Abstract: A microphone connector assembly comprises a receptacle and a sleeve. The receptacle includes a housing, a first cavity formed within the housing, a frame, a protrusion formed on the frame, and a first electrical block supported by the frame and positioned within the first cavity. The sleeve includes an outer shell, a second cavity formed within the outer shell, a keyway, and a second electrical block positioned within the second cavity. The sleeve is insertable into the receptacle such that the protrusion enters the keyway and the first and second electrical blocks engage one another.

Abstract: A microphone connector assembly comprises a receptacle and a sleeve. The receptacle includes a housing, a first cavity formed within the housing, a frame, a protrusion formed on the frame, and a first electrical block supported by the frame and positioned within the first cavity. The sleeve includes an outer shell, a second cavity formed within the outer shell, a keyway, and a second electrical block positioned within the second cavity. The sleeve is insertable into the receptacle such that the protrusion enters the keyway and the first and second electrical blocks engage one another.

Abstract: A microphone connector assembly comprises a receptacle and a sleeve. The receptacle includes a housing, a first cavity formed within the housing, a frame, a protrusion formed on the frame, and a first electrical block supported by the frame and positioned within the first cavity. The sleeve includes an outer shell, a second cavity formed within the outer shell, a keyway, and a second electrical block positioned within the second cavity. The sleeve is insertable into the receptacle such that the protrusion enters the keyway and the first and second electrical blocks engage one another.

Abstract: A microphone connector assembly comprises a receptacle and a sleeve. The receptacle includes a housing, a first cavity formed within the housing, a frame, a protrusion formed on the frame, and a first electrical block supported by the frame and positioned within the first cavity. The sleeve includes an outer shell, a second cavity formed within the outer shell, a keyway, and a second electrical block positioned within the second cavity. The sleeve is insertable into the receptacle such that the protrusion enters the keyway and the first and second electrical blocks engage one another.

Abstract: A system and method of providing a broadband patch antenna includes a main patch having a first strip and a second strip positioned about a ground strip extending from a ground plane, wherein at least a portion of the first strip of the main patch is disposed above the ground strip and forms a first radiating edge with the ground strip, and at least a portion of the second strip of the main patch is disposed below the ground strip and forms a second radiating edge with the ground plane. A parasitic patch is coupled to the main patch along at least a portion of a non-radiating edge of the main patch, and the parasitic patch includes a first strip and a second strip, wherein at least a portion of the first strip of the parasitic patch is disposed above the ground strip and at least a portion of the second strip of the parasitic patch is disposed below the ground strip.

Abstract: A system and method of providing a broadband patch antenna includes a main patch having a first strip and a second strip positioned about a ground strip extending from a ground plane, wherein at least a portion of the first strip of the main patch is disposed above the ground strip and forms a first radiating edge with the ground strip, and at least a portion of the second strip of the main patch is disposed below the ground strip and forms a second radiating edge with the ground plane. A parasitic patch is coupled to the main patch along at least a portion of a non-radiating edge of the main patch, and the parasitic patch includes a first strip and a second strip, wherein at least a portion of the first strip of the parasitic patch is disposed above the ground strip and at least a portion of the second strip of the parasitic patch is disposed below the ground strip.

Abstract: Systems and methods to search for, gather, transform, integrate, and present information representative of real property and land parcels. The systems and methods are web-based and include a spatial database configuration having an input side and an output side. The input side is capable of transforming data gathered from multiple disparate sources in an automated or semi-automated manner. The output side is capable of presenting an intuitive interface for users to search for, access, and view the transformed information.

Abstract: Systems and methods to search for, gather, transform, integrate, and present information representative of real property and land parcels. The systems and methods are web-based and include a spatial database configuration having an input side and an output side. The input side is capable of transforming data gathered from multiple disparate sources in an automated or semi-automated manner. The output side is capable of presenting an intuitive interface for users to search for, access, and view the transformed information.

Abstract: A pedestal style electronics enclosure provides an upright housing for enclosing electronic components. Installed at the top of the housing can be a hollow enclosure cap that defines an internal air gap. The air gap can be located between an upper, dome-like shield plate exposed to the exterior and a lower, contoured guide plate exposed to the interior of the enclosure. The air gap can help buffer the enclosure from solar radiation impinging upon the exterior shield plate. The interior contoured guide plate can help direct heated air rising in the interior of the enclosure to one or more vent panels located about the periphery of the cap. The hollow enclosure cap can be comprised of thermoplastic material and can be made as a single piece, monolithic structure produced by, for example, a blow molding process.

