Patents by Inventor Walter De Raedt
Walter De Raedt has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 11160500Abstract: Disclosed herein is a system for determining a subject's stress condition. The system includes a stress test unit configured for: receiving features defining the subject and physiological signals sensed from the subject when performing a relaxation and a stressful test task; extracting normalization parameters from the physiological signals; and identifying stress-responsive physiological features. The system also includes a storage unit configured for: storing a plurality of stress models; and storing the subject's features, normalization parameters, and the stress-responsive physiological features.Type: GrantFiled: December 18, 2018Date of Patent: November 2, 2021Assignees: IMEC vzw, Katholieke Universiteit Leuven, KU LEUVEN R&DInventors: Elena Smets, Emmanuel Rios Velazquez, Giuseppina Schiavone, Walter De Raedt, Christiaan Van Hoof
-
Publication number: 20190192074Abstract: Disclosed herein is a system for determining a subject's stress condition. The system includes a stress test unit configured for: receiving features defining the subject and physiological signals sensed from the subject when performing a relaxation and a stressful test task; extracting normalization parameters from the physiological signals; and identifying stress-responsive physiological features. The system also includes a storage unit configured for: storing a plurality of stress models; and storing the subject's features, normalization parameters, and the stress-responsive physiological features.Type: ApplicationFiled: December 18, 2018Publication date: June 27, 2019Applicants: IMEC VZW, Katholieke Universiteit Leuven, KU LEUVEN R&D, Stichting IMEC NederlandInventors: Elena Smets, Emmanuel Rios Velazquez, Giuseppina Schiavone, Walter De Raedt, Christiaan Van Hoof
-
Publication number: 20120092674Abstract: Disclosed are methods and devices for measuring electromagnetic properties of samples. In one embodiment, a device is disclosed that includes a substantially two-dimensional measurement chamber comprising a reflective surface, where the reflective surface has a substantially elliptical shape that forms a part of an ellipse having a first focal point and a second focal point. The device further includes an input/output port located at the first focal point and a sample holder located at the second focal point.Type: ApplicationFiled: October 13, 2011Publication date: April 19, 2012Applicants: Katholieke Universiteit Leuven, K.U. Leuven R&D, IMECInventors: Amin Enayati, Steven Brebels, Walter De Raedt, Guy Vandenbosch
-
Patent number: 8003537Abstract: A method for the production of a planar structure is disclosed. The method comprises producing on a substrate a plurality of structures of substantially equal height, and there being a space in between the plurality of structures. The method further comprises providing a fill layer of electromagnetic radiation curable material substantially filling the space between the structures. The method further comprises illuminating a portion of the fill layer with electromagnetic radiation, hereby producing a exposed portion and an unexposed portion, the portions being separated by an interface substantially parallel with the first main surface of the substrate. The method further comprises removing the portion above the interface.Type: GrantFiled: July 18, 2007Date of Patent: August 23, 2011Assignees: IMEC, Katholieke Universiteit LeuvenInventors: Xavier Rottenberg, Phillip Ekkels, Hendrikus Tilmans, Walter De Raedt
-
Patent number: 7835157Abstract: An interconnect module and a method of manufacturing the same. The method of making an interconnect module on a substrate comprises forming an interconnect section on the substrate. The interconnect section comprises at least two metal interconnect layers separated by a dielectric layer. The method further comprises forming a passive device on the substrate at a location laterally adjacent to the interconnect section. The passive device comprises at least one moveable element comprising a metal layer. The method further comprises forming the metal layer and one of the at least two metal interconnect layers from substantially the same material.Type: GrantFiled: December 6, 2007Date of Patent: November 16, 2010Assignee: IMECInventors: Hendrikus Tilmans, Eric Beyne, Henri Jansen, Walter De Raedt
-
Patent number: 7687904Abstract: A method of bonding two elements such as wafers used in microelectronics applications is disclosed. One inventive aspect relates to a method for bonding comprising producing on a first main surface of a first element a first solder ball, producing on a first main surface of a second element a second solder ball, providing contact between the first solder ball and the second solder ball, bonding the first element and the second element by applying a reflow act whereby the solder balls melt and form a joined solder ball structure. Prior to the bonding, the first solder ball is laterally embedded in a nonconductive material, such that the upper part of the first solder ball is not covered by the non-conductive material. Devices related to such methods are also disclosed.Type: GrantFiled: April 16, 2007Date of Patent: March 30, 2010Assignee: IMECInventors: Walter De Raedt, Steven Brebels, Steven Sanders, Tom Torfs, Eric Beyne
