Abstract: Persistent storage may contain definitions of: configuration items (CIs) each having attributes that characterize a respective hardware or software component, a list of data sources used to update at least some of the CIs, and an auto-attestation time period; and one or more processors configured to: identify a plurality of the CIs for auto-attestation; for each respective CI, determine a respective condition of whether: (i) a data-source attribute of the respective CI indicates that it was updated by a trusted data source, and (ii) a most-recent-update attribute of the respective CI indicates that it was updated within the auto-attestation time period; and mark each respective CI based on its respective condition, wherein the respective CI is marked as auto-attested when its respective condition is true, and wherein the respective CI is marked as not auto-attested when its respective condition is false.

Abstract: In one or more embodiments, one or more systems, one or more methods, and/or one or more methods may: register a subroutine configured to store multiple addresses of a volatile memory medium VMM of an information handling system (IHS); for each IHS initialization executable/OS executable pair of multiple IHS initialization executable/OS executable pairs: retrieve, from a first non-volatile memory medium (NVMM), an IHS initialization executable of the IHS initialization executable/OS executable pair; copy, by the IHS initialization executable, an OS executable of the IHS initialization executable/OS executable pair from the first NVMM to the VMM; call, by the IHS initialization executable, the subroutine; store, by the subroutine, an address associated with the OS executable via a data structure stored by the VMM; and copy, by a first OS executable, the OS executable from the VMM to a second NVMM based at least on the address associated with the OS executable.

Abstract: In one or more embodiments, one or more systems, one or more methods, and/or one or more processes may execute a first information handling system (IHS) initialization executable of a first IHS initialization executable/operating system (OS) executable pair; execute a second OS executable of a second IHS initialization executable/OS executable pair via an OS context; determine, by the second OS executable, that at least one application has been installed on the IHS in addition to multiple applications that have already been installed on the IHS; determine, by the second OS executable, information associated with the at least one application and at least one of system information, power configuration information, status configuration information, and hardware information; and provide first information that recommends how to configure power utilization of the IHS and second information that recommends how not to configure power utilization of the IHS based at least on the determined information.

Abstract: A molding process includes the operation of placing insulation material comprising fibers and binder on the fibers in a mold cavity. The molding process further includes the step of transferring heat to the insulation material to cause the binder to cure.

Abstract: In one or more embodiments, one or more systems, one or more methods, and/or one or more methods may: register a subroutine configured to store multiple addresses of a volatile memory medium VMM of an information handling system (IHS); for each IHS initialization executable/OS executable pair of multiple IHS initialization executable/OS executable pairs: retrieve, from a first non-volatile memory medium (NVMM), an IHS initialization executable of the IHS initialization executable/OS executable pair; copy, by the IHS initialization executable, an OS executable of the IHS initialization executable/OS executable pair from the first NVMM to the VMM; call, by the IHS initialization executable, the subroutine; store, by the subroutine, an address associated with the OS executable via a data structure stored by the VMM; and copy, by a first OS executable, the OS executable from the VMM to a second NVMM based at least on the address associated with the OS executable.

Abstract: Systems and methods here may include computing system configured to coordinate more than one remotely operated vehicle using level of automation determination and assignments. In some examples, the method for coordinating a plurality of drones includes using a computer with a processor and a memory in communication with the plurality of drones, and a candidate problem resolver for retrieving a candidate resolution from a data storage, and sending the retrieved candidate resolution to a candidate resolution states predictor.

Abstract: In one or more embodiments, one or more systems, one or more methods, and/or one or more methods may: register a subroutine configured to store multiple addresses of a volatile memory medium VMM of an information handling system (IHS); for each IHS initialization executable/OS executable pair of multiple IHS initialization executable/OS executable pairs: retrieve, from a first non-volatile memory medium (NVMM), an IHS initialization executable of the IHS initialization executable/OS executable pair; copy, by the IHS initialization executable, an OS executable of the IHS initialization executable/OS executable pair from the first NVMM to the VMM; call, by the IHS initialization executable, the subroutine; store, by the subroutine, an address associated with the OS executable via a data structure stored by the VMM; and copy, by a first OS executable, the OS executable from the VMM to a second NVMM based at least on the address associated with the OS executable.

