Patents by Inventor Walter Leitgeb
Walter Leitgeb has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230098233Abstract: A chuck for a laser beam wafer dicing equipment includes a wafer support plate having an upper surface for holding a wafer disposed on a dicing tape. The upper surface includes a topographically structured surface region that partly or completely overlaps an edge of the wafer when the wafer disposed on the dicing tape is placed on the upper surface. The topographically structured surface region provides for a reduction in an area of contact between the upper surface and the dicing tape.Type: ApplicationFiled: September 12, 2022Publication date: March 30, 2023Inventors: Franz-Josef Pichler, Johannes Mueller, Christoph Ahamer, Gerald Lackner, Walter Leitgeb
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Patent number: 11594439Abstract: According to various embodiments, a frame cassette includes a housing and a mounting structure within the housing. The mounting structure includes a plurality of tape-frame slots, each tape-frame slot configured to receive a tape-frame. The housing includes an opening configured to introduce a tape-frame into a tape-frame slot of the plurality of tape-frame slots, or to remove the tape frame from the tape-frame slot of the plurality of tape-frame slots. The housing also includes an electrostatic discharge protection. A corresponding automatic transportation system and method of automatic transportation of semiconductor wafers is also provided.Type: GrantFiled: June 15, 2018Date of Patent: February 28, 2023Assignee: Infineon Technologies AGInventors: Germar Schneider, Matthias Taubert, Michael Mitrach, Thomas Gadau, Markus Pfeifenberger, Walter Leitgeb, Frank Boenewitz
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Patent number: 11309196Abstract: A method of detecting adhesive residue on a wafer after peeling an adhesive film from the wafer by using a peeling tape is described. According to a first aspect, the method includes illuminating the peeling tape with first UV light after the peeling and acquiring a fluorescence image from the peeling tape. According to a second aspect, the method includes illuminating the wafer with second UV light after the peeling and acquiring a fluorescence image from the wafer.Type: GrantFiled: September 30, 2019Date of Patent: April 19, 2022Assignee: Infineon Technologies AGInventors: Robert Muhr, Matthias Fehr, Walter Leitgeb
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Patent number: 11251097Abstract: A method of monitoring a dicing tape tension is described. The method includes acquiring tension data indicative of the dicing tape tension by automated optical inspection of a dicing tape.Type: GrantFiled: February 25, 2020Date of Patent: February 15, 2022Assignee: Infineon Technologies AGInventors: Walter Leitgeb, Daniel Brunner, Lukas Ferlan
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Patent number: 11088009Abstract: According to various embodiments, a support table may include: a baseplate including a support structure, the support structure defining a support region over the baseplate to support at least one of a workpiece or a workpiece carrier therein; and one or more light-emitting components disposed between the baseplate and the support region. The one or more light-emitting components are configured to emit light into the support region.Type: GrantFiled: July 17, 2019Date of Patent: August 10, 2021Assignee: Infineon Technologies AGInventors: Bernhard Goller, Walter Leitgeb, Daniel Brunner, Lukas Ferlan, Markus Ottowitz
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Publication number: 20200286795Abstract: A method of monitoring a dicing tape tension is described. The method includes acquiring tension data indicative of the dicing tape tension by automated optical inspection of a dicing tape.Type: ApplicationFiled: February 25, 2020Publication date: September 10, 2020Inventors: Walter Leitgeb, Daniel Brunner, Lukas Ferlan
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Publication number: 20200105552Abstract: A method of detecting adhesive residue on a wafer after peeling an adhesive film from the wafer by using a peeling tape is described. According to a first aspect, the method includes illuminating the peeling tape with first UV light after the peeling and acquiring a fluorescence image from the peeling tape. According to a second aspect, the method includes illuminating the wafer with second UV light after the peeling and acquiring a fluorescence image from the wafer.Type: ApplicationFiled: September 30, 2019Publication date: April 2, 2020Inventors: Robert Muhr, Matthias Fehr, Walter Leitgeb
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Publication number: 20200027774Abstract: According to various embodiments, a support table may include: a baseplate including a support structure, the support structure defining a support region over the baseplate to support at least one of a workpiece or a workpiece carrier therein; and one or more light-emitting components disposed between the baseplate and the support region. The one or more light-emitting components are configured to emit light into the support region.Type: ApplicationFiled: July 17, 2019Publication date: January 23, 2020Inventors: Bernhard Goller, Walter Leitgeb, Daniel Brunner, Lukas Ferlan, Markus Ottowitz