-
Patent number: 7586393Abstract: One inventive aspect relates to a reconfigurable cavity resonator. The resonator comprises a cavity delimited by metallic walls. The resonator further comprises a coupling device for coupling an electromagnetic wave into the cavity. The resonator further comprises a tuning element for tuning a resonance frequency at which the electromagnetic wave resonates in the cavity. The tuning element comprises one or more movable micro-electromechanical elements with an associated actuation element located in their vicinity for actuating each of them between an up state and a down state. The movable micro-electromechanical elements at least partially have a conductive surface and are mounted within the cavity.Type: GrantFiled: May 4, 2007Date of Patent: September 8, 2009Assignee: Interuniversitair Microelektronica Centrum (IMEC) VZWInventors: Hendrikus Tilmans, Ilja Ocket, Walter De Raedt
-
Publication number: 20080157897Abstract: An interconnect module and a method of manufacturing the same. The method of making an interconnect module on a substrate comprises forming an interconnect section on the substrate. The interconnect section comprises at least two metal interconnect layers separated by a dielectric layer. The method further comprises forming a passive device on the substrate at a location laterally adjacent to the interconnect section. The passive device comprises at least one moveable element comprising a metal layer. The method further comprises forming the metal layer and one of the at least two metal interconnect layers from substantially the same material.Type: ApplicationFiled: December 6, 2007Publication date: July 3, 2008Applicant: Interuniversitair Microelektronica Centrum (IMEC) vzwInventors: Hendrikus Tilmans, Eric Beyne, Henri Jansen, Walter De Raedt
-
Patent number: 7368311Abstract: An interconnect module and a method of manufacturing the same. The method of making an interconnect module on a substrate comprises forming an interconnect section on the substrate. The interconnect section comprises at least two metal interconnect layers separated by a dielectric layer. The method further comprises forming a passive device on the substrate at a location laterally adjacent to the interconnect section. The passive device comprises at least one moveable element comprising a metal layer. The method further comprises forming the metal layer and one of the at least two metal interconnect layers from substantially the same material.Type: GrantFiled: July 21, 2004Date of Patent: May 6, 2008Assignee: Interuniversitair Microelektronica Centrum (IMEC)Inventors: Hendrikus Tilmans, Eric Beyne, Henri Jansen, Walter De Raedt
-
Publication number: 20080038916Abstract: A method for the production of a planar structure is disclosed. The method comprises producing on a substrate a plurality of structures of substantially equal height, and there being a space in between the plurality of structures. The method further comprises providing a fill layer of electromagnetic radiation curable material substantially filling the space between the structures. The method further comprises illuminating a portion of the fill layer with electromagnetic radiation, hereby producing a exposed portion and an unexposed portion, the portions being separated by an interface substantially parallel with the first main surface of the substrate. The method further comprises removing the portion above the interface.Type: ApplicationFiled: July 18, 2007Publication date: February 14, 2008Applicants: Interuniversitair Microelektronica Centrum (MEC) vzw, Katholieke Unversiteit LeuvenInventors: Xavier Rottenberg, Phillip Ekkels, Hendrikus Tilmans, Walter De Raedt
-
Publication number: 20070257750Abstract: One inventive aspect relates to a reconfigurable cavity resonator. The resonator comprises a cavity delimited by metallic walls. The resonator further comprises a coupling device for coupling an electromagnetic wave into the cavity. The resonator further comprises a tuning element for tuning a resonance frequency at which the electromagnetic wave resonates in the cavity. The tuning element comprises one or more movable micro-electromechanical elements with an associated actuation element located in their vicinity for actuating each of them between an up state and a down state. The movable micro-electromechanical elements at least partially have a conductive surface and are mounted within the cavity.Type: ApplicationFiled: May 4, 2007Publication date: November 8, 2007Applicant: Interuniversitair Microelektronica Centrum (IMEC) VZWInventors: Hendrikus Tilmans, Ilja Ocket, Walter De Raedt
-
