Patents by Inventor Walter M. Bryant

Walter M. Bryant has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 4806651
    Abstract: Processes for preparing 3,3-disubstituted indolines, particularly 3,3-dipyridine substituted indolines useful to treat cognitive or neurological dysfunction in a mammal, are provided.
    Type: Grant
    Filed: October 7, 1987
    Date of Patent: February 21, 1989
    Assignee: E. I. Du Pont de Nemours and Company
    Inventors: Walter M. Bryant, III, George F. Huhn
  • Patent number: 4667037
    Abstract: An improved process for the dealkylation of alkyl aryl ethers to aryl phenols is provided. In this process, an alkyl aryl ether, such as a methyl ether of an opioid, is contacted with an aqueous acid selected from HBr, HCl, or HI which contains at least one equivalent weight, based on the ether, of boric acid or an inorganic salt of a metal selected from Li, Na, K, Al, Mg, Ca, Mn and Ni. MgBr.sub.2 in aqueous HBr is preferred in dealkylating an N-substituted 14-hydroxydihydronorcodeine.
    Type: Grant
    Filed: June 6, 1985
    Date of Patent: May 19, 1987
    Assignee: E. I. Du Pont de Nemours and Company
    Inventor: Walter M. Bryant, III
  • Patent number: 3993411
    Abstract: A direct bond between metallic members and non-metallic members is achieved at elevated temperatures in a controlled reactive atmosphere without resorting to the use of electroless plating, vacuum deposition or intermediate metals. A metal member such as copper, for example, is placed in contact with a non-metallic substrate, such as alumina, the metal member and the substrate are heated to a temperature slightly below the melting of the metal, e.g., between approximately 1065.degree. and 1080.degree. C. for copper, with the heating being performed in a reactive atmosphere, such as an oxidizing atmosphere, for a sufficient time to create a copper-copper oxide eutectic melt which, upon cooling, bonds the copper to the substrate. Various metals, non-metals and reactive gases are described for direct bonding.
    Type: Grant
    Filed: February 12, 1975
    Date of Patent: November 23, 1976
    Assignee: General Electric Company
    Inventors: Guy L. Babcock, Walter M. Bryant, Constantine A. Neugebauer, James F. Burgess