Patents by Inventor Walter J. Messmer, III

Walter J. Messmer, III has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 4872212
    Abstract: An electronic device which includes multiple components separately housed in electromagnetically isolating modular units, which units are interchangeably and detachably mounted in a frame. The frame and modular units are formed to releasably connect the various components to sources of electrical and/or microwave energy.
    Type: Grant
    Filed: May 15, 1987
    Date of Patent: October 3, 1989
    Assignee: EIP Microwave, Inc.
    Inventors: Mark D. Roos, Walter J. Messmer, III
  • Patent number: 4813886
    Abstract: A microwave device including various electromagnetically isolated components assembled with a microwave distribution bar in a single housing. A microwave distribution bar is formed to distribute microwave energy to those individual components which are selectively connected thereto.
    Type: Grant
    Filed: April 10, 1987
    Date of Patent: March 21, 1989
    Assignee: EIP Microwave, Inc.
    Inventors: Mark D. Roos, Walter J. Messmer, III
  • Patent number: 4800464
    Abstract: A modular electronic shielding assembly having a housing in which a ground plane platform is held. The housing is formed from a conductive material which provides for electromagnetic isolation. The ground plane platform also provides for electromagnetic isolation by having disposed on one side thereof a conductive layer. This ground plane platform separates the housing into two electromagnetically isolated compartments. The ground plane platform has electronic circuitry formed upon that surface opposite the conductive layer, which circuitry is isolated from the microwave components by one of two techniques. The first involves mounting the components to the opposite surface of the platform which carries the conductive layer, or by forming the components on one side of a daughterboard with the opposite side bearing a conductive layer. The daughterboard is mounted on that platform surface bearing the circuitry with the daughterboard conductive surface facing the circuitry.
    Type: Grant
    Filed: February 5, 1988
    Date of Patent: January 24, 1989
    Assignee: EIP Microwave, Inc.
    Inventors: Mark D. Roos, Walter J. Messmer, III