Abstract: Methods for producing a circuit board system and a circuit board arrangement are disclosed. One method for producing a circuit board system includes: providing a first circuit board including a top side, a bottom side, a top metallization layer arranged at the top side, and a bottom metallization layer arranged at the bottom side, wherein the bottom metallization layer comprises a number of soldering pads; applying a first solder over the soldering pads; and applying a second solder over the top metallization layer. The method further includes providing a number of electronic components and a metallic or metallized shielding frame; arranging the number of electronic components and the shielding frame on the applied second solder; and soldering the number of electronic components and the shielding frame to the top metallization layer with the second solder.

Abstract: Methods for producing a circuit board system and a circuit board arrangement are disclosed. One method for producing a circuit board system includes: providing a first circuit board including a top side, a bottom side, a top metallization layer arranged at the top side, and a bottom metallization layer arranged at the bottom side, wherein the bottom metallization layer comprises a number of soldering pads; applying a first solder over the soldering pads; and applying a second solder over the top metallization layer. The method further includes providing a number of electronic components and a metallic or metallized shielding frame; arranging the number of electronic components and the shielding frame on the applied second solder; and soldering the number of electronic components and the shielding frame to the top metallization layer with the second solder.

Abstract: A memory unit mounting module is provided for an on-board vehicle navigation device. The memory unit mounting module includes a memory unit and a support plate inside a housing of the navigation device and absorbing means arranged between the support plate and the memory unit for protecting the memory unit against shock and/or vibration, The absorbing means includes at least one spring element that may support the memory unit, and at least one damping element for absorbing shock and/or vibration of the memory unit.

Abstract: A memory unit mounting module is provided for an on-board vehicle navigation device. The memory unit mounting module includes a memory unit and a support plate inside a housing of the navigation device and absorbing means arranged between the support plate and the memory unit for protecting the memory unit against shock and/or vibration, The absorbing means includes at least one spring element that may support the memory unit, and at least one damping element for absorbing shock and/or vibration of the memory unit.