Abstract: Novel tools and techniques are provided for implementing a semiconductor package or a chip package, and more particularly methods, systems, and apparatuses are provided for implementing a semiconductor package or a chip package including a stiffener member with a via. In various embodiments, an apparatus includes a substrate and a connector electrically coupled to the substrate. A stiffener member is disposed between the substrate and the connector and configured to restrain at least one of the substrate or the connector. A via extends through a body of the stiffener member and electrically couples the connector to the substrate.

Abstract: Techniques or processes for reducing and/or mitigation warpage are disclosed. A method for fabricating a package includes providing a stiffener member for mounting on a substrate of the package, determining an out-of-plane displacement for the substrate at a temperature of interest, the out-of-plane displacement corresponding to warpage, and if the warpage exceeds a predetermined value, modifying at least one attribute associated with the stiffener member.

Abstract: An electronic device and transducer structures are described.

Abstract: Transducer structures having multiple piezoelectric layer and annular contacts are described.

Abstract: An electronic device and transducer structures are described.

Abstract: Transducer structures having multiple piezoelectric layer and annular contacts are described.

Abstract: A design methodology reduces electromigration in integrated circuit joints such as flip-chip bumps by seeking to produce a more uniform current distribution at the interface between the integrated circuit pad and the joint while maintaining an interface form that coincides with standard integrated circuit designs is presented. The design methodology addresses the current distribution at the pad by dividing current carrying traces into a plurality of sub-traces with known resistances such that each sub-trace distributes a known amount of current to the pad of the integrated circuit. The multiple sub-traces connect to the pad and are placed to obtain a desired uniformity in the incoming current distribution. Width and/or length adjustments could be made to each of the plurality of sub-traces to obtain the desired resistances.

Abstract: A design methodology reduces electromigration in integrated circuit joints such as flip-chip bumps by seeking to produce a more uniform current distribution at the interface between the integrated circuit pad and the joint while maintaining an interface form that coincides with standard integrated circuit designs is presented. The design methodology addresses the current distribution at the pad by introducing an intermediate trace routing design between the current delivering trace and the pad that distributes the inflow of current from the trace to multiple points of entry on the pad. The intermediate trace routing design includes an outer trace channel connected to the current delivering trace. A plurality of conductive trace leads connect the outer trace channel to the pad. Preferably, each of the plurality of conductive trace leads is characterized by a respective trace impedance so as to distribute equal current flow through each of the leads to the pad.

Abstract: A novel pad structure for an integrated circuit component that utilizes a bump interconnect for connection to other integrated circuit components that produces a relatively uniform current distribution within the bump of the bump interconnect is presented. The pad structure includes an inner pad implemented on an inner conductive layer of the integrated circuit component, an outer pad implemented on an outer conductive layer of the integrated circuit component, and a plurality of vias connecting the inner pad and outer pad. The outer pad is sealed preferably around its edges with a passivation layer, which includes an opening exposing a portion of the outer pad. The vias connecting the inner pad and outer pad are preferably implemented to lie in a via region within the footprint of the pad opening.