Patents by Inventor Walter H. Johnson, III

Walter H. Johnson, III has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Resistivity probes with curved portions
    Patent number: 11249110
    Abstract: Resistivity probes can be used to test integrated circuits. In one example, a resistivity probe has a substrate with multiple vias and multiple metal pins. Each of the metal pins is disposed in one of the vias. The metal pins extend out of the substrate. Interconnects provide an electrical connection to the metal pins. In another example, a resistivity probe has a substrate with a top surface and multiple elements extending from the substrate. Each of the elements curves from the substrate to a tip of the element such that each of the elements is non-parallel to the top surface of the substrate.
    Type: Grant
    Filed: November 10, 2019
    Date of Patent: February 15, 2022
    Assignee: KLA-Tencor Corporation
    Inventors: Walter H. Johnson, III, Nanchang Zhu, Xianghua Liu, Jianli Cui, Zhu-bin Shi, Zhuoxian Zhang, Haiyang You, Lu Yu, Jianou Shi, Fan Zhang
  • Multi-Pin Dense Array Resistivity Probe
    Publication number: 20200072869
    Abstract: Resistivity probes can be used to test integrated circuits. In one example, a resistivity probe has a substrate with multiple vias and multiple metal pins. Each of the metal pins is disposed in one of the vias. The metal pins extend out of the substrate. Interconnects provide an electrical connection to the metal pins. In another example, a resistivity probe has a substrate with a top surface and multiple elements extending from the substrate. Each of the elements curves from the substrate to a tip of the element such that each of the elements is non-parallel to the top surface of the substrate.
    Type: Application
    Filed: November 10, 2019
    Publication date: March 5, 2020
    Inventors: Walter H. Johnson, III, Nanchang Zhu, Xianghua Liu, Jianli Cui, Zhu-bin Shi, Zhuoxian Zhang, Haiyang You, Lu Yu, Jianou Shi, Fan Zhang
  • Resistivity probe having movable needle bodies
    Patent number: 10514391
    Abstract: Resistivity probes can be used to test integrated circuits. In one example, a resistivity probe has a substrate with multiple vias and multiple metal pins. Each of the metal pins is disposed in one of the vias. The metal pins extend out of the substrate. Interconnects provide an electrical connection to the metal pins. In another example, a resistivity probe has a substrate with a top surface and multiple elements extending from the substrate. Each of the elements curves from the substrate to a tip of the element such that each of the elements is non-parallel to the top surface of the substrate.
    Type: Grant
    Filed: August 1, 2017
    Date of Patent: December 24, 2019
    Assignee: KLA-Tencor Corporation
    Inventors: Walter H. Johnson, III, Nanchang Zhu, Xianghua Liu, Jianli Cui, Zhu-bin Shi, Zhuoxian Zhang, Haiyang You, Lu Yu, Jianou Shi, Fan Zhang
  • Multi-Pin Dense Array Resistivity Probe
    Publication number: 20180052189
    Abstract: Resistivity probes can be used to test integrated circuits. In one example, a resistivity probe has a substrate with multiple vias and multiple metal pins. Each of the metal pins is disposed in one of the vias. The metal pins extend out of the substrate. Interconnects provide an electrical connection to the metal pins. In another example, a resistivity probe has a substrate with a top surface and multiple elements extending from the substrate. Each of the elements curves from the substrate to a tip of the element such that each of the elements is non-parallel to the top surface of the substrate.
    Type: Application
    Filed: August 1, 2017
    Publication date: February 22, 2018
    Inventors: Walter H. Johnson, III, Nanchang Zhu, Xianghua Liu, Jianli Cui, Zhu-bin Shi, Zhuoxian Zhang, Haiyang You, Lu Yu, Jianou Shi, Fan Zhang