Patents by Inventor Walter H. Johnson
Walter H. Johnson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20220137380Abstract: A Cassegrain or quasi-Cassegrain structure objective lens is used in a polar MOKE metrology system. The quasi-Cassegrain reflective objective lens includes a primary concave mirror and a secondary mirror. The primary concave mirror has a wider diameter than the secondary mirror and defines an aperture through which the laser beam is configured to be transmitted toward the secondary mirror. The secondary mirror can be convex, concave, or have a flat surface.Type: ApplicationFiled: October 19, 2021Publication date: May 5, 2022Inventors: Alex ZHENG, Jun WANG, David Y. WANG, Chunxia LI, Changfei YAN, Rui NI, Lansheng DONG, Yang ZHOU, Hai-Yang YOU, Haijing PENG, Walter H. JOHNSON, Shankar KRISHNAN, Jianou SHI
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Patent number: 11249110Abstract: Resistivity probes can be used to test integrated circuits. In one example, a resistivity probe has a substrate with multiple vias and multiple metal pins. Each of the metal pins is disposed in one of the vias. The metal pins extend out of the substrate. Interconnects provide an electrical connection to the metal pins. In another example, a resistivity probe has a substrate with a top surface and multiple elements extending from the substrate. Each of the elements curves from the substrate to a tip of the element such that each of the elements is non-parallel to the top surface of the substrate.Type: GrantFiled: November 10, 2019Date of Patent: February 15, 2022Assignee: KLA-Tencor CorporationInventors: Walter H. Johnson, III, Nanchang Zhu, Xianghua Liu, Jianli Cui, Zhu-bin Shi, Zhuoxian Zhang, Haiyang You, Lu Yu, Jianou Shi, Fan Zhang
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Patent number: 11043239Abstract: A laser beam is directed through a transmissive axicon telescope or a reflective axicon telescope such as in a magneto-optic Kerr effect metrology system. With the transmissive axicon telescope, a Gaussian beam profile is directed through a first axicon lens and a second axicon lens. The first axicon lens and second axicon lens transfer the Gaussian beam profile of the laser beam to a hollowed laser ring. The laser beam with a hollowed laser ring can be directed through a Schwarzschild reflective objective. With the reflective axicon telescope, the laser beam is directed through two conical mirrors that are fully reflective. One of the conical mirrors defines a central hole that the laser beam passes through.Type: GrantFiled: March 17, 2020Date of Patent: June 22, 2021Assignee: KLA CorporationInventors: Jun Wang, Yaolei Zheng, Chunxia Li, Changfei Yan, Lansheng Dong, Yang Zhou, Hai-Yang You, Haijing Peng, Jianou Shi, Rui Ni, Shankar Krishnan, David Y. Wang, Walter H. Johnson
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Publication number: 20200302965Abstract: A laser beam is directed through a transmissive axicon telescope or a reflective axicon telescope such as in a magneto-optic Kerr effect metrology system. With the transmissive axicon telescope, a Gaussian beam profile is directed through a first axicon lens and a second axicon lens. The first axicon lens and second axicon lens transfer the Gaussian beam profile of the laser beam to a hollowed laser ring. The laser beam with a hollowed laser ring can be directed through a Schwarzschild reflective objective. With the reflective axicon telescope, the laser beam is directed through two conical mirrors that are fully reflective. One of the conical mirrors defines a central hole that the laser beam passes through.Type: ApplicationFiled: March 17, 2020Publication date: September 24, 2020Inventors: Jun Wang, Yaolei Zheng, Chunxia Li, Changfei Yan, Lansheng Dong, Yang Zhou, Hai-Yang You, Haijing Peng, Jianou Shi, Rui Ni, Shankar Krishnan, David Y. Wang, Walter H. Johnson, Barry Blasenheim
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Publication number: 20200072869Abstract: Resistivity probes can be used to test integrated circuits. In one example, a resistivity probe has a substrate with multiple vias and multiple metal pins. Each of the metal pins is disposed in one of the vias. The metal pins extend out of the substrate. Interconnects provide an electrical connection to the metal pins. In another example, a resistivity probe has a substrate with a top surface and multiple elements extending from the substrate. Each of the elements curves from the substrate to a tip of the element such that each of the elements is non-parallel to the top surface of the substrate.Type: ApplicationFiled: November 10, 2019Publication date: March 5, 2020Inventors: Walter H. Johnson, III, Nanchang Zhu, Xianghua Liu, Jianli Cui, Zhu-bin Shi, Zhuoxian Zhang, Haiyang You, Lu Yu, Jianou Shi, Fan Zhang
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Patent number: 10514391Abstract: Resistivity probes can be used to test integrated circuits. In one example, a resistivity probe has a substrate with multiple vias and multiple metal pins. Each of the metal pins is disposed in one of the vias. The metal pins extend out of the substrate. Interconnects provide an electrical connection to the metal pins. In another example, a resistivity probe has a substrate with a top surface and multiple elements extending from the substrate. Each of the elements curves from the substrate to a tip of the element such that each of the elements is non-parallel to the top surface of the substrate.Type: GrantFiled: August 1, 2017Date of Patent: December 24, 2019Assignee: KLA-Tencor CorporationInventors: Walter H. Johnson, III, Nanchang Zhu, Xianghua Liu, Jianli Cui, Zhu-bin Shi, Zhuoxian Zhang, Haiyang You, Lu Yu, Jianou Shi, Fan Zhang
