Kulicke
  • System for reducing or eliminating semiconductor device wire sweep
    Publication number: 20050224930
    Abstract: Packaging a semiconductor device is provided. The semiconductor device comprises a plurality of semiconductor elements; a plurality of conductors providing interconnection between said plurality of semiconductor elements; and an insulative material applied across only a portion of at least two of said plurality of conductors.
    Type: Application
    Filed: June 6, 2005
    Publication date: October 13, 2005
    Inventors: Rakesh Batish, Andrew Hmiel, Glenn Sandgren, Walt VonSeggern, C. Kulicke
  • System and method for reducing or eliminating semiconductor device wire sweep
    Publication number: 20050085019
    Abstract: A method of packaging a semiconductor device is provided. The method includes applying an insulative material across only a portion of at least two of a plurality of conductors providing interconnection between elements in the semiconductor device. The method also includes encapsulating the conductors and elements, thereby packaging the semiconductor device.
    Type: Application
    Filed: October 16, 2003
    Publication date: April 21, 2005
    Inventors: Rakesh Batish, Andrew Hmiel, Glenn Sandgren, Walt VonSeggern, C. Kulicke
  • System and method for preventing and alleviating short circuiting in a semiconductor device
    Patent number: 6847122
    Abstract: A method of packaging a semiconductor device including a plurality of elements is provided. The method includes applying an insulative material to at least a portion of the semiconductor device, where the insulative material includes insulative particles having a diameter smaller than a gap between adjacent conductors providing interconnection between the elements. The method also includes curing the insulative material.
    Type: Grant
    Filed: October 16, 2003
    Date of Patent: January 25, 2005
    Assignee: Kulicke & Soffa Investments, Inc.
    Inventors: Rakesh Batish, C. Scott Kulicke, Andrew Hmiel, Walt VonSeggern