Patents by Inventor Walter Draxler

Walter Draxler has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Dicing method
    Patent number: 9421640
    Abstract: The method comprises providing a substrate like a semiconductor wafer (1), applying a laser cut (4) of the substrate, and subsequently applying a saw to divide the substrate from a main surface (10). The laser cut (4) may be used to cut along boundaries of saw streets (7).
    Type: Grant
    Filed: January 21, 2014
    Date of Patent: August 23, 2016
    Assignee: AMS AG
    Inventor: Walter Draxler
  • DICING METHOD
    Publication number: 20150367450
    Abstract: The method comprises providing a substrate like a semiconductor wafer (1), applying a laser cut (4) of the substrate, and subsequently applying a saw to divide the substrate from a main surface (10). The laser cut (4) may be used to cut along boundaries of saw streets (7).
    Type: Application
    Filed: January 21, 2014
    Publication date: December 24, 2015
    Inventor: Walter DRAXLER
  • Method for producing an electrical component
    Patent number: 7338839
    Abstract: To expose a submerged bondable terminal pad in a component that includes at least two substrates which are joined with each other, it is proposed that grooves of relatively shallow depth be provided on the connecting surface of the second substrate before the two substrates are joined. After the two substrates are joined, incisions are made opposite the grooves which open the grooves from the back side. The cutouts to be removed are defined between two grooves.
    Type: Grant
    Filed: June 4, 2003
    Date of Patent: March 4, 2008
    Assignee: Austriamicrosystems AG
    Inventors: Manfred Brandl, Robert Csernicska, Walter Draxler
  • Method for producing an electrical component
    Publication number: 20060141760
    Abstract: To expose a submerged bondable terminal pad in a component that includes at least two substrates which are joined with each other, it is proposed that grooves of relatively shallow depth be provided on the connecting surface of the second substrate before the two substrates are joined. After the two substrates are joined, incisions are made opposite the grooves which open the grooves from the back side. The cutouts to be removed are defined between two grooves.
    Type: Application
    Filed: June 4, 2003
    Publication date: June 29, 2006
    Inventors: Manfred Brandl, Robert Csernicska, Walter Draxler