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Patent number: 10231337Abstract: Printed circuit assemblies comprising two or more printed circuit boards stacked and/or folded together and related methods. In some embodiments, a first printed circuit board comprising a first plurality of electrical components may be coupled with a second printed circuit board comprising a second plurality of electrical components using a flexible coupling member. The first printed circuit board may be stacked on top of the second printed circuit board and coupled using an adhesive layer positioned in between the first printed circuit board and the second printed circuit board. The adhesive layer may be configured to maintain the first printed circuit board in a stacked configuration with respect to the second printed circuit board.Type: GrantFiled: December 16, 2015Date of Patent: March 12, 2019Assignee: Inertial Sense, Inc.Inventor: Walter H. Johnson
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Publication number: 20180052189Abstract: Resistivity probes can be used to test integrated circuits. In one example, a resistivity probe has a substrate with multiple vias and multiple metal pins. Each of the metal pins is disposed in one of the vias. The metal pins extend out of the substrate. Interconnects provide an electrical connection to the metal pins. In another example, a resistivity probe has a substrate with a top surface and multiple elements extending from the substrate. Each of the elements curves from the substrate to a tip of the element such that each of the elements is non-parallel to the top surface of the substrate.Type: ApplicationFiled: August 1, 2017Publication date: February 22, 2018Inventors: Walter H. Johnson, III, Nanchang Zhu, Xianghua Liu, Jianli Cui, Zhu-bin Shi, Zhuoxian Zhang, Haiyang You, Lu Yu, Jianou Shi, Fan Zhang
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Patent number: 9778043Abstract: Microchip assemblies, such as self-contained, aided, INS microchip assemblies configured for being coupled with a circuit board or another electrical component. In some embodiments, two inertial navigation sensors may be provided, along with a receiver configured to receive an external signal comprising location data or another aiding sensor, such as a barometric pressure sensor, magnetometer, or WIFI receiver. The assembly may further comprise a processor configured to receive inertial parameter data from inertial navigation sensors and location data from the receiver, and may be configured to process the inertial parameter data and location data to output inertial navigation information.Type: GrantFiled: March 24, 2016Date of Patent: October 3, 2017Assignee: INERTIAL SENSE, LLCInventor: Walter H. Johnson
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Patent number: 9435826Abstract: A continuous variable spacing probe pin device, including first and second probe pins. The first and second probe pins are configured to measure a property of a conductive layer. In a first configuration, the first and second probe pins include respective first portions arranged to contact the conductive layer to measure the property. In a second configuration, the first and second probe pins include respective second portions arranged to contact the conductive layer to measure the property. A first area for each respective first portion is different from a second area for each respective second portion.Type: GrantFiled: May 6, 2013Date of Patent: September 6, 2016Assignee: KLA-Tencor CorporationInventors: Walter H. Johnson, Jianou Shi, Lansheng Dong, Haijing Peng, Xianghua Liu, Jiazhou Jin, Zhuoxian Zhang, Nanchang Zhu
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Publication number: 20160174378Abstract: Printed circuit assemblies comprising two or more printed circuit boards stacked and/or folded together and related methods. In some embodiments, a first printed circuit board comprising a first plurality of electrical components may be coupled with a second printed circuit board comprising a second plurality of electrical components using a flexible coupling member. The first printed circuit board may be stacked on top of the second printed circuit board and coupled using an adhesive layer positioned in between the first printed circuit board and the second printed circuit board. The adhesive layer may be configured to maintain the first printed circuit board in a stacked configuration with respect to the second printed circuit board.Type: ApplicationFiled: December 16, 2015Publication date: June 16, 2016Inventor: Walter H. Johnson
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Patent number: 9030219Abstract: A variable pressure probe pin device, including: a housing with a channel having a first longitudinal axis; a probe at least partially disposed in the channel and including a plurality of probe pins configured to measure a property of a conductive layer; and a fluid pressure system configured to supply pressurized fluid o the channel to control a position of the probe within the channel. The housing or the probe is displaceable such that the plurality of probe pins contact the conductive layer.Type: GrantFiled: February 27, 2013Date of Patent: May 12, 2015Assignee: KLA-Tencor CorporationInventors: Walter H. Johnson, Nanchang Zhu
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Publication number: 20130300445Abstract: A continuous variable spacing probe pin device, including first and second probe pins. The first and second probe pins are configured to measure a property of a conductive layer. In a first configuration, the first and second probe pins include respective first portions arranged to contact the conductive layer to measure the property. In a second configuration, the first and second probe pins include respective second portions arranged to contact the conductive layer to measure the property. A first area for each respective first portion is different from a second area for each respective second portion.Type: ApplicationFiled: May 6, 2013Publication date: November 14, 2013Inventors: Walter H. Johnson, Jianou Shi, Lansheng Dong, Haijing Peng, Xianghua Liu, Jiazhou Jin, Zhuoxian Zhang, Nanchang Zhu
