Patents by Inventor Walter Betz

Walter Betz has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240084907
    Abstract: An enhanced low noise relief valve renders the anodizing processing irrelevant to the low leakage nature of the valve member based on the tolerance between the tube portion of the valve member and the inlet bore of the machined housing. This is accomplished by providing an additional valve stem holder that acts as a stem holder through which at least part of the tube portion of the valve member extends, with the stem holder instead of the valve member tube being located adjacent to the bore of the machined housing. The stem holder does not need to be subject to the anodizing process, and therefore a tight tolerance between the valve member and stem holder provides adequate leakage control, and the anodizing process applied to the machined housing otherwise is separated from the location where leakage tolerance is critical.
    Type: Application
    Filed: September 11, 2023
    Publication date: March 14, 2024
    Applicant: Parker-Hannifin Corporation
    Inventors: Gerard G. Betz, II, Anthony F. White, David Walter Zuk
  • Publication number: 20010018891
    Abstract: A scale in the nanometer range for technical devices which are used for the high-resolution or ultrahigh-resolution imaging of structures. To construct the scale, at least two different crystalline or amorphous materials are used, which, when imaged, are easily distinguished from one another by their contrast. These material layers are deposited using a suitable material deposition method as a heterolayer sequence onto a substrate material. The produced heterolayer sequence is characterized experimentally using an analysis method that is sensitive to the individual layer thicknesses of the heterolayer sequence. The data obtained from the analysis method are evaluated and recorded. The layer structure is exposed by splitting open the heterolayer sequence in the deposition direction. The scale is suited for calibrating technical devices used for scanning electron microscopy, scanning transmission electron microscopy, or scanning probe microscopy (atomic force microscopy, scanning tunneling microscopy).
    Type: Application
    Filed: December 28, 2000
    Publication date: September 6, 2001
    Applicant: Deutsche Telekom AG
    Inventors: Rainer Loesch, Hartmut Hillmer, Winfried Schlapp, Armin Poecker, Walter Betz, Rainer Goebel
  • Patent number: 6231668
    Abstract: A method for manufacturing and calibrating a scale in the nanometer range for technical devices which are used for the high-resolution or ultrahigh-resolution imaging of structures, and such a scale. To construct the scale, at least two different crystalline or amorphous materials are used, which, when imaged, are easily distinguished from one another by their contrast. These material layers are deposited using a suitable material deposition method as a heterolayer sequence onto a substrate material. The produced heterolayer sequence is characterized experimentally using an analysis method that is sensitive to the individual layer thicknesses of the heterolayer sequence. The data obtained from the analysis method are evaluated and recorded. The layer structure is exposed by splitting open the heterolayer sequence in the deposition direction.
    Type: Grant
    Filed: February 6, 1997
    Date of Patent: May 15, 2001
    Assignee: Deutsche Telekom AG
    Inventors: Rainer Loesch, Hartmut Hillmer, Winfried Schlapp, Armin Poecker, Walter Betz, Rainer Goebel
  • Patent number: 5496878
    Abstract: Thermoplastic molding materials are obtainable by mixingA) from 0.5 to 5% by weight of a carboxyl-containing polyethylene wax having an average molecular weight M.sub.n (number average value) of from 500 to 20,000 andB) from 0 to 50% by weight of fibrous or particulate fillers or mixtures in a melt ofC) from 40 to 99.5% by weight of a polyamide prepolymer having a viscosity number of from 40 to 80 ml/g followed by post-condensation in the solid phase.
    Type: Grant
    Filed: September 21, 1994
    Date of Patent: March 5, 1996
    Assignee: BASF Aktiengesellschaft
    Inventors: Walter Goetz, Walter Betz
  • Patent number: 5442042
    Abstract: Moldings based on polyamides are surface treated with mixtures of at least 20% strength by weight aqueous hydrochloric acid with mono- or diethers of an aliphatic polyfunctional hydroxy compound in a mixing ratio of from 90:10 to 10:90% by volume.
    Type: Grant
    Filed: December 16, 1993
    Date of Patent: August 15, 1995
    Assignee: BASF Aktiengesellschaft
    Inventors: Hartmut Zeiner, Walter Betz, Graham E. McKee
  • Patent number: 5391572
    Abstract: Thermoplastic molding compositions are obtainable by mixingA) from 0.5 to 5% by weight of a thermoplastic polyester elastomer andB) from 0 to 50% by weight of fibrous or particulate fillers or mixtures thereof into a melt ofC) from 40 to 99.5% by weight of a polyamide prepolymer having a viscosity number of from 40 to 80 ml/g and subsequent postcondensation in solid phase.
