Abstract: The present invention relates to the method of producing an interface that intimately bonds to common molding compounds; even though they contain mold release agents. The method utilizes a material at the surface of the molded part that bonds to the surface of the part but not to the steel mold. This not only permits the molding of an article using common industry techniques but more importantly the subsequent postmolding of a pigmented or protective resinous coating on one surface of a molded article. The method eliminates the need for special surface preparation such as sand blasting, scuff sanding, etc., to facilitate bonding of a secondary coating.

Abstract: Composite sheets of low pressure molding compounds sandwiched between films of polyethylene are thickened to a viscosity at which the film can be stripped from the composite by the application of low temperatures to at least the surface of the sandwiched composite.

Abstract: A method of making molding compounds, and particularly sheet molding compounds, wherein the reactive monomers are mixed directly with high density inorganic fillers and other ingredients of a molding compound. The monomers are converted to a resin insitu that is in or approaching the B-stage, so that the material is handleable as a solid and is moldable. Because of the amount, type, and thermal conductivity of the fillers, the resinification can be done quickly in a continuous process, by reason of the fact that the monomers are spread over a large surface area of inert fillers to provide good heat transfer, and exceedingly good process control.

Abstract: A method of making molding compounds, and particularly sheet molding compounds, wherein the reactive monomers are mixed directly with high density inorganic fillers and other ingredients of a molding compound. The monomers are converted to a resin insitu that is in or approaching the B-stage, so that the material is handleable as a solid and is moldable. Because of the amount, type, and thermal conductivity of the fillers, the resinification can be done quickly in a continuous process, by reason of the fact that the monomers are spread over a large surface area of inert fillers to provide good heat transfer, and exceedingly good process control.

Abstract: Disclosed is a method of bonding two layers of thermosetting plastic. A thin sheet of thermoplastic material is interpositioned between two layers of thermosetting plastic and the combination is subjected to temperatures sufficient to cause the thermosetting plastic layers to bond and cure. The thermosetting plastic contains mold release agents which are absorbable by the thermoplastic sheet, and crosslinking monomers in which the thermoplastic sheet is dissolvable at molding temperatures.

Abstract: A controlled reaction is had by reacting a phenol monomer with a basic catalyst to form a phenolate salt and the phenolate salt is then reacted with an aldehyde while dispersed throughout the inorganic filler of a molding compound. The reaction is stopped at a fusible state to produce a molding compound.

Abstract: We have developed molding compositions comprising a mixture of phenolic resin and hydrated cement. A minimum amount of hydration in the cement provides strength and cure enhancement to the phenolic resin. We think the hydrated cement acts as a processing aid to the phenolic resin because of surface activity.