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Publication number: 20130229196Abstract: A variable pressure probe pin device, including: a housing with a channel having a first longitudinal axis; a probe at least partially disposed in the channel and including a plurality of probe pins configured to measure a property of a conductive layer; and a fluid pressure system configured to supply pressurized fluid o the channel to control a position of the probe within the channel. The housing or the probe is displaceable such that the plurality of probe pins contact the conductive layer.Type: ApplicationFiled: February 27, 2013Publication date: September 5, 2013Applicant: KLA-TENCOR CORPORATIONInventors: Walter H. Johnson, Nanchang Zhu
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Patent number: 7302316Abstract: A system and method for providing autonomous control of unmanned aerial vehicles (UAVs) is disclosed. The system includes a ground station in communication with an unmanned aerial vehicle. The method for providing autonomous control of a UAV includes methods for processing communications between the ground station and UAV. The method also includes procedures for processing commands from the ground station. Also included in the method is a process for estimating the attitude of the UAV and autonomously maintaining its altitude within a desired threshold. The method also includes a process for autonomously orbiting about a specified point in space. Combined with these processes, the method also includes a process for an autonomous takeoff and landing of the UAV.Type: GrantFiled: September 14, 2004Date of Patent: November 27, 2007Assignee: Brigham Young UniversityInventors: Randal W. Beard, Walter H. Johnson, Reed Christiansen, Joshua M. Hintze, Timothy W. McLain
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Patent number: 7050160Abstract: A process for measuring both the reflectance and sheet resistance of a thin film, such as a metal film or a doped semiconductor, in a common apparatus comprises: directing a beam of radiation from a radiation source on the common apparatus onto a portion of the surface of the thin film, sensing the amount of radiation reflected from the surface of the thin film, and contacting the surface of the thin film with a sheet resistance measurement apparatus on the apparatus at a portion of the surface of the thin film coincident with or adjacent to the portion of the thin film contacted by the radiation beam to measure the sheet resistance of the thin film. The sheet resistance measurement apparatus may, by way of example, comprise a 4 point probe or an eddy current measurement apparatus. The respective measurements may be carried out either simultaneously or sequentially.Type: GrantFiled: April 3, 2003Date of Patent: May 23, 2006Assignee: KLA-Tencor Technologies CorporationInventors: Walter H. Johnson, Jagadish Kalyanam, Shankar Krishnan, Murali K. Narasimhan
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Patent number: 6815959Abstract: A pin configured to be disposed within a probe is provided. The probe may be configured to measure a property of a conductive layer. The pin may include a contact surface which may be substantially planar. The pin may also include a first portion extending from the contact surface. A cross-sectional area of the first portion, in a direction substantially parallel to the contact surface, may be substantially equal to a surface area of the contact surface across a length of the first portion. A system configured to measure a property of a conductive layer is also provided. The system may include a mounting device and at least two probes coupled to the mounting device. The probes may be configured to measure the property of a conductive layer. In addition, the mounting device may be configured such that one of the probes may contact the conductive layer during measurement.Type: GrantFiled: April 9, 2002Date of Patent: November 9, 2004Assignee: KLA-Tencor Technologies Corp.Inventors: Walter H. Johnson, Torsten Borchers, Daniel Griffing, Andrei Danet, George Erskine
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Publication number: 20030060092Abstract: A pin configured to be disposed within a probe is provided. The probe may be configured to measure a property of a conductive layer. The pin may include a contact surface which may be substantially planar. The pin may also include a first portion extending from the contact surface. A cross-sectional area of the first portion, in a direction substantially parallel to the contact surface, may be substantially equal to a surface area of the contact surface across a length of the first portion. A system configured to measure a property of a conductive layer is also provided. The system may include a mounting device and at least two probes coupled to the mounting device. The probes may be configured to measure the property of a conductive layer. In addition, the mounting device may be configured such that one of the probes may contact the conductive layer during measurement.Type: ApplicationFiled: April 9, 2002Publication date: March 27, 2003Inventors: Walter H. Johnson, Torsten Borchers, Daniel Griffing, Andrei Danet, George Erskine
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Patent number: 5260668Abstract: The resistivity of the surface of a semiconductor wafer is measured at different temperatures to determine the resistivity as a function of temperature. The temperature of the semiconductor wafer is varied by a heater in thermal contact with the semiconductor wafer, and the temperature is measured by a temperature sensor in thermal contact with the semiconductor. The heater is controlled by a control unit which adjusts the amount of heat provided by the heater, thereby controlling the temperature at which a measurement from a four-point resistivity probe is taken.Type: GrantFiled: June 11, 1992Date of Patent: November 9, 1993Assignee: Prometrix CorporationInventors: Chester L. Mallory, Walter H. Johnson, Wayne K. Borglum