    Type: Grant
    Filed: May 11, 1994
    Date of Patent: February 21, 1995
    Assignee: BASF Aktiengesellschaft
    Inventors: Walter Goetz, Walter Betz, Gunter Pipper
  • Patent number: 5332777
    Abstract: Unreinforced polyamide molding materials containA) from 60 to 100% by weight of a mixture consisting ofA.sub.1) from 97.5 to 99.85% by weight of one or more polyamides,A.sub.2) from 0.05 to 0.5% by weight of aluminum hydroxide andA.sub.3) from 0.1 to 2% by weight of one or more esters or amides of saturated or unsaturated aliphatic carboxylic acids of 10 to 40 carbon atoms with aliphatic saturated alcohols or amines of 2 to 40 carbon atomsand, based on the total weight of the polyamide molding material,B) from 0 to 40% by weight of a toughened polymer andC) from 0 to 10% by weight of conventional additives in effective amounts.
    Type: Grant
    Filed: September 25, 1992
    Date of Patent: July 26, 1994
    Assignee: BASF Aktiengesellschaft
    Inventors: Walter Goetz, Walter Betz
  • Patent number: 5254620
    Abstract: Thermoplastic molding compositions are obtainable by mixingA) from 0.5 to 5% by weight of a thermoplastic polyester elastomer andB) from 0 to 50% by weight of fibrous or particulate fillers or mixtures thereof into a melt ofC) from 40 to 99.5% by weight of a polyamide prepolymer having a viscosity number of from 40 to 80 ml/g and subsequent postcondensation in solid phase.
    Type: Grant
    Filed: December 2, 1991
    Date of Patent: October 19, 1993
    Assignee: BASF Aktiengesellschaft
    Inventors: Walter Goetz, Walter Betz, Gunter Pipper
  • Patent number: 5192477
    Abstract: A process for the surface treatment of moldings based on polyamides by treatment with an aqueous acid, wherein the aqueous acid used is a 30-85% strength solution of H.sub.3 PO.sub.4 yields moldings which are readily metallizable. Metallized moldings obtained by this process are useful in the production of automobiles and in the electronics industry.
    Type: Grant
    Filed: September 9, 1991
    Date of Patent: March 9, 1993
    Assignee: BASF Aktiengesellschaft
    Inventors: Walter Betz, Gerd Blinne
  • Patent number: 5034450
    Abstract: Thermoplastic molding materials contain, as essential components,A) from 40 to 99.5% by weight of a thermoplastic polyamide,B) from 0.5 to 15% by weight of a thermoplastic polyester elastomerand furthermoreC) from 0 to 50% by weight of fibrous or particulate fillers or a mixture of these.
    Type: Grant
    Filed: February 24, 1989
    Date of Patent: July 23, 1991
    Assignee: BASF Aktiengesellschaft
    Inventors: Walter Betz, Christoph Plachetta, Eckhard M. Koch, Gerd Blinne, Gunter Pipper
  • Patent number: 5015681
    Abstract: Thermoplastic molding materials contain, as essential components,(A) from 40 to 99.55% by weight of a thermoplastic polyamide,(B) from 0.45 to 15% by weight of a thermoplastic polyester elastomer,(C) from 0.05 to 1.99% by weight of melamine cyanurate and in addition(D) from 0 to 50% by weight of fibrous or particulate fillers or a mixture thereof.
    Type: Grant
    Filed: November 28, 1989
    Date of Patent: May 14, 1991
    Assignee: BASF Aktiengesellschaft
    Inventors: Peter Steiert, Walter Betz, Christoph Plachetta, Eckhard M. Koch
  • Patent number: 4898087
    Abstract: A laminarizer or arrangement for producing laminar flow, particularly for ceilings and walls of clean rooms or the link formed of filter modules. The laminarizer is suspended or held spaced from a cover supporting mechanical filters. The laminarizer is composed of rectangular frames with fabric sheets stretched onto the rectangular frames. The side members of the rectangular frames are hollow sections or angle sections of triangular cross-section. The fabric sheets rest against and are aligned by the surfaces of the side members facing the rooms are only as narrow and/or rounded-off alignment contacts for the fabric sheets, while the fastening of the fabric sheets is provided at the outer surfaces of the side members extending perpendicularly to the plane of the frame and/or on the rear surfaces of the side members extending in the plane of the frame.
    Type: Grant
    Filed: March 17, 1989
    Date of Patent: February 6, 1990
    Assignee: Heinrich Nickel GmbH
    Inventors: Klaus Fitzner, Walter Betz, Uwe Plitt, Wolfgang Schmitt
  • Patent number: 4866115
    Abstract: A solid mixture contains as essential components(A) from 40 to 99% by weight, based on the total weight of (A) and (B), of a nonnucleating thermoplastic polyamide and(B) from 1 to 60% by weight, based on the total weight of (A) and (B), of a thermoplastic polyamide which contains a nucleating agent, and in addition(C) from 0 to 60% by weight, based on the total weight of (A)+(B)+(C), of fibrous or particulate fillers.
    Type: Grant
    Filed: August 5, 1988
    Date of Patent: September 12, 1989
    Assignee: BASF Aktiengesellschaft
    Inventors: Walter Betz, Eckhard M. Koch, Christoph Plachetta, Gerd Blinne, Karl Hahn