Abstract: A printed circuit panel is selectively coated to protect circuits which may be exposed to deleterious chemicals during the electroplating of connector tabs. The apparatus has a mechanism for gripping and transporting the circuit panels through multiple stations including cleaning, drying, coating and curing in a vertical position at variable speeds. The coating station has multiple wipers movable in a vertical plane to apply a polymer to the circuit panel at a controlled volume on various levels. The wipers each have a leading edge in contact with the panel surface to be coated and an adjustable back edge spaced apart from the panel surface to be coated with the polymer flowing to the panel between the two edges.