Patent number: 7205177Abstract: A method of bonding two elements such as wafers used in microelectronics applications is disclosed. One inventive aspect relates to a method for bonding comprising producing on a first main surface of a first element a first solder ball, producing on a first main surface of a second element a second solder ball, providing contact between the first solder ball and the second solder ball, bonding the first element and the second element by applying a reflow act whereby the solder balls melt and form a joined solder ball structure. Prior to the bonding, the first solder ball is laterally embedded in a nonconductive material, such that the upper part of the first solder ball is not covered by the non-conductive material. Devices related to such methods are also disclosed.Type: GrantFiled: June 30, 2005Date of Patent: April 17, 2007Assignee: Interuniversitair Microelektronica Centrum (IMEC)Inventors: Walter De Raedt, Steven Brebels, Steven Sanders, Tom Torfs, Eric Beyne
-
Patent number: 7002439Abstract: A micro electromechanical switchable capacitor is disclosed, comprising a substrate, a bottom electrode, a dielectric layer deposited on at least part of said bottom electrode, a conductive floating electrode deposited on at least part of said dielectric layer, an armature positioned proximate to the floating electrode and a first actuation area in order to stabilize the down state position of the armature. The device may furthermore comprise a second actuation area. The present invention provides shunt switches and series switches with actuation in zones attached to the floating electrode area or with relay actuation.Type: GrantFiled: September 15, 2003Date of Patent: February 21, 2006Assignee: Interuniversitair Microelektronica Centrum (IMEC)Inventors: Xavier Rottenberg, Henri Jansen, Hendrikus Tilmans, Walter De Raedt
-
Patent number: 6876056Abstract: An interconnect module and a method of manufacturing the same is described comprising: a substrate, an interconnect section formed on the substrate, and a variable passive device section formed on the substrate located laterally adjacent to the interconnect section. The interconnect section has at least two metal interconnect layers separated by a dielectric layer and the variable passive device has at least one moveable element. The moveable element is formed from a metal layer which is formed from the same material and at the same time as one of the two interconnect layers. The moveable element is formed on the dielectric layer and is released by local removal of the dielectric layer. Additional interconnect layers and intermediate dielectric layers may be added.Type: GrantFiled: April 18, 2002Date of Patent: April 5, 2005Assignee: Interuniversitair Microelektronica Centrum (IMEC)Inventors: Hendrikus Tilmans, Eric Beyne, Henri Jansen, Walter De Raedt
-
Publication number: 20040124497Abstract: A micro electromechanical switchable capacitor is disclosed, comprising a substrate, a bottom electrode, a dielectric layer deposited on at least part of said bottom electrode, a conductive floating electrode deposited on at least part of said dielectric layer, an armature positioned proximate to the floating electrode and a first actuation area in order to stabilize the down state position of the armature. The device may furthermore comprise a second actuation area. The present invention provides shunt switches and series switches with actuation in zones attached to the floating electrode area or with relay actuation.Type: ApplicationFiled: September 15, 2003Publication date: July 1, 2004Inventors: Xavier Rottenberg, Henri Jansen, Hendrikus Tilmans, Walter De Raedt
-
Publication number: 20030042567Abstract: An interconnect module and a method of manufacturing the same is described comprising: a substrate, an interconnect section formed on the substrate, and a variable passive device section formed on the substrate located laterally adjacent to the interconnect section. The interconnect section has at least two metal interconnect layers separated by a dielectric layer and the variable passive device has at least one moveable element. The moveable element is formed from a metal layer which is formed from the same material and at the same time as one of the two interconnect layers. The moveable element is formed on the dielectric layer and is released by local removal of the dielectric layer. Additional interconnect layers and intermediate dielectric layers may be added.Type: ApplicationFiled: April 18, 2002Publication date: March 6, 2003Inventors: Hendrikus Tilmans, Eric Beyne, Henri Jansen, Walter De Raedt
-
Patent number: 6278410Abstract: The present invention provides a planar antenna having a first, outer planar conductive element and a second planar conductive element located in a hole in the outer element. At least 75% of the boundary between the hole and the first outer planar conductive element is a continuous concave smooth curve. The second planar conductive element is substantially coplanar with and surrounded by the first outer planar conductive element. At least 75% of the outer boundary of the second planar conductive element is a continuously convex smooth curve.Type: GrantFiled: November 29, 1999Date of Patent: August 21, 2001Assignees: Interuniversitair Microelektronica Centrum, Katholieke Universiteit Leuven Research & DevelopmentInventors: Ezzeldin Soliman, Eric Beyne, Walter De Raedt, Guy Vandenbosch