Patents by Inventor Walter A. Bush, Jr.

Walter A. Bush, Jr. has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Flip chip-in-leadframe package and process
    Patent number: 6828220
    Abstract: A method for connecting a chip to a leadframe includes forming bumps on a die by a Au stud-bumping technique, and attaching the chip to the leadframe by thermo-compression of the bumps onto bonding fingers of the leadframe. Also a flip chip-in-leadframe package is made according to the method. The package provides improved electrical performance particularly for devices used in RF applications.
    Type: Grant
    Filed: March 9, 2001
    Date of Patent: December 7, 2004
    Assignee: ChipPAC, Inc.
    Inventors: Rajendra D. Pendse, Marcos Karnezos, Walter A. Bush, Jr.