Abstract: A fiber optic splice enclosure for housing an interconnection contained in a splice tray between at least one optical fiber of a feeder cable and at least one optical fiber of a drop cable is provided. The optical fiber of the feeder cable is at least partially contained in a feeder cable buffer or transportation tube. The fiber optic splice enclosure includes a support frame arranged in the enclosure. The support frame includes a central office side and a drop side. A basket is arranged on the support frame for storing slack of a spliced buffer tube transitioning to the splice tray. The spliced storage arrangement is sized so as to be able to store slack of the spliced feeder cable buffer tube while maintaining a predetermined tube bend radius. A splice tray mounting arrangement is arranged on the drop side of the support frame for supporting the splice tray.

Abstract: A fiber optic splice enclosure for housing an interconnection contained in a splice tray between at least one optical fiber of a feeder cable and at least one optical fiber of a drop cable is provided. The optical fiber of the feeder cable is at least partially contained in a feeder cable buffer or transportation tube. The fiber optic splice enclosure includes a support frame arranged in the enclosure. The support frame includes a central office side and a drop side. A basket is arranged on the support frame for storing slack of a spliced buffer tube transitioning to the splice tray. The spliced storage arrangement is sized so as to be able to store slack of the spliced feeder cable buffer tube while maintaining a predetermined tube bend radius. A splice tray mounting arrangement is arranged on the drop side of the support frame for supporting the splice tray.

Abstract: A pedestal enclosure for electronic components is provided. The pedestal enclosure includes a base section and a cover engageable with the base section so as to define an interior space. The base section has a generally rectangular configuration and having a plurality of longitudinally extending channels formed therein such that the base section is substantially self-supporting in the ground. The cover has a generally cylindrical configuration and is engageable with a cylindrical neck on the base section so as to define an interior space. A bracket system is supported on the base section and arranged in the interior space. The bracket system includes a pair of legs. The base section comprises front and rear housing sections that can be selectively assembled together and split apart without removal of the bracket system. A lock mechanism is arranged near the top or near the bottom of the cover.

Abstract: An enclosure for electronic components is provided. The enclosure includes an electronics housing that has at least one slot for receiving one or more electronic components. The slot is defined by a plurality of walls. A heat pipe thermal management system is associated with the slot. The heat pipe system includes a heat pipe having a first portion embedded into one of the walls defining the slot for conducting heat from the wall to a second portion of the heat pipe extending out of the electronics housing. At least one cooling fin is carried by the second portion of the heat pipe such that heat from the heat pipe is conducted into the fin and the fin dissipates the heat to the ambient atmosphere outside of the electronics housing.

Abstract: A pedestal enclosure for electronic components is provided. The pedestal enclosure includes a base section and a cover engageable with the base section so as to define an interior space. The base section has a generally rectangular configuration and having a plurality of longitudinally extending channels formed therein such that the base section is substantially self-supporting in the ground. The cover has a generally cylindrical configuration and is engageable with a cylindrical neck on the base section so as to define an interior space. A bracket system is supported on the base section and arranged in the interior space. The bracket system includes a pair of legs. The base section comprises front and rear housing sections that can be selectively assembled together and split apart without removal of the bracket system. A lock mechanism is arranged near the top or near the bottom of the cover.

Abstract: A pedestal enclosure for electronic components is provided. The pedestal enclosure includes a base section and a cover engageable with the base section so as to define an interior space. A bracket system is arranged in the interior space. The bracket system has at least two side rails. The pedestal enclosure further includes a mounting arrangement for releasably mounting the bracket system to the base section. The mounting arrangement includes a channel section at a lower end of each of the side rails of the bracket system and a mounting part supported on the base section. Each of the mounting parts is configured and arranged to be received in and engage a respective one of the channel sections. Each channel section is configured to capture the respective mounting part on at least four sides thereof and each mounting part includes a stop surface for engaging an end of the respective channel section.

Abstract: A pedestal enclosure for electronic components is provided. The pedestal enclosure includes a base section and a cover engageable with the base section. A lock mechanism is arranged on the cover. The lock mechanism includes a latch supported in a lock housing for movement between locked and unlocked positions and a rotator rotatably supported by the lock housing such that rotation of the rotator moves the latch between the locked and unlocked positions. The rotator extends through the lock housing and has a head arranged outside a first side of the housing and a shaft end arranged outside a second side of the lock housing. A removable retaining device is arranged on the shaft end outside the second side of the lock housing. A lock receptacle is supported by the base section for receiving the lock mechanism when the cover is engaged with the base section.

Abstract: An enclosure for electronic components is provided. The enclosure includes an electronics housing that has at least one slot for receiving one or more electronic components. The slot is defined by a plurality of walls. A heat pipe thermal management system is associated with the slot. The heat pipe system includes a heat pipe having a first portion embedded into one of the walls defining the slot for conducting heat from the wall to a second portion of the heat pipe extending out of the electronics housing. At least one cooling fin is carried by the second portion of the heat pipe such that heat from the heat pipe is conducted into the fin and the fin dissipates the heat to the ambient atmosphere outside of the electronics housing.