Abstract: In one or more embodiments, one or more systems, one or more methods, and/or one or more methods may: register a subroutine configured to store multiple addresses of a volatile memory medium VMM of an information handling system (IHS); for each IHS initialization executable/OS executable pair of multiple IHS initialization executable/OS executable pairs: retrieve, from a first non-volatile memory medium (NVMM), an IHS initialization executable of the IHS initialization executable/OS executable pair; copy, by the IHS initialization executable, an OS executable of the IHS initialization executable/OS executable pair from the first NVMM to the VMM; call, by the IHS initialization executable, the subroutine; store, by the subroutine, an address associated with the OS executable via a data structure stored by the VMM; and copy, by a first OS executable, the OS executable from the VMM to a second NVMM based at least on the address associated with the OS executable.

Abstract: A molding process (100) comprising the step of inserting an uncured blank (102) in a mold cavity (14) formed in a mold system, the uncured blank including fiber and uncured binder, transferring heat from the mold system to a cool pressurized gas (108) to establish a hot pressurized gas, injecting the hot pressurized gas into the mold cavity (110), and transferring heat (112) from the hot pressurized gas to the uncured blank to cause the uncured binder to cure and establish a cured product (114).

Abstract: A molding process includes the operation of placing insulation material comprising fibers and binder on the fibers in a mold cavity. The molding process further includes the step of transferring heat to the insulation material to cause the binder to cure.

Abstract: A molding process includes the operation of placing insulation material comprising fibers and binder on the fibers in a mold cavity. The molding process further includes the operation of transferring heat to the insulation material to cause the binder to cure.

Abstract: Metal film thickness can be determined using the sheet resistance, resistivity, and temperature coefficient of resistivity for the metal film. Variation in film thickness measurements caused by resistivity can be reduced or eliminated. A probe head may be used for some of the measurements of the metal film. The probe head can include a temperature sensor used during sheet resistance measurements. A wafer on a chuck is heated, such as using the chuck or the probe head, for the measurements.

Abstract: A molding process includes the operation of placing insulation material comprising fibers and binder on the fibers in a mold cavity. The molding process further includes the operation of transferring heat to the insulation material to cause the binder to cure.

Abstract: Metal film thickness can be determined using the sheet resistance, resistivity, and temperature coefficient of resistivity for the metal film. Variation in film thickness measurements caused by resistivity can be reduced or eliminated. A probe head may be used for some of the measurements of the metal film. The probe head can include a temperature sensor used during sheet resistance measurements. A wafer on a chuck is heated, such as using the chuck or the probe head, for the measurements.

Abstract: A three dimensional (3D) printing system includes an ink cartridge providing ink to a printhead and a controller. The ink cartridge also includes a flag material and a sensor component. The ink has a low dielectric constant and defines an upper surface having a vertical position defining an ink level. The flag material has a high dielectric constant and is disposed upon the upper surface of the ink. The sensor component includes a vertical arrangement of electrodes proximate to the ink. The controller is coupled to the sensor electrodes and is configured to: (1) scan sensor electrodes to determine a capacitance between adjacent pairs of electrodes, (2) identify at least one pair of electrodes having a peak capacitance value relative to capacitance values of remaining pairs of electrodes, and (3) estimate the ink level based upon the identification.

Abstract: A molding process includes the operation of placing insulation material comprising fibers and binder on the fibers in a mold cavity. The molding process further includes the operation of transferring heat to the insulation material to cause the binder to cure.

Abstract: A molding process includes the operation of placing insulation material comprising fibers and binder on the fibers in a mold cavity. The molding process further includes the operation of transferring heat to the insulation material to cause the binder to cure.