Patents by Inventor Walter Horst Leitgeb

Walter Horst Leitgeb has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and Apparatus for Use in Wafer Processing
    Publication number: 20230170233
    Abstract: In an embodiment a method includes placing a wafer on a receptacle comprising a chuck base, wherein a light port for emitting light from a source of light is an opening located in a surface of the chuck base, and wherein the light port is located underneath the wafer, shining the light from the light port at an edge of the wafer so that light passes by the edge of the wafer and processing the wafer on the receptacle based on the light that passed by the edge of the wafer and that is received by a light sensitive element.
    Type: Application
    Filed: January 26, 2023
    Publication date: June 1, 2023
    Inventors: Thomas Fischer, Gerald Lackner, Walter Horst Leitgeb, Michael Lecher
  • Method and apparatus for use in wafer processing
    Patent number: 11637028
    Abstract: In an embodiment an apparatus includes a receptacle configured to receive a wafer, a light port configured to emit light from a source of light so as to shine the light on an edge of the wafer, wherein the light port is an opening located on a surface of the receptacle and a light sensitive element configured to receive light that passed the edge of the wafer and to form a detection signal based on the received light, wherein the light port is located underneath the wafer.
    Type: Grant
    Filed: March 31, 2021
    Date of Patent: April 25, 2023
    Assignee: INFINEON TECHNOLOGIES AG
    Inventors: Thomas Fischer, Gerald Lackner, Walter Horst Leitgeb, Michael Lecher
  • WAFER CHUCK FOR A LASER BEAM WAFER DICING EQUIPMENT
    Publication number: 20230100613
    Abstract: A chuck for a laser beam wafer dicing equipment includes a wafer support plate having an upper surface for holding a wafer disposed on a dicing tape. The upper surface includes an annular groove that overlaps an edge of the wafer when the wafer disposed on the dicing tape is placed on the upper surface. The wafer support plate includes a ventilation channel configured to ventilate the annular groove.
    Type: Application
    Filed: September 12, 2022
    Publication date: March 30, 2023
    Inventors: Franz-Josef Pichler, Johannes Mueller, Christoph Ahamer, Gerald Lackner, Walter Horst Leitgeb
  • Method and Apparatus for Use in Wafer Processing
    Publication number: 20210217640
    Abstract: In an embodiment an apparatus includes a receptacle configured to receive a wafer, a light port configured to emit light from a source of light so as to shine the light on an edge of the wafer, wherein the light port is an opening located on a surface of the receptacle and a light sensitive element configured to receive light that passed the edge of the wafer and to form a detection signal based on the received light, wherein the light port is located underneath the wafer.
    Type: Application
    Filed: March 31, 2021
    Publication date: July 15, 2021
    Inventors: Thomas Fischer, Gerald Lackner, Walter Horst Leitgeb, Michael Lecher
  • Method and apparatus for use in wafer processing
    Patent number: 10985041
    Abstract: A method and apparatus for use in a wafer processing are disclosed. In an embodiment a includes providing the wafer on a receptacle, wherein the receptacle comprises a light port, and wherein the light port includes a source of light, shining a light from the source of light at an edge of the wafer thereby passing light by the edge of the wafer and processing the wafer on the receptacle based on the light passing by the edge of the wafer and received by a light sensitive element.
    Type: Grant
    Filed: December 14, 2018
    Date of Patent: April 20, 2021
    Assignee: Infineon Technologies AG
    Inventors: Thomas Fischer, Gerald Lackner, Walter Horst Leitgeb, Michael Lecher
  • Method and Apparatus for Use in Wafer Processing
    Publication number: 20190122909
    Abstract: A method and apparatus for use in a wafer processing are disclosed. In an embodiment a includes providing the wafer on a receptacle, wherein the receptacle comprises a light port, and wherein the light port includes a source of light, shining a light from the source of light at an edge of the wafer thereby passing light by the edge of the wafer and processing the wafer on the receptacle based on the light passing by the edge of the wafer and received by a light sensitive element.
    Type: Application
    Filed: December 14, 2018
    Publication date: April 25, 2019
    Inventors: Thomas Fischer, Gerald Lackner, Walter Horst Leitgeb, Michael Lecher
  • Method and apparatus for use in wafer processing
    Patent number: 10186438
    Abstract: A method and an apparatus for use in processing a wafer are disclosed. In an embodiment the method includes providing a wafer on a receptacle, shining a light at an edge of the wafer and based on light that passed the edge of the wafer, processing the wafer on the receptacle.
    Type: Grant
    Filed: November 5, 2015
    Date of Patent: January 22, 2019
    Assignee: Infineon Technologies AG
    Inventors: Thomas Fischer, Gerald Lackner, Walter Horst Leitgeb, Michael Lecher
  • Method and Apparatus for Use in Wafer Processing
    Publication number: 20170133253
    Abstract: A method and an apparatus for use in processing a wafer are disclosed. In an embodiment the method includes providing a wafer on a receptacle, shining a light at an edge of the wafer and based on light that passed the edge of the wafer, processing the wafer on the receptacle.
    Type: Application
    Filed: November 5, 2015
    Publication date: May 11, 2017
    Inventors: Thomas Fischer, Gerald Lackner, Walter Horst Leitgeb, Michael Lecher