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Publication number: 20180308721Abstract: According to various embodiments, a frame cassette includes a housing and a mounting structure within the housing. The mounting structure includes a plurality of tape-frame slots, each tape-frame slot configured to receive a tape-frame. The housing includes an opening configured to introduce a tape-frame into a tape-frame slot of the plurality of tape-frame slots, or to remove the tape frame from the tape-frame slot of the plurality of tape-frame slots. The housing also includes an electrostatic discharge protection. A corresponding automatic transportation system and method of automatic transportation of semiconductor wafers is also provided.Type: ApplicationFiled: June 15, 2018Publication date: October 25, 2018Inventors: Germar Schneider, Matthias Taubert, Michael Mitrach, Thomas Gadau, Markus Pfeifenberger, Walter Leitgeb, Frank Boenewitz
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Patent number: 10020215Abstract: According to various embodiments, a frame cassette may include: a housing; a mounting structure inserted in the housing, the mounting structure including a plurality of tape-frame slots, wherein each tape-frame slot is configured to receive a tape-frame, wherein the housing includes an opening to introduce a tape-frame into a tape-frame slot of the plurality of tape-frame slots or to remove a tape-frame from a tape-frame slot of the plurality of tape-frame slots, and a door mounted at the housing, wherein the door is configured to close the opening of the housing to seal the interior of the housing from the exterior of the housing.Type: GrantFiled: January 26, 2016Date of Patent: July 10, 2018Assignee: Infineon Technologies AGInventors: Germar Schneider, Matthias Taubert, Michael Mitrach, Thomas Gadau, Markus Pfeifenberger, Walter Leitgeb, Frank Boenewitz
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Publication number: 20160141189Abstract: According to various embodiments, a frame cassette may include: a housing; a mounting structure inserted in the housing, the mounting structure including a plurality of tape-frame slots, wherein each tape-frame slot is configured to receive a tape-frame, wherein the housing includes an opening to introduce a tape-frame into a tape-frame slot of the plurality of tape-frame slots or to remove a tape-frame from a tape-frame slot of the plurality of tape-frame slots, and a door mounted at the housing, wherein the door is configured to close the opening of the housing to seal the interior of the housing from the exterior of the housing.Type: ApplicationFiled: January 26, 2016Publication date: May 19, 2016Inventors: Germar Schneider, Matthias Taubert, Michael Mitrach, Thomas Gadau, Markus Pfeifenberger, Walter Leitgeb, Frank Boenewitz
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Publication number: 20150214084Abstract: According to various embodiments, a frame cassette may include: a housing; a mounting structure inserted in the housing, the mounting structure including a plurality of tape-frame slots, wherein each tape-frame slot is configured to receive a tape-frame, wherein the housing includes an opening to introduce a tape-frame into a tape-frame slot of the plurality of tape-frame slots or to remove a tape-frame from a tape-frame slot of the plurality of tape-frame slots, and a door mounted at the housing, wherein the door is configured to close the opening of the housing to seal the interior of the housing from the exterior of the housing.Type: ApplicationFiled: January 30, 2014Publication date: July 30, 2015Applicant: Infineon Technologies AGInventors: Germar Schneider, Matthias Taubert, Michael Mitrach, Thomas Gadau, Markus Pfeifenberger, Walter Leitgeb, Frank Boenewitz
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Patent number: 4330940Abstract: A measuring device for determining the oil level in a closed housing, especially of internal combustion engines and transmissions. The device is provided with a sleeve fixed to the housing, and a removable measuring rod or dipstick. A stopper to close the sleeve is secured to the dipstick, which also has an abutment to limit the insertion depth in the measuring position of the dipstick. That end of the sleeve inside the housing terminates below the minimum oil level, and the sleeve has holes or openings for equalizing the pressure to the interior of the housing located as far as possible above the maximum oil level. In the measuring position, during insertion of the dipstick up to the abutment, the stopper is located below the outer end of the sleeve by at least one and one-half times the oil column level corresponding to the overpressure in the housing.Type: GrantFiled: June 9, 1980Date of Patent: May 25, 1982Assignee: Klockner-Humboldt-Deutz AktiengesellschaftInventor: Walter Leitgeb, deceased