Abstract: An embedded chip package is provided. The embedded chip package includes a plurality of chips; encapsulation material embedding the plurality of chips; at least one electrical redistribution layer electrically connected to the plurality of chips; and a common terminal connected to the at least one electrical redistribution layer, wherein the common terminal provides an interface to at least one of transmit and receive a common electrical signal between the plurality of chips and the common terminal.

Abstract: An embedded chip package is provided. The embedded chip package includes a plurality of chips; encapsulation material embedding the plurality of chips; at least one electrical redistribution layer electrically connected to the plurality of chips; and a common terminal connected to the at least one electrical redistribution layer, wherein the common terminal provides an interface to at least one of transmit and receive a common electrical signal between the plurality of chips and the common terminal.

Abstract: A sensor may include a sensor membrane, wherein one side of the sensor membrane at least partly has a glob top and wherein the glob top furthermore has structurings.

Abstract: A test device includes first and second testers each having at least one testing contact for making contact with at least one external contact of an electronic component; and a conveying device that conveys electronic components to the first and second testers in a synchronized manner such that the external contacts of the electronic components form an electrical connection to the testing contacts. Via the testing contacts, it is possible to apply input voltages and input currents to the electronic components and it is possible to measure the voltages, currents and resistances prevailing in the electronic components. The testers check the electronic components on the basis of a predetermined overall set of test criteria or on the basis of subsets of the overall set of test criteria.

Abstract: A test device includes first and second testers each having at least one testing contact for making contact with at least one external contact of an electronic component; and a conveying device that conveys electronic components to the first and second testers in a synchronized manner such that the external contacts of the electronic components form an electrical connection to the testing contacts. Via the testing contacts, it is possible to apply input voltages and input currents to the electronic components and it is possible to measure the voltages, currents and resistances prevailing in the electronic components. The testers check the electronic components on the basis of a predetermined overall set of test criteria or on the basis of subsets of the overall set of test criteria.